KR960012388A - 반도체 소자 장착용 패키지 - Google Patents
반도체 소자 장착용 패키지 Download PDFInfo
- Publication number
- KR960012388A KR960012388A KR1019950030396A KR19950030396A KR960012388A KR 960012388 A KR960012388 A KR 960012388A KR 1019950030396 A KR1019950030396 A KR 1019950030396A KR 19950030396 A KR19950030396 A KR 19950030396A KR 960012388 A KR960012388 A KR 960012388A
- Authority
- KR
- South Korea
- Prior art keywords
- package
- semiconductor device
- device mounting
- mounting
- semiconductor
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22216594 | 1994-09-16 | ||
JP31068094A JPH08167674A (ja) | 1994-12-14 | 1994-12-14 | 半導体素子搭載用パッケージ |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960012388A true KR960012388A (ko) | 1996-04-20 |
Family
ID=26524723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950030396A KR960012388A (ko) | 1994-09-16 | 1995-09-15 | 반도체 소자 장착용 패키지 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5665473A (ko) |
EP (1) | EP0702408A3 (ko) |
KR (1) | KR960012388A (ko) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997000534A1 (fr) * | 1995-06-15 | 1997-01-03 | Nitto Denko Corporation | Procede d'elimination d'un agent photoresistant, et adhesif ou feuille adhesive utilises a cet effet |
US5888847A (en) * | 1995-12-08 | 1999-03-30 | Lsi Logic Corporation | Technique for mounting a semiconductor die |
US6339875B1 (en) | 1996-04-08 | 2002-01-22 | Heat Technology, Inc. | Method for removing heat from an integrated circuit |
KR19980063740A (ko) * | 1996-12-04 | 1998-10-07 | 윌리엄비.켐플러 | 몰딩된 패키지용 다층 리드프레임 |
JPH10223800A (ja) * | 1997-02-12 | 1998-08-21 | Shinko Electric Ind Co Ltd | 半導体パッケージの製造方法 |
DE19734748A1 (de) * | 1997-08-12 | 1999-02-18 | Reitter & Schefenacker Gmbh | Träger, vorzugsweise für Heckleuchten von Kraftfahrzeugen, sowie Verfahren zur Befestigung von elektronischen Bauteilen, vorzugsweise von LED's, an einem solchen Träger |
JPH11199841A (ja) * | 1998-01-19 | 1999-07-27 | Nitto Denko Corp | 半導体装置用接着シ―ト類と面実装型半導体装置 |
US6515359B1 (en) * | 1998-01-20 | 2003-02-04 | Micron Technology, Inc. | Lead frame decoupling capacitor semiconductor device packages including the same and methods |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
US6700185B1 (en) * | 1999-11-10 | 2004-03-02 | Hitachi Chemical Co., Ltd. | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
US6674775B1 (en) | 2000-02-18 | 2004-01-06 | Jds Uniphase Corporation | Contact structure for semiconductor lasers |
US20040120371A1 (en) * | 2000-02-18 | 2004-06-24 | Jds Uniphase Corporation | Contact structure for a semiconductor component |
US6614966B2 (en) | 2000-03-22 | 2003-09-02 | Matsushita Electric Industrial Co., Ltd. | Optical waveguide device integrated module and method of manufacturing the same |
DE10038006A1 (de) * | 2000-08-04 | 2002-02-21 | Haas Laser Gmbh & Co Kg | Laserverstärkeranordnung |
EP1320879A4 (en) * | 2000-08-11 | 2009-03-11 | Chem Trace Corp | SYSTEM AND METHOD FOR CLEANING PARTS OF SEMICONDUCTOR MANUFACTURING PARTS |
US6879861B2 (en) * | 2000-12-21 | 2005-04-12 | Medtronic, Inc. | Polymeric materials with improved dielectric breakdown strength |
CA2385211C (en) * | 2001-05-17 | 2009-11-24 | Nitto Denko Corporation | Adhering member and method for producing adhering member |
JP4779255B2 (ja) * | 2001-07-16 | 2011-09-28 | パナソニック株式会社 | レーザ光源 |
US6712621B2 (en) * | 2002-01-23 | 2004-03-30 | High Connection Density, Inc. | Thermally enhanced interposer and method |
JP4094494B2 (ja) * | 2002-08-23 | 2008-06-04 | 新光電気工業株式会社 | 半導体パッケージ |
US7045072B2 (en) * | 2003-07-24 | 2006-05-16 | Tan Samantha S H | Cleaning process and apparatus for silicate materials |
US7091132B2 (en) * | 2003-07-24 | 2006-08-15 | Applied Materials, Inc. | Ultrasonic assisted etch using corrosive liquids |
US7754609B1 (en) | 2003-10-28 | 2010-07-13 | Applied Materials, Inc. | Cleaning processes for silicon carbide materials |
JP2005217211A (ja) * | 2004-01-30 | 2005-08-11 | Tecnisco Ltd | 半導体用冷却器及び半導体用冷却器積層体 |
US7492595B2 (en) * | 2005-03-31 | 2009-02-17 | Tecnisco Limited | Semiconductor cooling device and stack of semiconductor cooling devices |
JP4876426B2 (ja) * | 2005-04-08 | 2012-02-15 | 日亜化学工業株式会社 | 耐熱性及び耐光性に優れる発光装置 |
US7450396B2 (en) * | 2006-09-28 | 2008-11-11 | Intel Corporation | Skew compensation by changing ground parasitic for traces |
WO2008057351A2 (en) * | 2006-11-01 | 2008-05-15 | Applied Materials, Inc. | Methods and apparatus for cleaning chamber components |
CN101472386B (zh) * | 2007-12-26 | 2012-03-28 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
US20110038124A1 (en) * | 2008-04-21 | 2011-02-17 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
JP5590602B2 (ja) * | 2010-02-12 | 2014-09-17 | サムスン電機ジャパンアドバンスドテクノロジー株式会社 | ディスク駆動装置の生産方法及びその生産方法により生産されたディスク駆動装置 |
DE102010003227A1 (de) | 2010-03-24 | 2011-09-29 | Universität Stuttgart Institut für Strahlwerkzeuge | Lasersystem |
JP5581933B2 (ja) * | 2010-09-22 | 2014-09-03 | ソニー株式会社 | パッケージ基板及びこれを用いたモジュール並びに電気・電子機器 |
CN103811425A (zh) * | 2012-11-05 | 2014-05-21 | 康文生 | 一种可以防止光透射的晶闸管封装壳及晶闸管 |
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---|---|---|---|---|
JPS6017705B2 (ja) * | 1980-11-27 | 1985-05-04 | 日東電工株式会社 | 金属板補強用の接着性シ−トと金属板補強方法 |
JPS58128509U (ja) * | 1982-02-24 | 1983-08-31 | 日東電工株式会社 | 導電性接着テ−プ又はシ−ト |
JPS6066843A (ja) * | 1983-09-22 | 1985-04-17 | Hitachi Ltd | 集積回路パツケ−ジ |
US4877760A (en) * | 1985-05-22 | 1989-10-31 | Ngk Spark Plug Co., Ltd. | Aluminum nitride sintered body with high thermal conductivity and process for producing same |
US4835120A (en) | 1987-01-12 | 1989-05-30 | Debendra Mallik | Method of making a multilayer molded plastic IC package |
US4891687A (en) | 1987-01-12 | 1990-01-02 | Intel Corporation | Multi-layer molded plastic IC package |
US5008734A (en) * | 1989-12-20 | 1991-04-16 | National Semiconductor Corporation | Stadium-stepped package for an integrated circuit with air dielectric |
JP2808952B2 (ja) * | 1991-11-27 | 1998-10-08 | 日立電線株式会社 | 半導体素子搭載用基板 |
US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
US5629559A (en) * | 1993-04-06 | 1997-05-13 | Tokuyama Corporation | Package for semiconductor device |
US5510174A (en) * | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
-
1995
- 1995-09-12 US US08/527,225 patent/US5665473A/en not_active Expired - Fee Related
- 1995-09-15 EP EP95114553A patent/EP0702408A3/en not_active Withdrawn
- 1995-09-15 KR KR1019950030396A patent/KR960012388A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US5665473A (en) | 1997-09-09 |
EP0702408A3 (en) | 1997-09-10 |
EP0702408A2 (en) | 1996-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |