KR960022787A - Resin composition for flame retardant copper clad laminate for fluorescence detection method - Google Patents

Resin composition for flame retardant copper clad laminate for fluorescence detection method Download PDF

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Publication number
KR960022787A
KR960022787A KR1019940036792A KR19940036792A KR960022787A KR 960022787 A KR960022787 A KR 960022787A KR 1019940036792 A KR1019940036792 A KR 1019940036792A KR 19940036792 A KR19940036792 A KR 19940036792A KR 960022787 A KR960022787 A KR 960022787A
Authority
KR
South Korea
Prior art keywords
resin composition
fluorescence detection
detection method
retardant copper
flame retardant
Prior art date
Application number
KR1019940036792A
Other languages
Korean (ko)
Other versions
KR0182828B1 (en
Inventor
석재한
고종호
김정식
Original Assignee
이웅열
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019940036792A priority Critical patent/KR0182828B1/en
Publication of KR960022787A publication Critical patent/KR960022787A/en
Application granted granted Critical
Publication of KR0182828B1 publication Critical patent/KR0182828B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/329—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/132—Phenols containing keto groups, e.g. benzophenones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 브롬이 함유된 삼관능성 에폭시수지, 벤조페논계 또는 벤조트리아졸계 자외선안정제, 피라졸린계 형광염료, 경화제, 경화촉진제로 이루어진 형광검출방식 자동외관검사용 난연성 동박적층판용 수지조성물이다.The present invention is a resin composition for flame-retardant copper foil laminates for fluorescence detection type automatic visual inspection comprising a trifunctional epoxy resin containing bromine, a benzophenone-based or a benzotriazole-based UV stabilizer, a pyrazoline-based fluorescent dye, a curing agent, and a curing accelerator.

Description

형광검출방식 자동외관 검사용 난연성 동박적층판용 수지조성물Resin composition for flame retardant copper clad laminate for fluorescence detection method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (1)

브롬이 18~30% 함유되고 에폭시 당량이 300~1,000인 다음 구조식 (II)로 표시되는 삼관능성 에폭시수지 100중량부, 벤조페논, 또는 벤조트리아졸계 자외선 안정제 0.1~4.0중량부, 다음 구조식(I)로 표시되는 피라졸린계 형광염료 0.005~3.0중량부, 경화제로서 디시아노디아미드 1.0~30PHR, 경화촉진제로서 2-메틸이미다졸, 2-에틸-4-메틸이미다졸, 벤즈이미다졸 중에서 선택된 하나 또는 둘 이상의 혼합물의 촉매량으로 이루어진 것을 특징으로 하는 형광검출방식 자동 외관검사용 난연성 동박적층판용 수지조성물.100 parts by weight of trifunctional epoxy resin represented by the following structural formula (II) containing 18 to 30% bromine and an epoxy equivalent of 300 to 1,000, 0.1 to 4.0 parts by weight of a benzophenone or a benzotriazole-based UV stabilizer, and the following structural formula (I 0.005 to 3.0 parts by weight of pyrazoline-based fluorescent dyes represented by), dicyanodiamide 1.0 to 30 PHR as a curing agent, 2-methylimidazole, 2-ethyl-4-methylimidazole, and benzimidazole as curing accelerators. Resin composition for flame-retardant copper foil laminated plate for the automatic detection of fluorescence detection method characterized in that it consists of a catalytic amount of the selected one or two or more mixtures. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940036792A 1994-12-26 1994-12-26 Anti-flammable thin core resin composition for the usage of automatic test by fluorescence detection KR0182828B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940036792A KR0182828B1 (en) 1994-12-26 1994-12-26 Anti-flammable thin core resin composition for the usage of automatic test by fluorescence detection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940036792A KR0182828B1 (en) 1994-12-26 1994-12-26 Anti-flammable thin core resin composition for the usage of automatic test by fluorescence detection

Publications (2)

Publication Number Publication Date
KR960022787A true KR960022787A (en) 1996-07-18
KR0182828B1 KR0182828B1 (en) 1999-05-15

Family

ID=19403510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940036792A KR0182828B1 (en) 1994-12-26 1994-12-26 Anti-flammable thin core resin composition for the usage of automatic test by fluorescence detection

Country Status (1)

Country Link
KR (1) KR0182828B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754026B1 (en) * 2006-07-03 2007-09-03 태영세라믹주식회사 Composition for manufacturing tile that emits light in the dark using printing process and manufacturing method for tile that emits light in the dark using the composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754026B1 (en) * 2006-07-03 2007-09-03 태영세라믹주식회사 Composition for manufacturing tile that emits light in the dark using printing process and manufacturing method for tile that emits light in the dark using the composition

Also Published As

Publication number Publication date
KR0182828B1 (en) 1999-05-15

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