MX2010000678A - Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa. - Google Patents
Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa.Info
- Publication number
- MX2010000678A MX2010000678A MX2010000678A MX2010000678A MX2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A
- Authority
- MX
- Mexico
- Prior art keywords
- layer
- cycle time
- thick film
- manufacturing processes
- film resistive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
- Laminated Bodies (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Se proporciona un proceso para formar un dispositivo resistivo tal como una resistencia de carga o un calentador que incluye formar una capa dieléctrica sobre un sustrato, un objetivo, o una capa funcional adyacente, en donde la capa dieléctrica en una forma define una capa sencilla de cinta dieléctrica. La cinta dieléctrica se lamina en el sustrato, el objetivo, o la capa funcional adyacente a través de un ciclo de presión predeterminado sencillo, temperatura y tiempo, y después se forma una capa resistiva en la capa dieléctrica, y se forma una capa protectora sobre la capa resistiva.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/779,745 US8557082B2 (en) | 2007-07-18 | 2007-07-18 | Reduced cycle time manufacturing processes for thick film resistive devices |
PCT/US2008/070014 WO2009012239A2 (en) | 2007-07-18 | 2008-07-14 | Reduced cycle time manufacturing processes for thick film resistive devices |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2010000678A true MX2010000678A (es) | 2010-03-17 |
Family
ID=40137961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2010000678A MX2010000678A (es) | 2007-07-18 | 2008-07-14 | Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa. |
Country Status (8)
Country | Link |
---|---|
US (2) | US8557082B2 (es) |
EP (1) | EP2176869B1 (es) |
JP (1) | JP5588342B2 (es) |
CN (1) | CN101796596B (es) |
CA (1) | CA2693183C (es) |
MX (1) | MX2010000678A (es) |
TW (1) | TWI425529B (es) |
WO (1) | WO2009012239A2 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8089337B2 (en) * | 2007-07-18 | 2012-01-03 | Watlow Electric Manufacturing Company | Thick film layered resistive device employing a dielectric tape |
US8557082B2 (en) | 2007-07-18 | 2013-10-15 | Watlow Electric Manufacturing Company | Reduced cycle time manufacturing processes for thick film resistive devices |
US8061402B2 (en) * | 2008-04-07 | 2011-11-22 | Watlow Electric Manufacturing Company | Method and apparatus for positioning layers within a layered heater system |
KR102173541B1 (ko) * | 2013-06-14 | 2020-11-03 | 샌드빅 가부시키가이샤 | 이규화몰리브덴계 세라믹 발열체 유지 구조체 |
FR3012008B1 (fr) | 2013-10-11 | 2015-10-23 | Illinois Tool Works | Element chauffant a couche epaisse et equipement de cuisine comportant un tel element chauffant |
JP6328670B2 (ja) * | 2014-01-29 | 2018-05-23 | 中島ゴム工業株式会社 | 円筒形接着対象物の内外面にゴム層を接着するための前処理方法 |
CN104936318A (zh) * | 2015-05-14 | 2015-09-23 | 孙庄 | 一种厚膜加热器及其制造工艺 |
EP3626093B1 (de) * | 2018-09-24 | 2024-07-03 | Yageo Nexensos GmbH | Heizelement für ein system zur bereitstellung eines inhalierbaren aerosols |
KR102392126B1 (ko) * | 2019-08-02 | 2022-04-28 | 주식회사 케이티앤지 | 가열 조립체, 이를 포함하는 에어로졸 발생 장치 및 에어로졸 발생 시스템 |
KR20220056854A (ko) * | 2019-09-06 | 2022-05-06 | 제이티 인터내셔널 소시에떼 아노님 | 히터 조립체 |
EP3962234A1 (de) * | 2020-08-27 | 2022-03-02 | Heraeus Nexensos GmbH | Flexibles heizelement, verfahren zur herstellung eines derartigen heizelements und verwendung eines flexiblen heizelements |
CN112038027B (zh) * | 2020-09-02 | 2022-04-05 | 中国电子科技集团公司第四十九研究所 | 一种高精度转角传感器及其电阻敏感元件的制备方法 |
DE102021211121A1 (de) * | 2021-10-01 | 2023-04-06 | E.G.O. Elektro-Gerätebau GmbH | Heizeinrichtung und Verfahren zur Herstellung einer Heizeinrichtung |
EP4167685A1 (en) * | 2021-10-12 | 2023-04-19 | MAHLE International GmbH | Electric heating device, in particular for a heat exchanger |
GB2618803A (en) * | 2022-05-17 | 2023-11-22 | Dyson Technology Ltd | Thick film heating elements |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1132794A (en) | 1967-04-04 | 1968-11-06 | Matsushita Electric Ind Co Ltd | Improvements in or relating to the manufacture of film-type resistors |
US3648218A (en) * | 1971-04-12 | 1972-03-07 | David Kellerman | Wound resistor arrangement |
US3845443A (en) * | 1972-06-14 | 1974-10-29 | Bailey Meter Co | Thin film resistance thermometer |
US3806098A (en) * | 1972-07-11 | 1974-04-23 | Xodar Corp | Vertical aerating system |
US3880609A (en) * | 1972-12-14 | 1975-04-29 | Richard E Caddock | Method and apparatus for manufacturing cylindrical resistors by thick-film silk-screening |
US3964958A (en) * | 1973-01-24 | 1976-06-22 | Johnston Orin B | Heat bonding device |
DE2450551C2 (de) * | 1974-10-24 | 1977-01-13 | Heraeus Gmbh W C | Elektrischer messwiderstand fuer ein widerstandsthermometer und verfahren zu seiner herstellung |
US4072921A (en) * | 1976-04-27 | 1978-02-07 | Amf Incorporated | Low inductance precision resistor deposited on an adhesive backing and wound on a bobbin |
US4334850A (en) * | 1978-07-31 | 1982-06-15 | Armen Garabedian | Apparatus for making a stress-free plastic article |
JPS56106159A (en) | 1980-01-28 | 1981-08-24 | Hitachi Ltd | Production of sensor for detecting flow speed and flow rate |
JPS57178877A (en) | 1981-04-30 | 1982-11-04 | Oki Electric Ind Co Ltd | Thermal head |
JPS6213285A (ja) | 1985-06-28 | 1987-01-22 | Hitachi Electronics Eng Co Ltd | 厚膜モジユ−ル基板用ロ−ダ・アンロ−ダ |
US4806295A (en) * | 1986-10-31 | 1989-02-21 | Gte Laboratories Incorporated | Ceramic monolithic structure having an internal cavity contained therein and a method of preparing the same |
US4806188A (en) * | 1988-03-04 | 1989-02-21 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
US4866411A (en) * | 1988-03-25 | 1989-09-12 | Caddock Richard E | Film-type cylindrical resistor, and method of making it |
CA2018113A1 (en) | 1989-08-07 | 1991-02-07 | John Trublowski | Layered thick film resistors and method of producing the same |
US5139604A (en) * | 1990-05-09 | 1992-08-18 | Mitchell Charles P | Controlled bladder wrap tool system |
JPH0430443A (ja) * | 1990-05-25 | 1992-02-03 | Toto Ltd | ボンディング用ステージの製造方法 |
EP0720416B1 (de) | 1994-12-29 | 2004-03-24 | Robert Bosch Gmbh | Keramische Heizeinrichtung, Verfahren zu deren Herstellung und deren Verwendung |
JP3373973B2 (ja) * | 1995-05-12 | 2003-02-04 | ブラザー工業株式会社 | 定着用加熱ローラ |
US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
US5657532A (en) * | 1996-01-16 | 1997-08-19 | Ferro Corporation | Method of making insulated electrical heating element using LTCC tape |
DE69700108T2 (de) | 1996-07-15 | 1999-07-22 | Koninkl Philips Electronics Nv | Heizelement |
GB2316848B (en) | 1996-08-27 | 2000-10-04 | Strix Ltd | Electric heaters |
JP3594161B2 (ja) * | 1996-09-20 | 2004-11-24 | 株式会社クボタ | セラミックヒータおよびその製造方法 |
JPH11238571A (ja) * | 1998-02-23 | 1999-08-31 | Sumitomo Metal Electronics Devices Inc | セラミックヒータの製造方法および製造装置 |
US6458309B1 (en) * | 1998-06-01 | 2002-10-01 | Rohr, Inc. | Method for fabricating an advanced composite aerostructure article having an integral co-cured fly away hollow mandrel |
GB2338632A (en) | 1998-06-16 | 1999-12-22 | Pifco Ltd | Metal sheathed planar element: Edge connector with shutter |
KR100371828B1 (ko) | 1998-08-04 | 2003-02-12 | 다이켄카가쿠 코교 가부시키가이샤 | 퀴크 히트 로울러 |
JP3694408B2 (ja) * | 1998-10-02 | 2005-09-14 | 日本特殊陶業株式会社 | セラミックスヒータの製造方法 |
JP3746622B2 (ja) * | 1998-10-16 | 2006-02-15 | 日本特殊陶業株式会社 | セラミックスヒータの製造方法 |
US5973296A (en) * | 1998-10-20 | 1999-10-26 | Watlow Electric Manufacturing Company | Thick film heater for injection mold runner nozzle |
JP3601993B2 (ja) | 1999-02-26 | 2004-12-15 | 三菱電機株式会社 | 熱型センサおよびその製造方法 |
US6771019B1 (en) * | 1999-05-14 | 2004-08-03 | Ifire Technology, Inc. | Electroluminescent laminate with patterned phosphor structure and thick film dielectric with improved dielectric properties |
JP3670516B2 (ja) | 1999-05-26 | 2005-07-13 | シャープ株式会社 | ロール状ヒータ及びロール状ヒータを用いた定着装置 |
US6222166B1 (en) | 1999-08-09 | 2001-04-24 | Watlow Electric Manufacturing Co. | Aluminum substrate thick film heater |
TW426217U (en) * | 1999-10-12 | 2001-03-11 | Gen Semiconductor Of Taiwan Lt | Resistive sheet adhering device |
WO2001027602A2 (en) * | 1999-10-15 | 2001-04-19 | Delphi Technologies, Inc. | Gas sensor design and method for using the same |
US7241131B1 (en) | 2000-06-19 | 2007-07-10 | Husky Injection Molding Systems Ltd. | Thick film heater apparatus |
JP3713220B2 (ja) * | 2001-06-15 | 2005-11-09 | 日本特殊陶業株式会社 | セラミックヒータ |
US7304276B2 (en) * | 2001-06-21 | 2007-12-04 | Watlow Electric Manufacturing Company | Thick film heater integrated with low temperature components and method of making the same |
DE60237045D1 (de) * | 2002-06-03 | 2010-08-26 | Fuji Xerox Co Ltd | Heizwalze und heizwalzenherstellungsverfahren |
JP4051245B2 (ja) * | 2002-08-29 | 2008-02-20 | 京セラ株式会社 | セラミックヒータの製造方法 |
US6652906B1 (en) * | 2002-11-19 | 2003-11-25 | Hitachi Global Storage Technologies Netherlands B.V. | Fabrication of a magnetoresistance sensor structure having a spacer layer produced by multiple deposition and oxidation steps |
US7196295B2 (en) * | 2003-11-21 | 2007-03-27 | Watlow Electric Manufacturing Company | Two-wire layered heater system |
US8680443B2 (en) * | 2004-01-06 | 2014-03-25 | Watlow Electric Manufacturing Company | Combined material layering technologies for electric heaters |
US8536496B2 (en) * | 2004-09-15 | 2013-09-17 | Watlow Electric Manufacturing Company | Adaptable layered heater system |
US8089337B2 (en) * | 2007-07-18 | 2012-01-03 | Watlow Electric Manufacturing Company | Thick film layered resistive device employing a dielectric tape |
US8557082B2 (en) | 2007-07-18 | 2013-10-15 | Watlow Electric Manufacturing Company | Reduced cycle time manufacturing processes for thick film resistive devices |
-
2007
- 2007-07-18 US US11/779,745 patent/US8557082B2/en active Active
-
2008
- 2008-07-14 EP EP08781820.9A patent/EP2176869B1/en not_active Not-in-force
- 2008-07-14 MX MX2010000678A patent/MX2010000678A/es active IP Right Grant
- 2008-07-14 WO PCT/US2008/070014 patent/WO2009012239A2/en active Application Filing
- 2008-07-14 JP JP2010517110A patent/JP5588342B2/ja not_active Expired - Fee Related
- 2008-07-14 CA CA2693183A patent/CA2693183C/en active Active
- 2008-07-14 CN CN2008801061382A patent/CN101796596B/zh not_active Expired - Fee Related
- 2008-07-17 TW TW097127131A patent/TWI425529B/zh not_active IP Right Cessation
-
2013
- 2013-09-10 US US14/022,949 patent/US9486988B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2176869A2 (en) | 2010-04-21 |
CN101796596B (zh) | 2012-07-11 |
WO2009012239A2 (en) | 2009-01-22 |
TW200912966A (en) | 2009-03-16 |
WO2009012239A3 (en) | 2009-03-05 |
CA2693183C (en) | 2015-01-27 |
TWI425529B (zh) | 2014-02-01 |
CN101796596A (zh) | 2010-08-04 |
JP5588342B2 (ja) | 2014-09-10 |
JP2010533980A (ja) | 2010-10-28 |
US20090020905A1 (en) | 2009-01-22 |
EP2176869B1 (en) | 2016-11-16 |
CA2693183A1 (en) | 2009-01-22 |
US8557082B2 (en) | 2013-10-15 |
US9486988B2 (en) | 2016-11-08 |
US20140014265A1 (en) | 2014-01-16 |
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