MX2019010570A - Disco de mandril tipo collarin de contraste. - Google Patents

Disco de mandril tipo collarin de contraste.

Info

Publication number
MX2019010570A
MX2019010570A MX2019010570A MX2019010570A MX2019010570A MX 2019010570 A MX2019010570 A MX 2019010570A MX 2019010570 A MX2019010570 A MX 2019010570A MX 2019010570 A MX2019010570 A MX 2019010570A MX 2019010570 A MX2019010570 A MX 2019010570A
Authority
MX
Mexico
Prior art keywords
head
collet
pick
tubular element
disk
Prior art date
Application number
MX2019010570A
Other languages
English (en)
Inventor
W Carlson Kristopher
S Bender Christopher
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of MX2019010570A publication Critical patent/MX2019010570A/es

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G05B19/27Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path using an absolute digital measuring device
    • G05B19/29Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path using an absolute digital measuring device for point-to-point control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Se proporciona un módulo de máquina de recolección y colocación. El módulo de máquina de recolección y colocación incluye una boquilla y un disco de mandril tipo collarín. La boquilla incluye un cuerpo, un cabezal y un elemento tubular que se extiende entre el cuerpo y el cabezal, en un modo tal en que el cabezal es comunicable con el cuerpo mediante el elemento tubular para posibilitar una recolección de un componente por el cabezal. El disco de mandril tipo collarín se fija a una superficie del cuerpo que se orienta al cabezal alrededor del elemento tubular, y se configura para reflejar la luz incidente en el mismo hacia un área de la base que rodea el componente.
MX2019010570A 2017-03-07 2018-03-05 Disco de mandril tipo collarin de contraste. MX2019010570A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/452,264 US10620608B2 (en) 2017-03-07 2017-03-07 Collet contrast disk
PCT/US2018/020838 WO2018164982A1 (en) 2017-03-07 2018-03-05 Collet contrast disk

Publications (1)

Publication Number Publication Date
MX2019010570A true MX2019010570A (es) 2019-12-02

Family

ID=61683940

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019010570A MX2019010570A (es) 2017-03-07 2018-03-05 Disco de mandril tipo collarin de contraste.

Country Status (7)

Country Link
US (2) US10620608B2 (es)
EP (1) EP3593609A1 (es)
JP (1) JP6876139B2 (es)
CN (1) CN110383968B (es)
MX (1) MX2019010570A (es)
TW (1) TW201834141A (es)
WO (1) WO2018164982A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10620608B2 (en) 2017-03-07 2020-04-14 Raytheon Company Collet contrast disk
CN110505801B (zh) * 2019-08-20 2021-08-03 道晟智能装备(苏州)有限公司 多尺寸芯片用贴装设备

Family Cites Families (22)

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US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
JPS6354000A (ja) * 1986-08-22 1988-03-08 三洋電機株式会社 電子部品の位置検出装置
JPH06237094A (ja) * 1993-02-08 1994-08-23 Tdk Corp 吸着部品の照明方法及び装置
JPH08222893A (ja) 1995-02-17 1996-08-30 Japan Tobacco Inc ワーク実装機の吸着ノズル
US5946409A (en) * 1995-05-31 1999-08-31 Nec Corporation Pick-up apparatus and method for semiconductor devices
JP3893184B2 (ja) * 1997-03-12 2007-03-14 松下電器産業株式会社 電子部品実装装置
US6160906A (en) 1998-06-01 2000-12-12 Motorola, Inc. Method and apparatus for visually inspecting an object
JP3678007B2 (ja) * 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法
DE19982405T1 (de) 1998-11-03 2001-04-26 Cyberoptics Corp Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten
US6203082B1 (en) * 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
US6535291B1 (en) 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
US6909515B2 (en) 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
JP4122187B2 (ja) * 2002-08-08 2008-07-23 松下電器産業株式会社 照明装置、及びこれを備えた認識装置並びに部品実装装置
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.
WO2007033349A1 (en) 2005-09-14 2007-03-22 Cyberoptics Corporation Pick and place machine with improved component pick image processing
US8068664B2 (en) 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
DE102008018586A1 (de) 2008-04-12 2009-11-05 Mühlbauer Ag Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen
US20100295935A1 (en) 2009-05-06 2010-11-25 Case Steven K On-head component alignment using multiple area array image detectors
JP5561056B2 (ja) 2010-09-15 2014-07-30 ソニー株式会社 光照射装置、部品撮像装置及び部品実装装置
JP5323288B2 (ja) 2011-08-29 2013-10-23 パナソニック株式会社 部品実装装置、ノズル及び部品実装位置補正方法
US11026361B2 (en) 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
US10620608B2 (en) * 2017-03-07 2020-04-14 Raytheon Company Collet contrast disk

Also Published As

Publication number Publication date
US20180263147A1 (en) 2018-09-13
EP3593609A1 (en) 2020-01-15
CN110383968A (zh) 2019-10-25
CN110383968B (zh) 2021-07-13
US11429079B2 (en) 2022-08-30
WO2018164982A1 (en) 2018-09-13
US10620608B2 (en) 2020-04-14
JP6876139B2 (ja) 2021-05-26
JP2020509594A (ja) 2020-03-26
TW201834141A (zh) 2018-09-16
US20200209825A1 (en) 2020-07-02

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