KR970019784A - 프린트배선판과 플랫패널 디스플레이 구동회로용 프린트배선판 및 플랫패널 디스플레이장치 - Google Patents

프린트배선판과 플랫패널 디스플레이 구동회로용 프린트배선판 및 플랫패널 디스플레이장치 Download PDF

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Publication number
KR970019784A
KR970019784A KR1019960023752A KR19960023752A KR970019784A KR 970019784 A KR970019784 A KR 970019784A KR 1019960023752 A KR1019960023752 A KR 1019960023752A KR 19960023752 A KR19960023752 A KR 19960023752A KR 970019784 A KR970019784 A KR 970019784A
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South Korea
Prior art keywords
wiring board
printed wiring
longitudinal direction
flat panel
panel display
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KR1019960023752A
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English (en)
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KR100246634B1 (ko
Inventor
게이따로 야마기시
아끼오 고또
아끼히로 미우라
에이지 무까이
에이시 고후꾸
Original Assignee
기따오까 다까시
미쓰비시덴키주식회사
미쯔이 시게루
어드밴스트 디스플레이주식회사
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Publication of KR100246634B1 publication Critical patent/KR100246634B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

전자장치에서 사용되는 프린트배선판에 관한 것으로서, 고속동작으로 다량의 데이터를 취급해도 전기적으로 오동작이 없는 프린트배선판과 플랫패널 디스플레이장치용의 플랫패널 디스플레이 구동회로용 프린트배선판 및 플랫패널 디스플레이장치를 제공하기 위해, 가늘고 긴 형상을 갖는 다층으로 구성된 프린트배선판으로서 이 프린트배선판의 긴쪽방향의 한쪽의 끝부측에 긴쪽방향과 평행하게 프린트배선판에 직접 또는 간접적으로 탑재되는 IC의 단자와 접속되는 제1관통 VIA를 각 IC와 대응해서 각각이 1열 또는 여러열로 되도록 형성하고, 프린트배선판의 긴쪽방향의 다른쪽의 끝부측에 긴쪽방향과 평행하게 프린트배선판의 신호층을 형성하는 제1층과 제2층의 신호배선을 접속하는 제2관통 VIA를 각각이 1열 또는 여러열로 되도록 형성하고, 제1관통 VIA와 제2관통 VIA를 긴쪽방향과 직교하는 선에 대해서 어긋나게 한 위치에 배치하고, 제1층 및 제2층에 있어서의 제1관통 VIA와 제2관통 VIA 사이의 신호배선을 프린트배선판의 긴쪽방향에 대해서 각도를 갖게 해서 배선하는 것에 의해 IC의 동일 단자끼리를 접속한 구성으로 하였다.
이러한 구성에 의해 전기특성이 양호한 전기부품을 얻을 수 있고, 고정밀도인 플랫패널 디스플레이장치를 실현할 수 있다.

Description

프린트배선판과 플랫패널 디스플레이 구동회로용 프린트배선판 및 플랫패널 디스플레이장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 프린트배선판의 실시형태1의 구성을 도시한 도면.

Claims (3)

  1. 가늘고 긴 형상을 갖는 다층으로 구성된 프린트배선판으로서 이 프린트배선판의 긴쪽방향의 한쪽의 끝부측에 긴쪽방향과 평행하게 상기 프린트배선판에 직접 또는 간접적으로 탑재되는 IC의 단자와 접속되는 제1관통 VIA를 각 IC와 대응해서 각각이 1열 또는 여러열로 되도록 형성하고, 상기 프린트배선판의 긴쪽방향의 다른쪽의 끝부측에 긴쪽방향과 평행하게 상기 프린트배선판의 신호층을 형성하는 제1층과 제2층의 신호배선을 접속하는 제2관통 VIA를 각각이 1열 또는 여러열로 되도록 형성하고, 상기 제1관통 VIA와 상기 제2관통 VIA를 긴쪽방향과 직교하는 선에 대해서 어긋나게 한 위치에 배치하고, 상기 제1층 및 상기 제2층에 있어서의 상기 제1관통 VIA와 상기 제2관통 VIA 사이의 신호배선을 프린트배선판의 긴쪽방향에 대해서 각도를 갖게 해서 배선하는 것에 의해 상기 IC의 동일 단자끼리를 접속한 것을 특징으로 하는 프린트배선판.
  2. 가늘고 긴 형상을 갖는 다층으로 구성된 프린트배선판으로서, 이 프린트배선판의 중앙부에 긴쪽방향과 평행하게 상기 프린트배선판에 직접 또는 간접적으로 탑재되는 IC의 단자와 접속하는 제1관통 VIA를 각 IC와 대응해서 각각이 1열 또는 여러열로 되도록 마련하고, 상기 IC의 동일 단자끼리의 접속을 단 1개의 배선층만으로 실행하도록 한 것을 특징으로 하는 프린트배선판.
  3. 가늘고 긴 형상을 갖는 다층으로 구성된 프린트배선판으로서, 이 프린트배선판의 중앙부에 긴쪽방향과 평행하게 상기 프린트배선판에 직접 또는 간접적으로 탑재되는 IC의 단자와 접속하는 PAD를 각 IC에 대응하게 각각이 1열 또는 여러열로 되도록 마련하고, 상기 IC의 동일 단자끼리의 접속을 표면층에서만 실행하도록 한 것을 특징으로 하는 프린트배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960023752A 1995-09-21 1996-06-26 프린트배선판과 플랫패널 디스플레이 구동회로용 프린트배선판 및 플랫패널 디스플레이장치 KR100246634B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-243002 1995-09-21
JP24300295A JP3263705B2 (ja) 1995-09-21 1995-09-21 プリント配線板およびフラットパネル・ディスプレイ駆動回路用プリント配線板およびフラットパネル・ディスプレイ装置

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KR970019784A true KR970019784A (ko) 1997-04-30
KR100246634B1 KR100246634B1 (ko) 2000-03-15

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US (1) US5771158A (ko)
EP (1) EP0765053A3 (ko)
JP (1) JP3263705B2 (ko)
KR (1) KR100246634B1 (ko)
TW (1) TW318995B (ko)

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JP2920843B2 (ja) * 1991-03-13 1999-07-19 株式会社日立製作所 液晶表示装置

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EP0765053A3 (en) 1998-04-08
EP0765053A2 (en) 1997-03-26
US5771158A (en) 1998-06-23
TW318995B (ko) 1997-11-01
JPH0992986A (ja) 1997-04-04
JP3263705B2 (ja) 2002-03-11
KR100246634B1 (ko) 2000-03-15

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