CN219802901U - Heat treatment tool for electronic element - Google Patents
Heat treatment tool for electronic element Download PDFInfo
- Publication number
- CN219802901U CN219802901U CN202320435785.XU CN202320435785U CN219802901U CN 219802901 U CN219802901 U CN 219802901U CN 202320435785 U CN202320435785 U CN 202320435785U CN 219802901 U CN219802901 U CN 219802901U
- Authority
- CN
- China
- Prior art keywords
- heat treatment
- electronic component
- heat
- treatment tool
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 239000004519 grease Substances 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 7
- 238000007669 thermal treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract 1
- 239000011324 bead Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat treatment tool for an electronic element, which comprises a protective shell arranged on the electronic element in the use process of the electronic element, wherein one side of the length direction of the protective shell is provided with a cooling fan, the other side of the length direction of the protective shell is provided with a plurality of air outlets which are distributed at equal intervals, the bottom end inside the protective shell is provided with a circuit board, the top of the circuit board is provided with an electronic element main body, and the top of the electronic element main body is provided with a heat treatment component which can carry out heat treatment on the electronic element.
Description
Technical Field
The utility model mainly relates to the technical field of heat treatment of electronic elements, in particular to a heat treatment tool for electronic elements.
Background
Electronic components are the basic elements in electronic circuits, typically individual packages, and have two or more leads or metal contacts. The electronic components must be interconnected to form an electronic circuit with specific functions, such as: amplifiers, radio receivers, oscillators, etc., one of the common ways to connect electronic components is soldering to a printed circuit board; most electronic components are low power and only generate a small amount of heat during operation. However, some components, such as high power transistors, CPUs, high power diodes, generate a significant amount of heat, thereby affecting the operational life and reliability of the electronic components.
Disclosure of Invention
The utility model mainly provides a heat treatment tool for electronic elements, which is used for solving the technical problems in the background technology.
The technical scheme adopted for solving the technical problems is as follows:
the utility model provides a heat treatment frock for electronic component, includes the protecting crust that sets up on electronic component in the electronic component use, one side of protecting crust length direction is equipped with radiator fan, a plurality of equidistance distributed's gas outlet has been seted up to protecting crust length direction's opposite side, the inside bottom of protecting crust is equipped with the circuit board, the circuit board top is equipped with the electronic component main part, the electronic component main part top is equipped with the heat treatment subassembly that can carry out heat treatment to electronic component.
Further, the heat treatment assembly comprises an integrated plate positioned in the protective shell, a plurality of heat dissipation plates distributed at equal intervals are arranged at the top of the integrated plate, and heat conduction grease is arranged at the bottom of the integrated plate.
Further, the integrated board is attached to the surface of the electronic element main body through heat conduction grease arranged at the bottom.
Further, the height of the heat dissipation plate is consistent with that of the heat dissipation fan.
Further, a dust screen capable of preventing external dust from entering is arranged in the air outlet.
Further, the two sides of the protective shell along the width direction are provided with mounting plates.
Compared with the prior art, the utility model has the beneficial effects that:
the utility model is suitable for heat treatment of heat generated by the electronic element in the operation of the electronic element, and the heat treatment component is additionally arranged at the top of the electronic element main body, and the surface of the electronic element main body is attached to the bottom of the integrated plate through the heat conduction grease, so that the heat resistance between the surface of the electronic element main body and the bottom of the integrated plate is reduced, the heat dissipation area is increased, the heat dissipation is accelerated, the working temperature of the element is reduced, and the service life and the reliability of the electronic element are improved.
The utility model will be explained in detail below with reference to the drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the present utility model;
FIG. 3 is a schematic view of a heat treatment assembly according to the present utility model.
In the figure: 1. a protective shell; 101. a mounting plate; 102. a heat radiation fan; 103. an air outlet; 2. a circuit board; 201. an electronic component main body; 3. a heat treatment assembly; 301. an integrated board; 302. a heat dissipation plate; 303. and (5) heat conducting grease.
Detailed Description
In order that the utility model may be more fully understood, a more particular description of the utility model will be rendered by reference to the appended drawings, in which several embodiments of the utility model are illustrated, but which may be embodied in different forms and are not limited to the embodiments described herein, which are, on the contrary, provided to provide a more thorough and complete disclosure of the utility model.
Referring to fig. 1-3, a heat treatment tool for an electronic component includes a protecting shell 1 disposed on the electronic component during use of the electronic component, a heat dissipation fan 102 disposed on one side of the protecting shell 1 in a length direction, a plurality of air outlets 103 disposed on the other side of the protecting shell 1 in a length direction, a circuit board 2 disposed at a bottom end of the protecting shell 1, an electronic component main body 201 disposed at a top of the circuit board 2, and a heat treatment assembly 3 disposed at a top of the electronic component main body 201 and capable of heat treating the electronic component, wherein the heat treatment assembly 3 includes an integrated board 301 disposed in the protecting shell 1, a plurality of heat dissipation plates 302 disposed at a top of the integrated board 301 in an equidistant manner, heat dissipation grease 303 disposed at a bottom of the integrated board 301 is attached to a surface of the electronic component main body 201, and a height of the heat dissipation plate 302 is consistent with a height of the heat dissipation fan 102.
It should be noted that, when the current thermal grease 303 is applied, it should be ensured that all air is discharged out of the interface to reduce thermal resistance and lower the operating temperature of the element; the thermal conductivity of the thermal grease 303 is generally lower than that of the heat sink material, so the lower the construction thickness of the thermal grease 303 should be, the better this also helps to reduce the thermal resistance and the operating temperature of the element; however, the film thickness is as low as possible, and meanwhile, the air is not required to be introduced; an effective method for controlling the film thickness is to add glass bead road sign glass balls with controllable diameters into paste or resin, wherein the thickness of an internal interface gap can be measured by the diameters of the beads, and according to the condition of electronic element adaptation, a heat treatment assembly 3 is additionally arranged at the top of an electronic element main body 201, and the surface of the electronic element main body 201 is attached to the bottom of an integrated board 301 through heat conducting grease 303, so that the thermal resistance between the two interfaces is reduced, the heat dissipation area is increased, the heat dissipation is accelerated, the working temperature of an element is reduced, and the service life and the reliability of the electronic element are improved.
Specifically, referring to fig. 2, a dust screen capable of preventing external dust from entering is disposed inside the air outlet 103, so that dust can be prevented from entering the protective housing 1 to affect normal use of the electronic component by disposing the dust screen inside the air outlet 103.
Specifically, referring to fig. 1, mounting plates 101 are disposed on two sides of the protective housing 1 along the width direction, and the mounting plates 101 are provided to facilitate the mounting and dismounting of the protective housing 1 and the maintenance of the heat treatment tool.
The specific operation mode of the utility model is as follows:
firstly, the heat treatment assembly 3 is additionally arranged on the top of the electronic component main body 201, the surface of the electronic component main body 201 is attached to the bottom of the integrated board 301 through the heat conducting grease 303, so that the thermal resistance between the surface and the bottom of the integrated board is reduced, the heat radiating area can be enlarged through the plurality of heat radiating plates 302, the heat radiation is accelerated, the working temperature of the component is reduced, meanwhile, the air flow in the protective shell 1 can be further accelerated through the cooperation of the heat radiating fan 102, the heat is rapidly discharged, and the service life and the reliability of the electronic component are improved.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the utility model is not limited to the embodiments described above, but is intended to be within the scope of the utility model, as long as such insubstantial modifications are made by the method concepts and technical solutions of the utility model, or the concepts and technical solutions of the utility model are applied directly to other occasions without any modifications.
Claims (6)
1. The utility model provides a heat treatment frock for electronic component, includes protective housing (1) that sets up on electronic component in the electronic component use, its characterized in that: one side of protecting crust (1) length direction is equipped with radiator fan (102), gas outlet (103) that a plurality of equidistance was distributed have been seted up to the opposite side of protecting crust (1) length direction, the inside bottom of protecting crust (1) is equipped with circuit board (2), circuit board (2) top is equipped with electronic component main part (201), electronic component main part (201) top is equipped with heat treatment subassembly (3) that can carry out thermal treatment to electronic component.
2. The heat treatment tool for electronic components according to claim 1, wherein: the heat treatment assembly (3) comprises an integrated plate (301) positioned in the protective shell (1), a plurality of heat dissipation plates (302) distributed at equal intervals are arranged at the top of the integrated plate (301), and heat conduction grease (303) is arranged at the bottom of the integrated plate (301).
3. The heat treatment tool for electronic components according to claim 2, wherein: the integrated board (301) is attached to the surface of the electronic component main body (201) through heat conduction grease (303) arranged at the bottom.
4. The heat treatment tool for electronic components according to claim 2, wherein: the height of the heat dissipation plate (302) is consistent with the height of the heat dissipation fan (102).
5. The heat treatment tool for electronic components according to claim 1, wherein: the inside of the air outlet (103) is provided with a dustproof net which can prevent external dust from entering.
6. The heat treatment tool for electronic components according to claim 1, wherein: the two sides of the protective shell (1) along the width direction are provided with mounting plates (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320435785.XU CN219802901U (en) | 2023-03-09 | 2023-03-09 | Heat treatment tool for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320435785.XU CN219802901U (en) | 2023-03-09 | 2023-03-09 | Heat treatment tool for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802901U true CN219802901U (en) | 2023-10-03 |
Family
ID=88185106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320435785.XU Active CN219802901U (en) | 2023-03-09 | 2023-03-09 | Heat treatment tool for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802901U (en) |
-
2023
- 2023-03-09 CN CN202320435785.XU patent/CN219802901U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |