MX2008016433A - Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad. - Google Patents

Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad.

Info

Publication number
MX2008016433A
MX2008016433A MX2008016433A MX2008016433A MX2008016433A MX 2008016433 A MX2008016433 A MX 2008016433A MX 2008016433 A MX2008016433 A MX 2008016433A MX 2008016433 A MX2008016433 A MX 2008016433A MX 2008016433 A MX2008016433 A MX 2008016433A
Authority
MX
Mexico
Prior art keywords
electromagnetic wave
wave shielding
gasket
adhesiveness
elasticity
Prior art date
Application number
MX2008016433A
Other languages
English (en)
Inventor
Won-Sik Kim
Jeongwan Choi
Hun Jeong
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MX2008016433A publication Critical patent/MX2008016433A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/674—Nonwoven fabric with a preformed polymeric film or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Gasket Seals (AREA)

Abstract

Se describe un empaque que tiene propiedades eléctricas y adhesivas, así como funciones de blindaje contra las ondas electromagnéticas y un método para la fabricación del mismo. El empaque incluye una hoja polimérica adhesiva que tiene conductividad eléctrica y que está colocado en las direcciones longitudinal y transversal de un sustrato electroconductor, de modo que el empaque tiene propiedades de absorción de impacto y de vibración, además de una propiedad adhesiva.
MX2008016433A 2006-07-04 2007-06-29 Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad. MX2008016433A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060062468A KR101269741B1 (ko) 2006-07-04 2006-07-04 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
PCT/US2007/072434 WO2008005816A2 (en) 2006-07-04 2007-06-29 Electromagnetic wave shielding gasket having elasticity and adhesiveness

Publications (1)

Publication Number Publication Date
MX2008016433A true MX2008016433A (es) 2009-01-22

Family

ID=38895349

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2008016433A MX2008016433A (es) 2006-07-04 2007-06-29 Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad.

Country Status (11)

Country Link
US (1) US20090291608A1 (es)
EP (1) EP2042008A4 (es)
JP (1) JP2009543356A (es)
KR (1) KR101269741B1 (es)
CN (1) CN101485239B (es)
BR (1) BRPI0713970A2 (es)
CA (1) CA2656609A1 (es)
MX (1) MX2008016433A (es)
RU (1) RU2381638C1 (es)
TW (1) TW200812806A (es)
WO (1) WO2008005816A2 (es)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
EP2104188B1 (de) * 2008-03-19 2015-08-12 Rohde & Schwarz GmbH & Co. KG Hochfrequenz-Abdichtung von Hochfrequenz-Steckverbindern
WO2010119593A1 (ja) * 2009-04-16 2010-10-21 テイカ株式会社 広帯域電磁波吸収体及びその製造方法
JP2010080911A (ja) * 2008-04-30 2010-04-08 Tayca Corp 広帯域電磁波吸収体及びその製造方法
KR101599064B1 (ko) * 2008-09-18 2016-03-02 쓰리엠 이노베이티브 프로퍼티즈 캄파니 가스켓 및 상기 가스켓을 이용하는 표시장치
JP5256079B2 (ja) * 2009-03-03 2013-08-07 アキレス株式会社 電磁波シールド用ガスケット、及び電磁波シールド用ガスケットの製造方法。
KR100977481B1 (ko) * 2009-03-17 2010-08-23 주식회사 나노인터페이스 테크놀로지 도전성 가스켓 및 이의 제조방법
EP2237195B1 (en) * 2009-04-03 2012-07-25 3M Innovative Properties Company A material for packaging electronic components
WO2011047376A2 (en) 2009-10-16 2011-04-21 Emprimus, Inc. Modular electromagnetically shielded enclosure
US8547710B2 (en) 2009-10-16 2013-10-01 Emprimus, Llc Electromagnetically shielded power module
KR101074805B1 (ko) 2009-12-04 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
JP4995316B2 (ja) * 2009-12-28 2012-08-08 日東電工株式会社 ガスケット
US10352447B2 (en) 2009-12-29 2019-07-16 Nitto Denko Corporation Gasket
US8760859B2 (en) 2010-05-03 2014-06-24 Emprimus, Llc Electromagnetically-shielded portable storage device
EP2570013B1 (en) * 2010-05-12 2019-07-10 Parker-Hannifin Corporation Low force deflection and corrosion resistant emi gasket
US8782971B2 (en) * 2010-07-22 2014-07-22 Advanced Glazing Technologies Ltd. (Agtl) System for pressure equalizing and drying sealed translucent glass glazing units
KR101160589B1 (ko) * 2010-09-07 2012-06-28 두성산업 주식회사 내열성, 접착성, 내굴곡성, 및 도전성이 향상된 연성인쇄회로기판의 전자파 차폐용 접착시트 및 이를 포함하는 연성인쇄회로기판
US8599576B2 (en) 2010-10-29 2013-12-03 Emprimus, Llc Electromagnetically-protected electronic equipment
US8643772B2 (en) 2010-11-05 2014-02-04 Emprimus, Llc Electromagnetically shielded video camera and shielded enclosure for image capture devices
US8754980B2 (en) 2010-11-05 2014-06-17 Emprimus, Llc Electromagnetically shielded camera and shielded enclosure for image capture devices
WO2012088134A2 (en) 2010-12-20 2012-06-28 Emprimus, Inc. Low power localized distributed radio frequency transmitter
US9420219B2 (en) 2010-12-20 2016-08-16 Emprimus, Llc Integrated security video and electromagnetic pulse detector
US8692137B2 (en) 2011-06-29 2014-04-08 Tangitek, Llc Noise dampening energy efficient tape and gasket material
US9055667B2 (en) 2011-06-29 2015-06-09 Tangitek, Llc Noise dampening energy efficient tape and gasket material
US8854275B2 (en) 2011-03-03 2014-10-07 Tangitek, Llc Antenna apparatus and method for reducing background noise and increasing reception sensitivity
US8933393B2 (en) 2011-04-06 2015-01-13 Emprimus, Llc Electromagnetically-shielded optical system having a waveguide beyond cutoff extending through a shielding surface of an electromagnetically shielding enclosure
EP2541105B1 (en) * 2011-06-27 2020-02-19 Nitto Denko Corporation Gasket
US8658897B2 (en) 2011-07-11 2014-02-25 Tangitek, Llc Energy efficient noise dampening cables
DE102012202225B4 (de) * 2012-02-14 2015-10-22 Te Connectivity Germany Gmbh Steckergehäuse mit Dichtung
TW201405590A (zh) * 2012-07-25 2014-02-01 Benq Materials Corp 異方性導電膜
US9922746B2 (en) 2013-03-01 2018-03-20 The Regents Of The University Of Michigan Stretchable composite conductors for flexible electronics, stretchable plasmonic devices, optical filters, and implantable devices and methods for manufacture thereof
MX348516B (es) 2013-03-14 2017-06-16 Emprimus Llc Gabinete electronico protegido electromagneticamente.
US9408334B2 (en) 2013-04-30 2016-08-02 Apple Inc. Electronic device with component shielding structures and input-output connectors
US9612632B2 (en) 2013-04-30 2017-04-04 Apple Inc. Wireless electronic device with component cooling structures
DE102015007968A1 (de) * 2014-08-05 2016-02-11 Mann + Hummel Gmbh Filterelement und Verfahren zum Herstellen desselben
KR102268328B1 (ko) 2014-10-21 2021-06-24 삼성디스플레이 주식회사 광투과 점착 필름 및 이를 포함하는 표시 장치
KR101649613B1 (ko) * 2015-02-25 2016-08-19 자동차부품연구원 탄소 나노 하이브리드 방열 소재 조성물 및 이를 이용한 배터리 모듈 하우징
CN104853577B (zh) * 2015-05-13 2018-06-15 *** 超薄电磁屏蔽膜生产工艺
CN106317847B (zh) * 2015-06-30 2020-03-31 3M创新有限公司 导电泡棉、导电泡棉体及其制备方法和用途
US20170021380A1 (en) 2015-07-21 2017-01-26 Tangitek, Llc Electromagnetic energy absorbing three dimensional flocked carbon fiber composite materials
CN105439498B (zh) * 2015-12-01 2017-08-25 长安大学 一种具有导电性能的复合改性沥青混凝土及其制备方法
KR102406260B1 (ko) * 2017-07-24 2022-06-10 주식회사 아모그린텍 전자기기용 전자파차폐재, 이를 포함하는 전자파차폐형 회로모듈 및 이를 구비하는 전자기기
WO2019070296A1 (en) * 2017-10-06 2019-04-11 Hewlett-Packard Development Company, L.P. RADIO FREQUENCY ABSORPTION IN ELECTRONIC DEVICES
US11591497B2 (en) 2017-12-14 2023-02-28 Avery Dennison Corporation Pressure sensitive adhesive with broad damping temperature range
KR102167063B1 (ko) * 2018-07-20 2020-10-16 주식회사 이에스디웍 전자파 차폐용 가스켓 제조용 조성물 및 전자파 차폐용 가스켓
JP7263924B2 (ja) * 2019-05-31 2023-04-25 Dic株式会社 導電性緩衝材
KR20210101992A (ko) * 2020-02-11 2021-08-19 삼성전자주식회사 전자 부품의 열을 방출할 수 있는 전자파 차폐 시트 및 그 것을 포함하는 전자 장치
WO2023073809A1 (ja) * 2021-10-26 2023-05-04 日立Astemo株式会社 電子制御装置
CN114916217B (zh) * 2022-05-30 2023-08-29 中国电子科技集团公司第二十九研究所 一种高屏蔽效能的带自粘胶型导电密封衬垫

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4078160A (en) * 1977-07-05 1978-03-07 Motorola, Inc. Piezoelectric bimorph or monomorph bender structure
JPS5826381B2 (ja) * 1979-04-28 1983-06-02 信越ポリマ−株式会社 電磁気シ−ルドガスケットおよびその製造方法
US4216177A (en) * 1979-05-16 1980-08-05 Rogers Corporation Polyurethane foam product and process of manufacture thereof from thermosetting frothed mixture
US4448837A (en) * 1982-07-19 1984-05-15 Oki Densen Kabushiki Kaisha Pressure-sensitive conductive elastic sheet
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS63120399U (es) * 1987-01-29 1988-08-04
US5637469A (en) * 1992-05-01 1997-06-10 Trustees Of The University Of Pennsylvania Methods and apparatus for the detection of an analyte utilizing mesoscale flow systems
JP2948069B2 (ja) * 1993-09-20 1999-09-13 株式会社日立製作所 化学分析装置
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5604267A (en) * 1995-08-30 1997-02-18 Arco Chemical Technology, L.P. Process for producing froth polyurethane foam
CA2312102C (en) * 1997-12-24 2007-09-04 Cepheid Integrated fluid manipulation cartridge
AU765387B2 (en) * 1998-02-09 2003-09-18 Toyo Kohan Co. Ltd. Substrates for immobilizing and amplifying DNA, DNA-immobilized chips having DNA immobilized on the substrates, and method for amplifying DNA
AU747296B2 (en) * 1998-02-10 2002-05-16 Toyo Kohan Co. Ltd. Apparatus for immobilized DNA library preparation, apparatus for gene amplification, method for temperature control and method for comparing genes systematically
US6004821A (en) * 1998-03-07 1999-12-21 Levine; Robert A. Method and apparatus for performing chemical, qualitative, quantitative, and semi-quantitative analyses of a urine sample
US7029881B1 (en) * 1999-05-10 2006-04-18 Nihon Parkerizing Hiroshima Co., Ltd. Methods for constructing DNA library and support carrying DNA library immobilized thereon
US8080380B2 (en) * 1999-05-21 2011-12-20 Illumina, Inc. Use of microfluidic systems in the detection of target analytes using microsphere arrays
US6372106B1 (en) * 1999-07-26 2002-04-16 Applera Corporation Capillary electrophoresis method and apparatus for reducing peak broadening associated with the establishment of an electric field
JP2001156489A (ja) 1999-09-17 2001-06-08 Tomoegawa Paper Co Ltd 電磁波シールド材およびその製造方法
US6875619B2 (en) * 1999-11-12 2005-04-05 Motorola, Inc. Microfluidic devices comprising biochannels
US6483023B1 (en) * 2000-01-04 2002-11-19 Fujitsu Network Communications, Inc. Fabric wrapped over spring EMI gasket
US7277166B2 (en) * 2000-08-02 2007-10-02 Honeywell International Inc. Cytometer analysis cartridge optical configuration
US20040043479A1 (en) * 2000-12-11 2004-03-04 Briscoe Cynthia G. Multilayerd microfluidic devices for analyte reactions
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
DE10111457B4 (de) * 2001-03-09 2006-12-14 Siemens Ag Diagnoseeinrichtung
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
DE10142789C1 (de) * 2001-08-31 2003-05-28 Advalytix Ag Bewegungselement für kleine Flüssigkeitsmengen
WO2003030610A1 (en) * 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
WO2003066191A1 (en) * 2002-02-04 2003-08-14 Colorado School Of Mines Laminar flow-based separations of colloidal and cellular particles
EP1489881A4 (en) * 2002-02-28 2009-06-03 Furukawa Electric Co Ltd PLANAR SPEAKER
US7534623B2 (en) * 2002-06-11 2009-05-19 University Of Virginia Patent Foundation Apparatus and method for the purification of nucleic acids
WO2004040001A2 (en) * 2002-10-02 2004-05-13 California Institute Of Technology Microfluidic nucleic acid analysis
US7217542B2 (en) * 2002-10-31 2007-05-15 Hewlett-Packard Development Company, L.P. Microfluidic system for analyzing nucleic acids
GB0227765D0 (en) * 2002-11-28 2003-01-08 Secr Defence Apparatus for processing a fluid sample
AU2003303594A1 (en) * 2002-12-30 2004-07-29 The Regents Of The University Of California Methods and apparatus for pathogen detection and analysis
WO2004086837A1 (ja) * 2003-03-25 2004-10-07 Shin-Etsu Polymer Co., Ltd. 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付物品、およびそれらの製造方法
TW200535205A (en) * 2003-11-13 2005-11-01 Lg Chemical Ltd Adhesives having advanced flame-retardant property
JP4385794B2 (ja) * 2004-02-26 2009-12-16 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接続方法
DE102004050510B4 (de) * 2004-10-15 2012-01-12 Siemens Ag Verfahren zur Ventilsteuerung bei der Thermozyklisierung einer Substanz zwecks PCR und zugehörige Anordnung
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
US8206974B2 (en) * 2005-05-19 2012-06-26 Netbio, Inc. Ruggedized apparatus for analysis of nucleic acid and proteins
JP4686274B2 (ja) * 2005-06-30 2011-05-25 ポリマテック株式会社 放熱部品及びその製造方法
US7559675B2 (en) * 2006-02-07 2009-07-14 Seiko Epson Corporation Light source device and projector
JP2007299907A (ja) * 2006-04-28 2007-11-15 Nitto Denko Corp 電磁波を伝導又は吸収する特性を有する構造体
EP2041318A2 (en) * 2006-06-26 2009-04-01 Blood Cell Storage, Inc. Device and method for extraction and analysis of nucleic acids from biological samples
EP2245197B1 (en) * 2008-02-07 2016-10-12 Whitespace Enterprise Corporation Improvements in and relating to analysis

Also Published As

Publication number Publication date
JP2009543356A (ja) 2009-12-03
CA2656609A1 (en) 2008-01-10
CN101485239B (zh) 2012-02-08
KR101269741B1 (ko) 2013-05-30
CN101485239A (zh) 2009-07-15
KR20080004026A (ko) 2008-01-09
EP2042008A2 (en) 2009-04-01
WO2008005816A3 (en) 2008-02-21
US20090291608A1 (en) 2009-11-26
BRPI0713970A2 (pt) 2012-12-18
RU2381638C1 (ru) 2010-02-10
WO2008005816A2 (en) 2008-01-10
EP2042008A4 (en) 2011-01-05
TW200812806A (en) 2008-03-16

Similar Documents

Publication Publication Date Title
MX2008016433A (es) Empaque de blindaje contra las ondas electromagneticas que tienen elasticidad y adhesividad.
WO2012036788A3 (en) Compliant multilayered thermally-conductive interface assemblies having emi shielding properties
TW200628594A (en) Flame retardant emi shields
ATE530443T1 (de) Grossflächiger schaltkreis mit applikationen
MY182166A (en) Copper foil, copper foil with carrier foil, and copper-clad laminate
WO2008005782A3 (en) Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same
GB2491505A (en) Condutive polymer foams, method of manufacture, and uses thereof
WO2011108878A3 (ko) 그래핀을 이용한 전자파 차폐 방법 및 전자파 차폐재
WO2009003018A3 (en) Conformal shielding process using process gases
EP2629304A4 (en) FLEXIBLE CONDUCTOR MATERIAL AND TRANSDUCER, SOFT PRINTED CIRCUIT BOARD, AND ELECTROMAGNETIC PROTECTION USING THE SOFT CONDUCTOR MATERIAL
TW200707467A (en) Enhanced performance conductive filler and conductive polymers made therefrom
TW201129475A (en) Multilayer resin sheet and method of producing the same, method of producing cured multilayer resin sheet, and high heat conducting resin sheet laminate and method of producing the same
IN2012DN03193A (es)
WO2008057674A3 (en) Snap install emi shields with protrusions and electrically-conductive members for attachment to substrates
WO2014088748A3 (en) Encapsulated expanded crimped metal mesh for sealing, emi shielding and lighting strike applications
EP2290511A3 (en) Touch panel and a method of locating a touch point of the same
GB201213445D0 (en) Security wrap
WO2009143249A3 (en) Grounding electrode
HK1144732A1 (en) Electronic device including an insulating layer having different thicknesses and a conductive electrode and a process of forming the same
WO2011040752A3 (en) Conductive polymer adhesive using nanofiber and method for preparing the same
TW200833222A (en) Structure of mounting shield cover and display device
HK1144729A1 (en) Electronic device including a trench and a conductive structure therein and a process of forming the same
WO2012091487A3 (ko) 전극 및 이를 포함하는 전자소자
WO2009025518A3 (en) Electrically conductive adhesive tape and method for preparing the same
BRPI0907009A2 (pt) processamento de elementos elétricos e/ou eletrônicos em substratos de material celulósico