LT3130407T - Piezoelektrinio ultragarso keitiklio sujungimo būdas - Google Patents

Piezoelektrinio ultragarso keitiklio sujungimo būdas

Info

Publication number
LT3130407T
LT3130407T LTEP15180392.1T LT15180392T LT3130407T LT 3130407 T LT3130407 T LT 3130407T LT 15180392 T LT15180392 T LT 15180392T LT 3130407 T LT3130407 T LT 3130407T
Authority
LT
Lithuania
Prior art keywords
bonding
ultrasonic transducer
piezoelectric ultrasonic
piezoelectric
transducer
Prior art date
Application number
LTEP15180392.1T
Other languages
English (en)
Inventor
Thue Bjerring Lindballe
Original Assignee
Apator Miitors Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apator Miitors Aps filed Critical Apator Miitors Aps
Publication of LT3130407T publication Critical patent/LT3130407T/lt

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • G01F1/662Constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • G01F1/667Arrangements of transducers for ultrasonic flowmeters; Circuits for operating ultrasonic flowmeters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/14Casings, e.g. of special material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708Intermediate layers, e.g. barrier, adhesion or growth control buffer layers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
LTEP15180392.1T 2015-08-10 2015-08-10 Piezoelektrinio ultragarso keitiklio sujungimo būdas LT3130407T (lt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15180392.1A EP3130407B1 (en) 2015-08-10 2015-08-10 Method of bonding a piezoelectric ultrasonic transducer

Publications (1)

Publication Number Publication Date
LT3130407T true LT3130407T (lt) 2020-12-28

Family

ID=53800872

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP15180392.1T LT3130407T (lt) 2015-08-10 2015-08-10 Piezoelektrinio ultragarso keitiklio sujungimo būdas

Country Status (4)

Country Link
US (1) US10197423B2 (lt)
EP (1) EP3130407B1 (lt)
DK (1) DK3130407T3 (lt)
LT (1) LT3130407T (lt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123278A1 (de) * 2017-10-06 2019-04-11 Schott Ag Grundkörper mit angelötetem Massestift, Verfahren zu seiner Herstellung und seine Verwendungen
DE102018003802B4 (de) * 2018-05-09 2022-12-01 Diehl Metering Gmbh Messeinrichtung zur Ermittlung einer Fluidgröße
US10900819B2 (en) 2018-08-16 2021-01-26 AXIOMA Metering, UAB Ultrasonic flowmeter
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
US11264314B2 (en) 2019-09-27 2022-03-01 International Business Machines Corporation Interconnection with side connection to substrate
US11735529B2 (en) 2021-05-21 2023-08-22 International Business Machines Corporation Side pad anchored by next adjacent via

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2020593B3 (es) * 1987-08-10 1991-08-16 Siemens Ag Dispositivo ultrasonico aforador de caudales
JP3596364B2 (ja) * 1999-08-05 2004-12-02 松下電器産業株式会社 超音波送受波器および超音波流れ計測装置
US6656124B2 (en) * 2001-10-15 2003-12-02 Vermon Stack based multidimensional ultrasonic transducer array
US6739203B1 (en) * 2002-08-16 2004-05-25 Feldman Marvin J Ultrasonic transducer and flow sensor configuration
WO2004043617A1 (ja) * 2002-11-12 2004-05-27 Seiko Epson Corporation 圧電振動体、その製造方法、およびその圧電振動体を備えた機器
US6822376B2 (en) * 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
DE10325281B4 (de) * 2003-06-04 2018-05-17 Snaptrack, Inc. Elektroakustisches Bauelement und Verfahren zur Herstellung
US20050046312A1 (en) * 2003-09-01 2005-03-03 Fuji Photo Film Co., Ltd. Laminated structure, piezoelectric actuator and method of manufacturing the same
US20070257580A1 (en) * 2006-05-05 2007-11-08 Fujifilm Dimatix, Inc. Polishing Piezoelectric Material
JP5086146B2 (ja) * 2007-03-29 2012-11-28 日本特殊陶業株式会社 超音波振動子及びそれを備える超音波機器
CN103811366B (zh) * 2008-09-18 2017-04-12 富士胶卷视声公司 形成超声匹配层的方法及超声换能器
US8710717B2 (en) * 2010-01-29 2014-04-29 Research Triangle Institute Piezoelectric ultrasonic transducer apparatus
BR112013018520A2 (pt) * 2011-02-23 2016-10-18 Miitors Aps método ultrassônico de vazão
JP2013077883A (ja) * 2011-09-29 2013-04-25 Ge Medical Systems Global Technology Co Llc 超音波プローブ及び超音波画像表示装置
CN104583731B (zh) * 2012-08-22 2018-07-17 阿帕特米托尔斯有限公司 紧凑的超声波流量计

Also Published As

Publication number Publication date
EP3130407B1 (en) 2020-11-25
EP3130407A1 (en) 2017-02-15
US10197423B2 (en) 2019-02-05
DK3130407T3 (da) 2021-02-01
US20170045387A1 (en) 2017-02-16

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