KR970059231A - The thermoplastic resin composition having conductivity - Google Patents

The thermoplastic resin composition having conductivity Download PDF

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Publication number
KR970059231A
KR970059231A KR1019960000605A KR19960000605A KR970059231A KR 970059231 A KR970059231 A KR 970059231A KR 1019960000605 A KR1019960000605 A KR 1019960000605A KR 19960000605 A KR19960000605 A KR 19960000605A KR 970059231 A KR970059231 A KR 970059231A
Authority
KR
South Korea
Prior art keywords
resin composition
thermoplastic resin
conductivity
weight
parts
Prior art date
Application number
KR1019960000605A
Other languages
Korean (ko)
Other versions
KR0180569B1 (en
Inventor
계형산
권영도
길현수
이효일
Original Assignee
김상웅
주식회사 삼양사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김상웅, 주식회사 삼양사 filed Critical 김상웅
Priority to KR1019960000605A priority Critical patent/KR0180569B1/en
Publication of KR970059231A publication Critical patent/KR970059231A/en
Application granted granted Critical
Publication of KR0180569B1 publication Critical patent/KR0180569B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Abstract

본 발명은 전도성을 갖는 열가소성 수지 조성물에 관한 것으로서, 더욱 상세하게는 방항족 폴리설폰 수지, 바얗ㅇ족 폴리카보네이트 수지, 카본섬유 및 마이카를 첨가하여 이루어짐으로써 전기전도성, 내열성, 치수안전성 및 가곡ㅇ성이 우수하여 주로 전기전자 제품의 부품 특히, 반도체칩 제조시, 운반 및 건조용인 트레이(tray)등에 사용될 수 있는 열가소성 수지 조성물에 관한 것이다.TECHNICAL FIELD The present invention relates to a thermoplastic resin composition having conductivity, and more particularly, to a thermoplastic resin composition having electrical conductivity, and more particularly to a thermoplastic resin composition having electrical conductivity, And is mainly used for parts of electrical and electronic products, particularly, a thermoplastic resin composition which can be used for a tray for transportation and drying at the time of manufacturing semiconductor chips.

Description

전도성을 갖는 열가소성 수지 조성물The thermoplastic resin composition having conductivity

내용없음No content

Claims (1)

방향족 폴리설폰 수지 15∼85중량%와 폴리카보네이트 수지 85∼15중량%로 이루어진 수지 100중량부와 이에 대하여 카본섬유 5∼25중량부 및 마이카 5∼25중량부를 첨가하여 이루어진 것을 특징으로 하는 전도성을 갖는 열가소성 수지 조성물.100 parts by weight of a resin composed of 15 to 85% by weight of an aromatic polysulfone resin and 85 to 15% by weight of a polycarbonate resin, 5 to 25 parts by weight of carbon fibers and 5 to 25 parts by weight of a mica, And a thermoplastic resin composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960000605A 1996-01-15 1996-01-15 Thermoplastic resin composition KR0180569B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960000605A KR0180569B1 (en) 1996-01-15 1996-01-15 Thermoplastic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960000605A KR0180569B1 (en) 1996-01-15 1996-01-15 Thermoplastic resin composition

Publications (2)

Publication Number Publication Date
KR970059231A true KR970059231A (en) 1997-08-12
KR0180569B1 KR0180569B1 (en) 1999-05-15

Family

ID=19449384

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960000605A KR0180569B1 (en) 1996-01-15 1996-01-15 Thermoplastic resin composition

Country Status (1)

Country Link
KR (1) KR0180569B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002028971A1 (en) * 2000-10-02 2002-04-11 Ge Polymerland Co., Ltd. Polyphenyleneoxide-based composite resin composition for ic tray
WO2002081565A1 (en) * 2001-04-03 2002-10-17 Ge Polymerland Co., Ltd. Polymer resin for ion beam or ion injection treatment to give surface conductiveness
KR101681469B1 (en) * 2015-12-02 2016-12-02 주식회사 더우드 Conductive synthetic wood, and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002028971A1 (en) * 2000-10-02 2002-04-11 Ge Polymerland Co., Ltd. Polyphenyleneoxide-based composite resin composition for ic tray
WO2002081565A1 (en) * 2001-04-03 2002-10-17 Ge Polymerland Co., Ltd. Polymer resin for ion beam or ion injection treatment to give surface conductiveness
KR101681469B1 (en) * 2015-12-02 2016-12-02 주식회사 더우드 Conductive synthetic wood, and method of manufacturing the same

Also Published As

Publication number Publication date
KR0180569B1 (en) 1999-05-15

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