KR970003391A - 다이싱 테이프 - Google Patents
다이싱 테이프 Download PDFInfo
- Publication number
- KR970003391A KR970003391A KR1019960018661A KR19960018661A KR970003391A KR 970003391 A KR970003391 A KR 970003391A KR 1019960018661 A KR1019960018661 A KR 1019960018661A KR 19960018661 A KR19960018661 A KR 19960018661A KR 970003391 A KR970003391 A KR 970003391A
- Authority
- KR
- South Korea
- Prior art keywords
- dicing tape
- base polymer
- weight
- parts
- support film
- Prior art date
Links
- 229920005601 base polymer Polymers 0.000 claims abstract 8
- 239000000853 adhesive Substances 0.000 claims abstract 5
- 230000001070 adhesive effect Effects 0.000 claims abstract 5
- 230000005855 radiation Effects 0.000 claims abstract 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract 2
- 239000004821 Contact adhesive Substances 0.000 claims abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract 2
- 230000005281 excited state Effects 0.000 claims abstract 2
- 239000003999 initiator Substances 0.000 claims abstract 2
- 229920000642 polymer Polymers 0.000 claims abstract 2
- 238000006116 polymerization reaction Methods 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims abstract 2
- 229920005989 resin Polymers 0.000 claims abstract 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- MSMAPCFQRXQMRL-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) prop-2-enoate Chemical compound C=1C=CC=CC=1C(OC(=O)C=C)C(=O)C1=CC=CC=C1 MSMAPCFQRXQMRL-UHFFFAOYSA-N 0.000 claims 1
- 229930194542 Keto Chemical group 0.000 claims 1
- 125000003368 amide group Chemical group 0.000 claims 1
- -1 amino, hydroxyl Chemical group 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 150000002148 esters Chemical group 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 125000000468 ketone group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
UV에 대해 투명한 지지 필름을 가지는 웨이터 및 동류를 일시적으로 고정하기 위한 다이싱 테이프에 있어서, 상기 지지 필름의 한쪽 면에, 접착력이 UV 복사에의해 감소될 수 있는 접촉 접착제 조성물이 배열되고, 상기 접촉 접착제 조성물은, a) 중합 반응을 발생시키는 자유 라디칼을 형성하는 UV 복사에 의한 여기 상태의 기를 포함하는 중합체 체인 분자를 가진 끈기 있고 탄력 있는 (메트)아크릴레이트 - 기본 염기 중합체의 30내지 90중량부, b) (메트)아크릴 형태의 적어도 2개의 중합 가능 이중 결합을 포함하는 하나 이상의 저분자량의 10 내지 70중량부, 및 c) 필요에 따라, 기폭제 수지의 50 내지 60중량부를 포함한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- UV에 대해 투명한 지지 필름을 가지는 웨이퍼 및 동류를 일시적으로 고정하기 위한 다이싱 테이프에 있어서, 상기 지지 필름의 한쪽 면에, 접착력이 UV 복사에 의해 감소될 수 있는 접촉 접착제 조성물이 배열되고, 상기 접촉 접착제 조성물은, a) 중합 반응을 발생시키는 자유 라디칼을 형성하는 UV 복사에 의한 여기 상태의 기를 포함하는 중합체 체인 분자를 가진 끈기 있고 탄력 있는 (메트)아크릴레이트 - 기본 염기 중합체의 30 내지 90중량부, b) (메트)아크릴 형태의 적어도 2개의 중합 가능 이중 결합을 포함하는 하나 이상의 저분자량의 10 내지 70중량부, 및 c) 필요에 따라, 기폭제 수지의 50 내지 60중량부를 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 염기 중합체는, C1- C12에스테르 라디칼을 가진 에스테르 단위로 구성되는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 염기 중합체는 아미도, 아미노, 하이드록실, 카르복실, 케토 및/또는 에테르기 같은 극성 작용기를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 염기 중합체는 상기 b) 조성물 외에 스티렌과 같은 복합단량체를 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 b) 조성물에 따른 화합물은 상기 염기 중합체와 호환할 수 있고, 200 내지 15,000의 분자량, 특히 250 내지 5000의 분자량을 가지는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상호 연결 인자를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 염기 중합체는 80,000 내지 800,000의 분자량을 갖는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 상기 염기 중합체는 복합중합화된 형태의 벤조인 아클릴레이트를 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항에 있어서, 다른 광기폭제를 더 포함하는 것을 특징으로 하는 다이싱 테이프.
- 제1항 내지 제9항의 어느 한 항에 따른 다이싱 테이프 사용 방법에 있어서, 다이싱 테이프에 고정된 웨이퍼 또는 동류에 대한 접착력은 깨끗하게 손상없이 상기 웨이퍼 또는 동류가 상기 다이싱 테이프로부터 제거될 수 있을 정도까지 상기 지지 필름을 통과하는 UV 복사에 의해 감소되는 것을 특징으로 하는 다이싱 테이프 사용 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19520238A DE19520238C2 (de) | 1995-06-02 | 1995-06-02 | Selbstklebeband |
DE19520238.4 | 1995-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970003391A true KR970003391A (ko) | 1997-01-28 |
Family
ID=7763492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960018661A KR970003391A (ko) | 1995-06-02 | 1996-05-30 | 다이싱 테이프 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0745654A1 (ko) |
JP (1) | JPH08333555A (ko) |
KR (1) | KR970003391A (ko) |
CN (1) | CN1138615A (ko) |
DE (1) | DE19520238C2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655036B1 (ko) * | 1998-08-26 | 2006-12-07 | 린텍 가부시키가이샤 | 양면점착시트 및 그 사용 방법 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4072927B2 (ja) * | 1997-08-28 | 2008-04-09 | リンテック株式会社 | エネルギー線硬化型親水性粘着剤組成物およびその利用方法 |
DE10012580A1 (de) * | 2000-03-15 | 2001-09-27 | Basf Coatings Ag | Verfahren zur Herstellung von Beschichtungen, Klebschichten und Dichtungen aus mit aktinischer Strahlung härtbaren Beschichtungsstoffen, Klebstoffen und Dichtungsmassen |
DE10151441B4 (de) * | 2001-10-18 | 2015-08-20 | Infineon Technologies Ag | Anordnung und Verfahren zur Aufnahme und zum Bearbeiten eines dünnen Wafers |
JP4123518B2 (ja) * | 2001-12-06 | 2008-07-23 | 日立化成工業株式会社 | 光デバイスの製造方法及び光デバイス |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2005332982A (ja) * | 2004-05-20 | 2005-12-02 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2007291147A (ja) * | 2005-04-19 | 2007-11-08 | Denki Kagaku Kogyo Kk | 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。 |
JP5057697B2 (ja) * | 2006-05-12 | 2012-10-24 | 日東電工株式会社 | 半導体ウエハ又は半導体基板加工用粘着シート |
JP5047556B2 (ja) * | 2006-07-26 | 2012-10-10 | リンテック株式会社 | 光学機能性フィルム貼合用粘着剤、粘着剤付き光学機能性フィルム及びその製造方法 |
JP5209947B2 (ja) * | 2007-12-13 | 2013-06-12 | 東京応化工業株式会社 | 接着剤の処理方法 |
JP5117629B1 (ja) * | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | ウェハ加工用粘着テープ |
DE102013202473A1 (de) | 2013-02-15 | 2014-08-21 | Tesa Se | Verfahren zum Entfernen von Permeaten aus Flächengebilden |
DE102012224319A1 (de) | 2012-12-21 | 2014-06-26 | Tesa Se | Verfahren zum Entfernen von Permeaten aus Flächengebilden |
DE102013112245A1 (de) | 2013-11-07 | 2015-05-07 | Siltectra Gmbh | Verfahren zum Fixieren von Festkörperplatten |
CN103560081A (zh) * | 2013-11-13 | 2014-02-05 | 崔庆珑 | 晶圆切割和研磨用膜的加工工艺 |
DE102014207792A1 (de) | 2014-04-25 | 2015-10-29 | Tesa Se | Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie |
WO2024068152A1 (en) | 2022-09-30 | 2024-04-04 | Dyconex Ag | Method for manufacturing of a medical device having at least two electrical conductors |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0194706B1 (en) * | 1985-02-14 | 1989-08-23 | Bando Chemical Industries, Ltd. | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
US4968559A (en) * | 1985-02-14 | 1990-11-06 | Bando Chemical Industries. Ltd. | Pressure sensitive adhesive film with barrier layer |
DE3639266A1 (de) * | 1985-12-27 | 1987-07-02 | Fsk K K | Haftfolie |
DE3787680T2 (de) * | 1986-07-09 | 1994-03-10 | Lintec Corp | Klebestreifen zum Kleben von Plättchen. |
DE3850451T2 (de) * | 1987-07-08 | 1995-03-09 | Furukawa Electric Co Ltd | Strahlungsvernetzbare Klebestreifen. |
JP3491911B2 (ja) * | 1992-07-29 | 2004-02-03 | リンテック株式会社 | 半導体ウエハ加工用粘着シート |
DE4230784A1 (de) * | 1992-09-15 | 1994-03-17 | Beiersdorf Ag | Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape) |
JP3410202B2 (ja) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
-
1995
- 1995-06-02 DE DE19520238A patent/DE19520238C2/de not_active Expired - Fee Related
-
1996
- 1996-05-15 EP EP96107711A patent/EP0745654A1/de not_active Withdrawn
- 1996-05-24 JP JP8151883A patent/JPH08333555A/ja active Pending
- 1996-05-30 KR KR1019960018661A patent/KR970003391A/ko not_active Application Discontinuation
- 1996-06-03 CN CN96105370A patent/CN1138615A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655036B1 (ko) * | 1998-08-26 | 2006-12-07 | 린텍 가부시키가이샤 | 양면점착시트 및 그 사용 방법 |
Also Published As
Publication number | Publication date |
---|---|
EP0745654A1 (de) | 1996-12-04 |
DE19520238A1 (de) | 1996-12-12 |
JPH08333555A (ja) | 1996-12-17 |
CN1138615A (zh) | 1996-12-25 |
DE19520238C2 (de) | 1998-01-15 |
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