KR970010880A - Conductive Polysulfone Resin Composition - Google Patents

Conductive Polysulfone Resin Composition Download PDF

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Publication number
KR970010880A
KR970010880A KR1019950026802A KR19950026802A KR970010880A KR 970010880 A KR970010880 A KR 970010880A KR 1019950026802 A KR1019950026802 A KR 1019950026802A KR 19950026802 A KR19950026802 A KR 19950026802A KR 970010880 A KR970010880 A KR 970010880A
Authority
KR
South Korea
Prior art keywords
weight
resin composition
conductive
resin
polysulfone resin
Prior art date
Application number
KR1019950026802A
Other languages
Korean (ko)
Other versions
KR0174067B1 (en
Inventor
김환기
계형산
이효일
Original Assignee
김상응
주식회사 삼양사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김상응, 주식회사 삼양사 filed Critical 김상응
Priority to KR1019950026802A priority Critical patent/KR0174067B1/en
Publication of KR970010880A publication Critical patent/KR970010880A/en
Application granted granted Critical
Publication of KR0174067B1 publication Critical patent/KR0174067B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/017—Additives being an antistatic agent

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 전도성 폴리설폰 수지 조성물에 관한 것으로, 방향족 폴리설폰 수지 40∼80중량%와 폴리카보네이트 수지 60∼20중량%로 구성된 수지화합물 100중량부에 대해 카본화이바 5∼20중량부로 구성된 전도성 폴리설폰 수지 조성물에 관한 것으로, 전기 전도성, 치수정밀도, 기계적 강도, 가공성 등이 우수하여 사출성형등 여러가공방법에 의해 전도성 반도체 칩(chip) 캐리어(carrier)에 적용할 수 있는 특징이 있다.The present invention relates to a conductive polysulfone resin composition, the conductive polysulfone consisting of 5 to 20 parts by weight of carbon fiber to 100 parts by weight of a resin compound consisting of 40 to 80% by weight of aromatic polysulfone resin and 60 to 20% by weight of polycarbonate resin The present invention relates to a resin composition, and has excellent electrical conductivity, dimensional accuracy, mechanical strength, processability, and the like, and is applicable to a conductive semiconductor chip carrier by various processing methods such as injection molding.

Description

전도성 폴리설폰 수지 조성물Conductive Polysulfone Resin Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (1)

방향족 폴리설폰 수지 40∼80중량%와 폴리카보네이트 수지 60∼20중량%로 구성된 수지화합물 100중량부에 대해 카본화이버 5∼20중량부로 구성됨을 특징으로 하는 전도성 폴리설폰 수지 조성물.A conductive polysulfone resin composition comprising 5 to 20 parts by weight of carbon fibers relative to 100 parts by weight of a resin compound composed of 40 to 80% by weight of an aromatic polysulfone resin and 60 to 20% by weight of a polycarbonate resin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950026802A 1995-08-28 1995-08-28 Conductive Polysulfone Resin Composition KR0174067B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950026802A KR0174067B1 (en) 1995-08-28 1995-08-28 Conductive Polysulfone Resin Composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950026802A KR0174067B1 (en) 1995-08-28 1995-08-28 Conductive Polysulfone Resin Composition

Publications (2)

Publication Number Publication Date
KR970010880A true KR970010880A (en) 1997-03-27
KR0174067B1 KR0174067B1 (en) 1999-04-01

Family

ID=19424644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950026802A KR0174067B1 (en) 1995-08-28 1995-08-28 Conductive Polysulfone Resin Composition

Country Status (1)

Country Link
KR (1) KR0174067B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295715B1 (en) * 2012-07-17 2013-08-16 유한회사 아이엘에스 Heat radiation composition for reflecing board and cover of lighting apparatus coating having shielding electronic wave and lighting apparatus cover

Also Published As

Publication number Publication date
KR0174067B1 (en) 1999-04-01

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