KR970058507A - Part Mounting Method - Google Patents

Part Mounting Method Download PDF

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Publication number
KR970058507A
KR970058507A KR1019950062197A KR19950062197A KR970058507A KR 970058507 A KR970058507 A KR 970058507A KR 1019950062197 A KR1019950062197 A KR 1019950062197A KR 19950062197 A KR19950062197 A KR 19950062197A KR 970058507 A KR970058507 A KR 970058507A
Authority
KR
South Korea
Prior art keywords
tray
component
moving
disposed
suction nozzle
Prior art date
Application number
KR1019950062197A
Other languages
Korean (ko)
Other versions
KR100213035B1 (en
Inventor
정연갑
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950062197A priority Critical patent/KR100213035B1/en
Publication of KR970058507A publication Critical patent/KR970058507A/en
Application granted granted Critical
Publication of KR100213035B1 publication Critical patent/KR100213035B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명에 따르면, X-Y 로보트(21)에 의해 흡착 노즐(23)이 트레이 피이더(25)에 배치된 트레이(27)의 상부로 이동 및 하강하는 제1이동단계와; 상기 트레이(27)에 배치된 부품(28)을 상기 흡착 노즐(23)로 흡착하는 흡착단계와; 상기 흡착 노즐(22)이 인쇄회로 기판(24)의 상부로 이동 및 하강하는 제2이동 단계와; 공기 압력을 이용하여 상기 부품(28)을 상기 인쇄 회로 기판(24)에 장착하는 장착 단계를 구비한 부품 실장 방법에 있어서, 상기 부품(28)의 위치 및 정렬 상태에 대한 데이타를 제어기(30)에 입력하여 상기 흡착 노즐(22)을 제어할 수 있도록, 카메라(26)를 이용하여 상기 트레이(27)상에 배치된 상기 부품(28)들을 촬상하는 촬상 단계를 더 구비하는 것을 특징으로 하는 부품 실장 방법이 제공된다. 본 발명에 따른 부품 실장 방법에는 카메라로 트레이상의 부품을 인식하여 흡착 노즐을 제어하므로 작업자가 작업 시작전에 트레이상의 부품 정렬 상태에 대한 데이타를 미리 입력할 필요가 없어진다.According to the present invention, the first moving step of moving and lowering the suction nozzle 23 by the X-Y robot 21 to the upper portion of the tray 27 disposed on the tray feeder 25; An adsorption step of adsorbing the components 28 disposed on the tray 27 with the adsorption nozzles 23; A second moving step of moving and lowering the suction nozzle 22 to the upper portion of the printed circuit board 24; In a component mounting method having a mounting step of mounting the component 28 to the printed circuit board 24 using air pressure, the controller 30 stores data on the position and alignment of the component 28. And an imaging step of imaging the components 28 disposed on the tray 27 by using a camera 26 so as to control the suction nozzle 22 by inputting them to the component. A mounting method is provided. In the component mounting method according to the present invention, since the suction nozzle is controlled by recognizing the component on the tray with a camera, the operator does not need to input data on the arrangement of the components on the tray before the operation starts.

Description

부품 실장 방법Part Mounting Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따른 부품 실장 장치에 대한 개략적인 사시 상태도.2 is a schematic perspective state view of a component mounting apparatus according to the present invention.

Claims (1)

X-Y 로보트(21)에 의해 흡착 노즐(23)이 트레이 피이더(25)에 배치된 트레이(27)의 상부로 이동 및 하강하는 제1이동 단계와; 상기 트레이(27)에 배치된 부품(28)을 진공을 이용하여 상기 흡착 노즐(23)로 흡착하는 흡착 단계와; 상기 흡착 노즐(22)이 상승한 이후에 인쇄회로 기판(24)의 상부로 이동 및 하강하는 제2이동 단계와; 공기 압력을 이용하여 상기 흡착 노즐(22)에 흡착된 부품(28)을 상기 인쇄 회로 기판(24)에 장착하는 장착 단계를 구비한 부품 실장 방법에 있어서, 상기 부품(28)의 위치 및 정렬 상태에 대한 데이타를 제어기(30)에 입력하여 상기 흡착 노즐(22)을 제어할 수 있도록, 카메라(26)를 이용하여 상기 트레이(27)상에 배치된 상기 부품(28)들을 촬상하는 촬상 단계를 더 구비하는 것을 특징으로 하는 부품 실장 방법.A first moving step of moving and lowering the suction nozzle 23 by the X-Y robot 21 to the upper part of the tray 27 disposed in the tray feeder 25; An adsorption step of adsorbing the components 28 disposed on the tray 27 to the adsorption nozzle 23 using a vacuum; A second moving step of moving and lowering the upper portion of the printed circuit board 24 after the suction nozzle 22 is raised; A component mounting method having a mounting step of mounting a component 28 adsorbed on the adsorption nozzle 22 to the printed circuit board 24 using air pressure, wherein the position and alignment state of the component 28 are provided. An imaging step of imaging the components 28 disposed on the tray 27 using the camera 26 so that the data on the controller 30 can be input to the controller 30 to control the adsorption nozzle 22. The component mounting method further comprises. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950062197A 1995-12-28 1995-12-28 Part mounting method KR100213035B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950062197A KR100213035B1 (en) 1995-12-28 1995-12-28 Part mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950062197A KR100213035B1 (en) 1995-12-28 1995-12-28 Part mounting method

Publications (2)

Publication Number Publication Date
KR970058507A true KR970058507A (en) 1997-07-31
KR100213035B1 KR100213035B1 (en) 1999-08-02

Family

ID=19446155

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950062197A KR100213035B1 (en) 1995-12-28 1995-12-28 Part mounting method

Country Status (1)

Country Link
KR (1) KR100213035B1 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2918909B2 (en) * 1989-06-15 1999-07-12 株式会社パイロット Many times thermal transfer media

Also Published As

Publication number Publication date
KR100213035B1 (en) 1999-08-02

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