MX2019007949A - Dispositivos fluídicos y métodos para fabricar los mismos. - Google Patents
Dispositivos fluídicos y métodos para fabricar los mismos.Info
- Publication number
- MX2019007949A MX2019007949A MX2019007949A MX2019007949A MX2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A MX 2019007949 A MX2019007949 A MX 2019007949A
- Authority
- MX
- Mexico
- Prior art keywords
- bonding interface
- radiation
- outer area
- substrate layer
- cavity
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 230000005855 radiation Effects 0.000 abstract 3
- 239000011358 absorbing material Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
Classifications
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- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/054—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
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Abstract
Un método de ejemplo incluye proporcionar una pila de trabajo que tiene una primera capa de sustrato, una segunda capa de sustrato y un material absorbente de radiación colocado entre la primera y segunda capas de sustrato. La pila de trabajo incluye una cavidad dentro de la misma que tiene un líquido designado. Una interfase de unión se define entre el material absorbente de radiación y al menos una de la primera capa de sustrato o la segunda capa de sustrato. La interfase de unión tiene una película del líquido designado. El método también incluye dirigir radiación sobre la interfase de unión para formar un sello perimetral. El sello perimetral separa la cavidad de un área exterior de la interfase de unión. El método también incluye dirigir la radiación sobre el área exterior de la interfase de unión para asegurar la primera y segunda capas de sustrato conjuntamente. El sello perimetral impide ingreso de burbujas desde el área exterior en la cavidad conforme la radiación se dirige sobre el área exterior.
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US201762452923P | 2017-01-31 | 2017-01-31 | |
PCT/US2017/065855 WO2018144138A1 (en) | 2017-01-31 | 2017-12-12 | Fluidic devices and methods of manufacturing the same |
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MX2019007949A true MX2019007949A (es) | 2019-11-12 |
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MX2019007949A MX2019007949A (es) | 2017-01-31 | 2017-12-12 | Dispositivos fluídicos y métodos para fabricar los mismos. |
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WO2021035044A1 (en) * | 2019-08-20 | 2021-02-25 | Pattern Bioscience, Inc. | Microfluidic chips including a gutter to facilitate loading thereof and related methods |
TW202138866A (zh) | 2019-12-06 | 2021-10-16 | 美商伊路米納有限公司 | 從影像中估計值的裝置和方法 |
TW202138867A (zh) | 2019-12-06 | 2021-10-16 | 美商伊路米納有限公司 | 提供參數估計的裝置和方法 |
CN113371676A (zh) * | 2020-03-10 | 2021-09-10 | 上海新微技术研发中心有限公司 | 微细结构及其加工方法 |
WO2022155087A1 (en) * | 2021-01-12 | 2022-07-21 | Corning Incorporated | Liquid lenses with concentric laser bond paths and methods of making the same |
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AU709581B2 (en) * | 1995-06-06 | 1999-09-02 | Orchid Biosciences, Inc. | Electrokinetic pumping |
JPH11326891A (ja) * | 1998-05-08 | 1999-11-26 | Matsushita Electric Ind Co Ltd | 液晶表示パネルおよびそれを用いた液晶表示装置 |
KR20000071852A (ko) * | 1999-04-30 | 2000-11-25 | 모리시타 요이찌 | 액정표시소자 및 그 제조방법 |
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JP2003216059A (ja) | 2002-01-24 | 2003-07-30 | Sharp Corp | 表示素子およびその製造方法 |
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JP3798419B2 (ja) | 2005-08-29 | 2006-07-19 | シャープ株式会社 | 液晶表示パネルの製造方法 |
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EP2851121B1 (en) | 2013-09-20 | 2022-11-02 | thinXXS Microtechnology GmbH | Devices for and methods of forming microchannels or microfluid reservoirs |
KR102019973B1 (ko) | 2013-11-20 | 2019-11-04 | (주)바이오니아 | 마이크로 챔버 플레이트 |
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EP3468719A1 (en) | 2019-04-17 |
TW201830163A (zh) | 2018-08-16 |
WO2018144138A1 (en) | 2018-08-09 |
SA518400532B1 (ar) | 2022-07-24 |
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CN109311013A (zh) | 2019-02-05 |
MY193117A (en) | 2022-09-26 |
AU2017396784B2 (en) | 2022-06-02 |
BR112018074099A2 (pt) | 2019-08-13 |
CA3022831C (en) | 2021-02-02 |
CA3101710C (en) | 2023-05-09 |
US20180214869A1 (en) | 2018-08-02 |
IL262688B (en) | 2022-06-01 |
KR20190104863A (ko) | 2019-09-11 |
KR102578932B1 (ko) | 2023-09-14 |
JP7048516B2 (ja) | 2022-04-05 |
IL262688A (en) | 2018-12-31 |
TWI753065B (zh) | 2022-01-21 |
NZ747846A (en) | 2021-01-29 |
CA3022831A1 (en) | 2018-08-09 |
AU2017396784A1 (en) | 2018-11-22 |
BR112018074099B1 (pt) | 2023-05-16 |
EP3468719A4 (en) | 2019-11-13 |
SG11201811323XA (en) | 2019-01-30 |
US10688488B2 (en) | 2020-06-23 |
CA3101710A1 (en) | 2018-08-09 |
CN109311013B (zh) | 2021-06-04 |
RU2710567C1 (ru) | 2019-12-27 |
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