DK3130407T3 - Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer - Google Patents
Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer Download PDFInfo
- Publication number
- DK3130407T3 DK3130407T3 DK15180392.1T DK15180392T DK3130407T3 DK 3130407 T3 DK3130407 T3 DK 3130407T3 DK 15180392 T DK15180392 T DK 15180392T DK 3130407 T3 DK3130407 T3 DK 3130407T3
- Authority
- DK
- Denmark
- Prior art keywords
- binding
- procedure
- ultrasound transducer
- piezoelectric ultrasound
- piezoelectric
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000002604 ultrasonography Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
- G01F1/662—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
- G01F1/667—Arrangements of transducers for ultrasonic flowmeters; Circuits for operating ultrasonic flowmeters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/14—Casings, e.g. of special material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15180392.1A EP3130407B1 (en) | 2015-08-10 | 2015-08-10 | Method of bonding a piezoelectric ultrasonic transducer |
Publications (1)
Publication Number | Publication Date |
---|---|
DK3130407T3 true DK3130407T3 (da) | 2021-02-01 |
Family
ID=53800872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK15180392.1T DK3130407T3 (da) | 2015-08-10 | 2015-08-10 | Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer |
Country Status (4)
Country | Link |
---|---|
US (1) | US10197423B2 (da) |
EP (1) | EP3130407B1 (da) |
DK (1) | DK3130407T3 (da) |
LT (1) | LT3130407T (da) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017123278A1 (de) * | 2017-10-06 | 2019-04-11 | Schott Ag | Grundkörper mit angelötetem Massestift, Verfahren zu seiner Herstellung und seine Verwendungen |
DE102018003802B4 (de) * | 2018-05-09 | 2022-12-01 | Diehl Metering Gmbh | Messeinrichtung zur Ermittlung einer Fluidgröße |
US10900819B2 (en) | 2018-08-16 | 2021-01-26 | AXIOMA Metering, UAB | Ultrasonic flowmeter |
US11004819B2 (en) * | 2019-09-27 | 2021-05-11 | International Business Machines Corporation | Prevention of bridging between solder joints |
US11264314B2 (en) | 2019-09-27 | 2022-03-01 | International Business Machines Corporation | Interconnection with side connection to substrate |
US11735529B2 (en) | 2021-05-21 | 2023-08-22 | International Business Machines Corporation | Side pad anchored by next adjacent via |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5090252A (en) * | 1987-08-10 | 1992-02-25 | Siemens Aktiengesellschaft | Ultrasonic flow measurement installation |
JP3596364B2 (ja) * | 1999-08-05 | 2004-12-02 | 松下電器産業株式会社 | 超音波送受波器および超音波流れ計測装置 |
US6656124B2 (en) * | 2001-10-15 | 2003-12-02 | Vermon | Stack based multidimensional ultrasonic transducer array |
US6739203B1 (en) * | 2002-08-16 | 2004-05-25 | Feldman Marvin J | Ultrasonic transducer and flow sensor configuration |
CN100417458C (zh) * | 2002-11-12 | 2008-09-10 | 精工爱普生株式会社 | 压电振动体及其制造方法以及具有该压电振动体的机器 |
US6822376B2 (en) * | 2002-11-19 | 2004-11-23 | General Electric Company | Method for making electrical connection to ultrasonic transducer |
DE10325281B4 (de) * | 2003-06-04 | 2018-05-17 | Snaptrack, Inc. | Elektroakustisches Bauelement und Verfahren zur Herstellung |
US20050046312A1 (en) * | 2003-09-01 | 2005-03-03 | Fuji Photo Film Co., Ltd. | Laminated structure, piezoelectric actuator and method of manufacturing the same |
US20070257580A1 (en) * | 2006-05-05 | 2007-11-08 | Fujifilm Dimatix, Inc. | Polishing Piezoelectric Material |
JP5086146B2 (ja) * | 2007-03-29 | 2012-11-28 | 日本特殊陶業株式会社 | 超音波振動子及びそれを備える超音波機器 |
US20110144494A1 (en) * | 2008-09-18 | 2011-06-16 | James Mehi | Methods for acquisition and display in ultrasound imaging |
JP2013518530A (ja) * | 2010-01-29 | 2013-05-20 | リサーチ・トライアングル・インスティチュート | 圧電型超音波変換子を形成するための方法、および関連する装置 |
CN103380352A (zh) * | 2011-02-23 | 2013-10-30 | 米托尔斯有限公司 | 超声波流量计 |
JP2013077883A (ja) * | 2011-09-29 | 2013-04-25 | Ge Medical Systems Global Technology Co Llc | 超音波プローブ及び超音波画像表示装置 |
DK2888561T3 (da) * | 2012-08-22 | 2021-09-13 | Apator Miitors Aps | Ultralydsflowmåler omfattende et forbindelsesarrangement |
-
2015
- 2015-08-10 EP EP15180392.1A patent/EP3130407B1/en active Active
- 2015-08-10 LT LTEP15180392.1T patent/LT3130407T/lt unknown
- 2015-08-10 DK DK15180392.1T patent/DK3130407T3/da active
-
2016
- 2016-08-10 US US15/233,590 patent/US10197423B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10197423B2 (en) | 2019-02-05 |
EP3130407A1 (en) | 2017-02-15 |
US20170045387A1 (en) | 2017-02-16 |
LT3130407T (lt) | 2020-12-28 |
EP3130407B1 (en) | 2020-11-25 |
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