MX2019007949A - Dispositivos fluídicos y métodos para fabricar los mismos. - Google Patents

Dispositivos fluídicos y métodos para fabricar los mismos.

Info

Publication number
MX2019007949A
MX2019007949A MX2019007949A MX2019007949A MX2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A
Authority
MX
Mexico
Prior art keywords
bonding interface
radiation
outer area
substrate layer
cavity
Prior art date
Application number
MX2019007949A
Other languages
English (en)
Inventor
Gerhardt Earney John
Murali K Venkatesan Bala
Fullerton Justin
Smith Kaleb
Original Assignee
Illumina Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumina Inc filed Critical Illumina Inc
Publication of MX2019007949A publication Critical patent/MX2019007949A/es

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    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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    • B81B2201/00—Specific applications of microelectromechanical systems
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

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Abstract

Un método de ejemplo incluye proporcionar una pila de trabajo que tiene una primera capa de sustrato, una segunda capa de sustrato y un material absorbente de radiación colocado entre la primera y segunda capas de sustrato. La pila de trabajo incluye una cavidad dentro de la misma que tiene un líquido designado. Una interfase de unión se define entre el material absorbente de radiación y al menos una de la primera capa de sustrato o la segunda capa de sustrato. La interfase de unión tiene una película del líquido designado. El método también incluye dirigir radiación sobre la interfase de unión para formar un sello perimetral. El sello perimetral separa la cavidad de un área exterior de la interfase de unión. El método también incluye dirigir la radiación sobre el área exterior de la interfase de unión para asegurar la primera y segunda capas de sustrato conjuntamente. El sello perimetral impide ingreso de burbujas desde el área exterior en la cavidad conforme la radiación se dirige sobre el área exterior.
MX2019007949A 2017-01-31 2017-12-12 Dispositivos fluídicos y métodos para fabricar los mismos. MX2019007949A (es)

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