KR970048507U - 고밀도 인쇄회로 기판 - Google Patents

고밀도 인쇄회로 기판

Info

Publication number
KR970048507U
KR970048507U KR2019950051825U KR19950051825U KR970048507U KR 970048507 U KR970048507 U KR 970048507U KR 2019950051825 U KR2019950051825 U KR 2019950051825U KR 19950051825 U KR19950051825 U KR 19950051825U KR 970048507 U KR970048507 U KR 970048507U
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
high density
density printed
board
Prior art date
Application number
KR2019950051825U
Other languages
English (en)
Other versions
KR0135191Y1 (ko
Inventor
안규봉
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019950051825U priority Critical patent/KR0135191Y1/ko
Publication of KR970048507U publication Critical patent/KR970048507U/ko
Application granted granted Critical
Publication of KR0135191Y1 publication Critical patent/KR0135191Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
KR2019950051825U 1995-12-29 1995-12-29 고밀도 인쇄회로 기판 KR0135191Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950051825U KR0135191Y1 (ko) 1995-12-29 1995-12-29 고밀도 인쇄회로 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950051825U KR0135191Y1 (ko) 1995-12-29 1995-12-29 고밀도 인쇄회로 기판

Publications (2)

Publication Number Publication Date
KR970048507U true KR970048507U (ko) 1997-07-31
KR0135191Y1 KR0135191Y1 (ko) 1999-04-15

Family

ID=19441320

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950051825U KR0135191Y1 (ko) 1995-12-29 1995-12-29 고밀도 인쇄회로 기판

Country Status (1)

Country Link
KR (1) KR0135191Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200446009Y1 (ko) * 2009-05-13 2009-09-17 (주) 대영부스터펌프 전자개폐기 2단 설치 모듈

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100663265B1 (ko) * 2005-05-10 2007-01-02 삼성전기주식회사 다층 기판 및 그 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200446009Y1 (ko) * 2009-05-13 2009-09-17 (주) 대영부스터펌프 전자개폐기 2단 설치 모듈

Also Published As

Publication number Publication date
KR0135191Y1 (ko) 1999-04-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee