KR970023926A - How to align tab tape with alignment pins - Google Patents

How to align tab tape with alignment pins Download PDF

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Publication number
KR970023926A
KR970023926A KR1019950038799A KR19950038799A KR970023926A KR 970023926 A KR970023926 A KR 970023926A KR 1019950038799 A KR1019950038799 A KR 1019950038799A KR 19950038799 A KR19950038799 A KR 19950038799A KR 970023926 A KR970023926 A KR 970023926A
Authority
KR
South Korea
Prior art keywords
tab tape
tape
tab
alignment pins
recognizing
Prior art date
Application number
KR1019950038799A
Other languages
Korean (ko)
Other versions
KR0175265B1 (en
Inventor
이경희
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038799A priority Critical patent/KR0175265B1/en
Publication of KR970023926A publication Critical patent/KR970023926A/en
Application granted granted Critical
Publication of KR0175265B1 publication Critical patent/KR0175265B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 탭 내부리드 공정에 사용되는 장치의 위치 인식부를 이용한 탭 테이프 위치 인식 방법에 관한 것으로, 탭 테이프의 형성된 정렬 구멍에 대응되는 정렬 핀을 베이스 부에 설치하여 단 한번에 위치를 맞추며 또한 상기 탭 테이프 상의 스프라켓 구멍을 인식할 수 있는 고광역 감지 수단을 설치하여 탭 테이프의 위치를 조정할 수 있어 저단가의 탭 제품을 대량으로 제조할 수 있는 특징을 갖는다.The present invention relates to a method for recognizing a tap tape position using a position recognizing unit of a device used in a tab internal reading process, wherein the alignment pin corresponding to the formed alignment hole of the tab tape is installed at the base to adjust the position at a time. It is possible to adjust the position of the tab tape by installing a high-bandwidth sensing means for recognizing the sprocket holes on the tape, and has a feature that a large amount of low-priced tab products can be manufactured.

Description

정렬 핀을 적용한 탭 테이프의 위치 정렬 방법How to align tab tape with alignment pins

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명에 의한 정렬 핀을 적용한 탭 내부리드 본딩 장치를 개략적으로 나타내는 정면도,3 is a front view schematically showing a tab internal lead bonding apparatus to which an alignment pin according to the present invention is applied;

제4도는 제3도의 “B” 부분을 나타내는 평면도.4 is a plan view showing the portion “B” of FIG.

Claims (4)

탭 테이프의 위치를 인식하는 방법에 관한 것으로, (a)정렬 핀들이 형성된 베이스 부의 상부면 상에 복수개 칩이 부착된 캐리어와 그 캐리어의 전기적 연결될 칩에 각기 대응되는 윈도우의 외곽에 상기 정렬 핀들에 각기 대응되도록 형성된 정렬 핀들을 갖는 탭 테이프가 준비되는 단계와; (b)상기 준비된 탭 테이프가 하강되어 상기 정렬 핀들이 그들에 각기 대응되는 탭 테이프의 정렬 구멍들에 삽입되어 탭 테이프의 위치가 조정되는 단계를 포함하는 것을 특징으로 하는 정렬 핀을 적용한 탭 테이프의 위치 정렬 방법.A method for recognizing the position of a tab tape, the method comprising: (a) a carrier having a plurality of chips attached on an upper surface of a base portion on which alignment pins are formed and a window corresponding to a chip respectively corresponding to a chip to be electrically connected to the carrier; Preparing a tab tape having alignment pins each corresponding to each other; (b) the prepared tab tape is lowered so that the alignment pins are inserted into the alignment holes of the tab tape corresponding to them so that the position of the tab tape is adjusted. Position alignment method. 제1항에 있어서, 상기 (b)단계의 삽입된 탭 테이프와 상기 칩이 접촉되지 않는 것을 특징으로 하는 정렬 핀을 적용한 탭 테이프의 위치 정렬 방법.The method of claim 1, wherein the inserted tab tape of step (b) is not in contact with the chip. 제1항에 있어서, 상기 (b)단계 다음에 탭 테이프와 칩이 전기적 연결되는 (c)단계가 추가되는 것을 특징으로 하는 정렬 핀을 적용한 탭 테이프의 위치 정렬 방법.The method of claim 1, wherein the step (b) of the tab tape and the chip is electrically connected after step (b) is added. 제3항에 있어서, 상기 (c)단계 다음에 상기 하강된 탭 테이프가 상승되어 상기 (a)단계가 다시 진행되는 것을 특징으로 하는 정렬 핀을 적용한 탭 테이프의 위치 정렬 방법.4. The method of claim 3, wherein the lowered tab tape is raised after step (c), and step (a) is performed again. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950038799A 1995-10-31 1995-10-31 How to align tab tape with alignment pins KR0175265B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950038799A KR0175265B1 (en) 1995-10-31 1995-10-31 How to align tab tape with alignment pins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038799A KR0175265B1 (en) 1995-10-31 1995-10-31 How to align tab tape with alignment pins

Publications (2)

Publication Number Publication Date
KR970023926A true KR970023926A (en) 1997-05-30
KR0175265B1 KR0175265B1 (en) 1999-04-01

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ID=19432377

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038799A KR0175265B1 (en) 1995-10-31 1995-10-31 How to align tab tape with alignment pins

Country Status (1)

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KR (1) KR0175265B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101273523B1 (en) * 2010-12-22 2013-06-14 주식회사 루셈 Apparatus for correcting array of Tape Carrier Package using Motor
KR101711895B1 (en) * 2015-07-08 2017-03-06 주식회사 엔에이블 Method for manufacturing button with rfid capability and button manufactured by the same

Also Published As

Publication number Publication date
KR0175265B1 (en) 1999-04-01

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