KR970003391A - 다이싱 테이프 - Google Patents

다이싱 테이프 Download PDF

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Publication number
KR970003391A
KR970003391A KR1019960018661A KR19960018661A KR970003391A KR 970003391 A KR970003391 A KR 970003391A KR 1019960018661 A KR1019960018661 A KR 1019960018661A KR 19960018661 A KR19960018661 A KR 19960018661A KR 970003391 A KR970003391 A KR 970003391A
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KR
South Korea
Prior art keywords
dicing tape
base polymer
weight
parts
support film
Prior art date
Application number
KR1019960018661A
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English (en)
Inventor
글라이헨하겐 페터
파프 로날트
뮐러 안야
베스트팔 안드레아스
Original Assignee
에어렌트 딘네 · 요헨 빌케
바이어스도르프 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에어렌트 딘네 · 요헨 빌케, 바이어스도르프 악티엔게젤샤프트 filed Critical 에어렌트 딘네 · 요헨 빌케
Publication of KR970003391A publication Critical patent/KR970003391A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

UV에 대해 투명한 지지 필름을 가지는 웨이터 및 동류를 일시적으로 고정하기 위한 다이싱 테이프에 있어서, 상기 지지 필름의 한쪽 면에, 접착력이 UV 복사에의해 감소될 수 있는 접촉 접착제 조성물이 배열되고, 상기 접촉 접착제 조성물은, a) 중합 반응을 발생시키는 자유 라디칼을 형성하는 UV 복사에 의한 여기 상태의 기를 포함하는 중합체 체인 분자를 가진 끈기 있고 탄력 있는 (메트)아크릴레이트 - 기본 염기 중합체의 30내지 90중량부, b) (메트)아크릴 형태의 적어도 2개의 중합 가능 이중 결합을 포함하는 하나 이상의 저분자량의 10 내지 70중량부, 및 c) 필요에 따라, 기폭제 수지의 50 내지 60중량부를 포함한다.

Description

다이싱 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. UV에 대해 투명한 지지 필름을 가지는 웨이퍼 및 동류를 일시적으로 고정하기 위한 다이싱 테이프에 있어서, 상기 지지 필름의 한쪽 면에, 접착력이 UV 복사에 의해 감소될 수 있는 접촉 접착제 조성물이 배열되고, 상기 접촉 접착제 조성물은, a) 중합 반응을 발생시키는 자유 라디칼을 형성하는 UV 복사에 의한 여기 상태의 기를 포함하는 중합체 체인 분자를 가진 끈기 있고 탄력 있는 (메트)아크릴레이트 - 기본 염기 중합체의 30 내지 90중량부, b) (메트)아크릴 형태의 적어도 2개의 중합 가능 이중 결합을 포함하는 하나 이상의 저분자량의 10 내지 70중량부, 및 c) 필요에 따라, 기폭제 수지의 50 내지 60중량부를 포함하는 것을 특징으로 하는 다이싱 테이프.
  2. 제1항에 있어서, 상기 염기 중합체는, C1- C12에스테르 라디칼을 가진 에스테르 단위로 구성되는 것을 특징으로 하는 다이싱 테이프.
  3. 제1항에 있어서, 상기 염기 중합체는 아미도, 아미노, 하이드록실, 카르복실, 케토 및/또는 에테르기 같은 극성 작용기를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
  4. 제1항에 있어서, 상기 염기 중합체는 상기 b) 조성물 외에 스티렌과 같은 복합단량체를 포함하는 것을 특징으로 하는 다이싱 테이프.
  5. 제1항에 있어서, 상기 b) 조성물에 따른 화합물은 상기 염기 중합체와 호환할 수 있고, 200 내지 15,000의 분자량, 특히 250 내지 5000의 분자량을 가지는 것을 특징으로 하는 다이싱 테이프.
  6. 제1항에 있어서, 상호 연결 인자를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
  7. 제1항에 있어서, 상기 염기 중합체는 80,000 내지 800,000의 분자량을 갖는 것을 특징으로 하는 다이싱 테이프.
  8. 제1항에 있어서, 상기 염기 중합체는 복합중합화된 형태의 벤조인 아클릴레이트를 포함하는 것을 특징으로 하는 다이싱 테이프.
  9. 제1항에 있어서, 다른 광기폭제를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
  10. 제1항 내지 제9항의 어느 한 항에 따른 다이싱 테이프 사용 방법에 있어서, 다이싱 테이프에 고정된 웨이퍼 또는 동류에 대한 접착력은 깨끗하게 손상없이 상기 웨이퍼 또는 동류가 상기 다이싱 테이프로부터 제거될 수 있을 정도까지 상기 지지 필름을 통과하는 UV 복사에 의해 감소되는 것을 특징으로 하는 다이싱 테이프 사용 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960018661A 1995-06-02 1996-05-30 다이싱 테이프 KR970003391A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19520238A DE19520238C2 (de) 1995-06-02 1995-06-02 Selbstklebeband
DE19520238.4 1995-06-02

Publications (1)

Publication Number Publication Date
KR970003391A true KR970003391A (ko) 1997-01-28

Family

ID=7763492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960018661A KR970003391A (ko) 1995-06-02 1996-05-30 다이싱 테이프

Country Status (5)

Country Link
EP (1) EP0745654A1 (ko)
JP (1) JPH08333555A (ko)
KR (1) KR970003391A (ko)
CN (1) CN1138615A (ko)
DE (1) DE19520238C2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655036B1 (ko) * 1998-08-26 2006-12-07 린텍 가부시키가이샤 양면점착시트 및 그 사용 방법

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JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
DE10012580A1 (de) * 2000-03-15 2001-09-27 Basf Coatings Ag Verfahren zur Herstellung von Beschichtungen, Klebschichten und Dichtungen aus mit aktinischer Strahlung härtbaren Beschichtungsstoffen, Klebstoffen und Dichtungsmassen
DE10151441B4 (de) * 2001-10-18 2015-08-20 Infineon Technologies Ag Anordnung und Verfahren zur Aufnahme und zum Bearbeiten eines dünnen Wafers
JP4123518B2 (ja) * 2001-12-06 2008-07-23 日立化成工業株式会社 光デバイスの製造方法及び光デバイス
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2005332982A (ja) * 2004-05-20 2005-12-02 Renesas Technology Corp 半導体装置の製造方法
JP2007291147A (ja) * 2005-04-19 2007-11-08 Denki Kagaku Kogyo Kk 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。
JP5057697B2 (ja) * 2006-05-12 2012-10-24 日東電工株式会社 半導体ウエハ又は半導体基板加工用粘着シート
JP5047556B2 (ja) * 2006-07-26 2012-10-10 リンテック株式会社 光学機能性フィルム貼合用粘着剤、粘着剤付き光学機能性フィルム及びその製造方法
JP5209947B2 (ja) * 2007-12-13 2013-06-12 東京応化工業株式会社 接着剤の処理方法
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013112245A1 (de) 2013-11-07 2015-05-07 Siltectra Gmbh Verfahren zum Fixieren von Festkörperplatten
CN103560081A (zh) * 2013-11-13 2014-02-05 崔庆珑 晶圆切割和研磨用膜的加工工艺
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
WO2024068152A1 (en) 2022-09-30 2024-04-04 Dyconex Ag Method for manufacturing of a medical device having at least two electrical conductors

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
EP0194706B1 (en) * 1985-02-14 1989-08-23 Bando Chemical Industries, Ltd. A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
US4968559A (en) * 1985-02-14 1990-11-06 Bando Chemical Industries. Ltd. Pressure sensitive adhesive film with barrier layer
DE3639266A1 (de) * 1985-12-27 1987-07-02 Fsk K K Haftfolie
DE3787680T2 (de) * 1986-07-09 1994-03-10 Lintec Corp Klebestreifen zum Kleben von Plättchen.
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.
JP3491911B2 (ja) * 1992-07-29 2004-02-03 リンテック株式会社 半導体ウエハ加工用粘着シート
DE4230784A1 (de) * 1992-09-15 1994-03-17 Beiersdorf Ag Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape)
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655036B1 (ko) * 1998-08-26 2006-12-07 린텍 가부시키가이샤 양면점착시트 및 그 사용 방법

Also Published As

Publication number Publication date
EP0745654A1 (de) 1996-12-04
DE19520238A1 (de) 1996-12-12
JPH08333555A (ja) 1996-12-17
CN1138615A (zh) 1996-12-25
DE19520238C2 (de) 1998-01-15

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