KR970024098A - Leadframe with Streamlined Structure and Semiconductor Package Using the Same - Google Patents
Leadframe with Streamlined Structure and Semiconductor Package Using the Same Download PDFInfo
- Publication number
- KR970024098A KR970024098A KR1019950038148A KR19950038148A KR970024098A KR 970024098 A KR970024098 A KR 970024098A KR 1019950038148 A KR1019950038148 A KR 1019950038148A KR 19950038148 A KR19950038148 A KR 19950038148A KR 970024098 A KR970024098 A KR 970024098A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- semiconductor package
- streamlined structure
- streamlined
- pad
- Prior art date
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 오목부가 형성된 리드프레임을 이용한 반도체 패키지에 관한 것으로, 더욱 상세하게는 리드 프레임 패드의 좌우측부를 오목하게 형성하여 칩크랙을 방지하여 신뢰성을 향상시키기 위한 유선형 구조를 갖는 리드 프레임 및 그를 이용한 반도체 패키지에 관한 것이다.The present invention relates to a semiconductor package using a lead frame having a recess, and more particularly, to a lead frame having a streamlined structure for improving the reliability by preventing the chip crack by recessing the left and right portions of the lead frame pad, and the semiconductor using the same. It's about packages.
본 발명은, 리드 프레임 패드의 상부에 반도체 칩이 실장되고 그 반도체 칩과 내부리드가 와이어에 의해 전기적으로 연결되며 봉지수지로 성형되는 반도체 패키지에 있어서, 상기 오목부(105)가 상기 리드 프레임 패드의 장변에 상기 리드 프레임 패드의 중심을 향하도록 유선형으로 형성됨을 특징으로 하는 유선형 구조를 갖는 리드 프레임 및 그를 이용한 반도체 패키지를 제공한다.The present invention provides a semiconductor package in which a semiconductor chip is mounted on an upper portion of a lead frame pad, the semiconductor chip and the inner lead are electrically connected by wires, and formed into an encapsulating resin, wherein the recess portion 105 is formed in the lead frame pad. Provided is a lead frame having a streamlined structure and a semiconductor package using the streamlined structure, characterized in that formed on the long side of the lead frame pad toward the center of the streamlined structure.
따라서, 본 발명에 의한 구조에 따르면, 리드 프레임에 유선형의 오목부와 볼록부를 형성하여 패키지 크랙을 방지함과 동시에 수증기압에 의한 저항력을 증가시키는 효과가 있고, 제품의 신뢰성을 향상할 수 있는 이점(利點)이 있다.Therefore, according to the structure of the present invention, the streamlined concave and convex portions are formed in the lead frame, thereby preventing package cracks and increasing resistance by water vapor pressure, thereby improving the reliability of the product ( There is 利 點).
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2A도는 본 발명의 유선형 구조를 갖는 리드 프레임을 이용한 반도체 패키지의 구조를 보여주는 단면도.Figure 2A is a cross-sectional view showing the structure of a semiconductor package using a lead frame having a streamlined structure of the present invention.
제2B도는 본 발명의 유선형 구조를 갖는 리드 프레임을 보여주는 평면도.Figure 2B is a plan view showing a lead frame having a streamlined structure of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038148A KR970024098A (en) | 1995-10-30 | 1995-10-30 | Leadframe with Streamlined Structure and Semiconductor Package Using the Same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038148A KR970024098A (en) | 1995-10-30 | 1995-10-30 | Leadframe with Streamlined Structure and Semiconductor Package Using the Same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970024098A true KR970024098A (en) | 1997-05-30 |
Family
ID=66584847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950038148A KR970024098A (en) | 1995-10-30 | 1995-10-30 | Leadframe with Streamlined Structure and Semiconductor Package Using the Same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970024098A (en) |
-
1995
- 1995-10-30 KR KR1019950038148A patent/KR970024098A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |