KR960003945Y1 - Electromagnetic wave shielding equipment - Google Patents
Electromagnetic wave shielding equipment Download PDFInfo
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- KR960003945Y1 KR960003945Y1 KR92025792U KR920025792U KR960003945Y1 KR 960003945 Y1 KR960003945 Y1 KR 960003945Y1 KR 92025792 U KR92025792 U KR 92025792U KR 920025792 U KR920025792 U KR 920025792U KR 960003945 Y1 KR960003945 Y1 KR 960003945Y1
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- shielding
- electronic product
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래 장치의 구성을 보인 분해사시도.1 is an exploded perspective view showing the configuration of a conventional device.
제2도는 제1도의 A부 체결 상태도.2 is a state A fastening state of FIG.
제3도는 본 고안 장치의 구성을 보인 분해 사시도.Figure 3 is an exploded perspective view showing the configuration of the device of the present invention.
제4도는 제3도의 B부의 체결상태를 보인 부분 절결 사시도.4 is a partially cutaway perspective view showing the fastening state of the portion B of FIG.
제5도는 제3도의 C부의 고정상태를 보인 사시도.5 is a perspective view showing a fixed state of the portion C of FIG.
제6도는 본 고안에 의한 차폐커버의 방열공 배치상태를 보인 차폐커버의 부분 절개 사시도.Figure 6 is a partial cutaway perspective view of the shield cover showing a heat radiation hole arrangement of the shield cover according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 기판 1a : 체결공1 substrate 1a fastening hole
10 : 상부차폐커버 11 : 방열공10: upper shield cover 11: heat radiating hole
12 : 안내단 13 : 타발공12: guide 13: punching ball
20 : 하부차폐커버 21 : 방열공20: lower shield cover 21: heat dissipation hole
22 : 단턱부 23 : 체결편22: stepped portion 23: fastening piece
본 고안은 전자파 간섭규제(Electronic Magnetic Interference)를 받는 컴퓨터의 모니터 또는 텔레비젼등과 같은 전자제품에서 발생되는 전자파 노이즈를 차폐하기 위한 전자제품의 전자파 차폐장치에 관한 것이다.The present invention relates to an electromagnetic wave shielding device of an electronic product for shielding electromagnetic noise generated from an electronic product such as a monitor or a television of a computer subjected to electromagnetic interference interference (Electronic Magnetic Interference).
종래에는 제1도 및 제2도에 도시한 바와 같이, 각종 회로소자(2)(2')가 설치되는 기판(1)상면에 금속으로 형성된 소정 형상의 차폐커버(3)를, 기판(1)의 고정공(4)에 차폐커버(3)의 고정편(5)을 삽설한 후 납땜(9)으로 고정설치함으로써 기판(1)상의 회로소자(2)에서 발생되는 전자파 노이즈를 차폐토록 하였다.Conventionally, as shown in FIGS. 1 and 2, a shield cover 3 having a predetermined shape formed of metal on the upper surface of the substrate 1 on which the various circuit elements 2, 2 'are provided is provided. Inserting the fixing piece (5) of the shielding cover (3) into the fixing hole (4) of the () and then fixed by soldering (9) to shield the electromagnetic noise generated in the circuit element (2) on the substrate (1) .
도면중 미설명 부호 6은 차폐커버(3)의 개방부, 7은 CPT소켓, 8은 리드선을 보인 것이다.In the drawings, reference numeral 6 denotes an opening of the shield cover 3, 7 a CPT socket, and 8 a lead wire.
상기한 바와 같이 구성되어 설치되는 종래 전자파 차폐장치는 상기 차폐커버(3)의 전면부에 형성된 개방부(6)를 통해 회로소자에서 발생되는 전자파 노이즈가 주변에 설치되어 있는 각종 부품으로 누설되어 영향을 미치게 됨으로써, 제품의 신뢰를 저하하는 문제점이 있었고, 상기 차폐커버의 좌,우측면과 후면은 폐쇄되어 있기 때문에 회로소자에서 발생되는 열이 외부로 방출되지 못하게 됨으로써, 회로소자의 특성이 떨어져서 제품의 성능을 저하시키는 문제점이 있었다.Conventional electromagnetic shielding device configured and installed as described above is affected by the electromagnetic noise generated from the circuit elements leaked to the various components installed around the opening portion 6 formed in the front portion of the shielding cover (3) By this, there was a problem of lowering the reliability of the product, and since the left, right and rear surfaces of the shielding cover are closed, the heat generated from the circuit device is not discharged to the outside, so that the characteristics of the product are degraded. There was a problem of degrading performance.
본 고안의 목적은 전자제품의 기판상의 각종 회로소자에서 발생되는 전자파 노이즈의 외부노설을 방지하여 주변에 설치되어 있는 부품을 전자파 간섭으로 인한 영향으로부터 보호함으로써 제품의 신뢰성을 향상하려는데 있다.An object of the present invention is to improve the reliability of the product by preventing the external exposure of electromagnetic noise generated in various circuit elements on the substrate of the electronic product to protect the components installed around from the effects of electromagnetic interference.
이러한 본 고안의 목적을 달성하기 위하여, 전자파 노이즈가 발생되는 전자제품의 기판상면에 상부차폐커버를 결합고정하고, 기판의 하면에는 하부차폐커버를 결합고정하여 외부로 누설되는 전자파 노이즈를 차폐하도록 구성되는 것임을 특징으로 하는 전자제품의 전자파 차폐장치가 제공된다.In order to achieve the object of the present invention, the upper shield cover is fixed to the upper surface of the substrate of the electromagnetic wave generating electromagnetic noise, and the lower shield cover is fixed to the lower surface of the substrate is configured to shield the electromagnetic noise leaked to the outside Provided is an electromagnetic shielding device for an electronic product, which is to be provided.
상기 상,하부차폐커버에는 기판에서 발생되는 열을 외부로 방산시키기 위한 다수개의 방열공이 형성되는 것을 특징으로 한다.The upper and lower shield covers are provided with a plurality of heat dissipation holes for dissipating heat generated from the substrate to the outside.
이하, 상기한 바와 같은 본 고안을 첨부도면에 의해 상세히 설명한다.Hereinafter, the present invention as described above will be described in detail by the accompanying drawings.
제3도는 본 고안 장치의 구성을 보인 분해 사시도이고, 제4도는 제3도의 B부의 체결상태를 보인 부분 절결사시도이며, 제5도는 제3도의 C부의 고정상태를 보인 사시도이고, 제6도는 본 고안에 의한 차폐커버의 방열공배치상태를 보인 차폐커버의 부분 절결 사시도이다.Figure 3 is an exploded perspective view showing the configuration of the device of the present invention, Figure 4 is a partially cutaway perspective view showing the fastening state of the B portion of Figure 3, Figure 5 is a perspective view showing a fixed state of the C portion of Figure 3, Figure 6 Partial cutaway perspective view of the shield cover showing the heat dissipation hole arrangement state of the present invention.
제3도에서 상부차폐커버(10)은 일부 절개한 상태로 도시되어 있으나, 실질적으로 기판(1)의 전체를 씌울 수 있는 크기로 형성되는 것이다.In FIG. 3, the upper shield cover 10 is partially cut away, but is formed to have a size that substantially covers the entire substrate 1.
이에 도시한 바와 같이, 본 고안에 의한 전자제품의 전자파 차폐장치는 전자파 노이즈가 발생되는 전자제품의 기판(1)의 상면에 상부차폐커버(10)를 결합고정하고, 기판(1)의 하면에는 하부차폐커버(20)를 결합고정하여 외부로 누설되는 전자파 노이즈를 차폐하도록 구성한다.As shown in the figure, the electromagnetic wave shielding device of the electronic product according to the present invention is fixed to the upper shield cover 10 on the upper surface of the substrate 1 of the electronic product where electromagnetic noise is generated, the lower surface of the substrate 1 It is configured to shield the electromagnetic shield leaking to the outside by fixing the lower shield cover 20.
상기 상부차폐커버(10)와 하부차폐커버(20)의 재질은 금속으로 된 통상적인 강판이면 무방하나, 강판이 아닐 경우에는 부식이 되지 않도록 도금처리하여 사용하도록 하며, 그 두께(t)는 전기적인 금속의 도전성과 기계적인 강도를 고려하여 최소 0.3mm이상으로 하는 것이 바람직하다.The material of the upper shielding cover 10 and the lower shielding cover 20 may be a conventional steel sheet made of metal, but when the steel sheet is not a steel sheet, the upper shielding cover 10 and the lower shielding cover 20 are plated so as not to be corroded. In consideration of the conductivity and mechanical strength of the metal, it is desirable to set it as 0.3 mm or more.
또한, 상기 상, 하부차폐커버(10)(20)에는 기판(1)에서 발생되는 열을 외부로 발산시키기 위해 다수개의 방열공(11)(21)을 소정간격으로 형성하도록 한다. 이때 상기 방열공(11)(21)의 직경(a)은 6~8mm 정도로 하고, 방열공(11)(21)간의 상호 간격(b)은 최소 4mm이상으로 한다.In addition, the upper and lower shield covers 10 and 20 to form a plurality of heat dissipation holes 11 and 21 at predetermined intervals to dissipate heat generated from the substrate 1 to the outside. At this time, the diameter (a) of the heat dissipation holes (11) 21 is about 6 ~ 8mm, and the mutual spacing (b) between the heat dissipation holes (11) 21 is at least 4mm.
한편, 상기 상부차폐커버(10)는 하단부에 안내단(12)을 형성하고, 전, 좌, 우측면의 일정부위에는 타발공(13)을 형성하며, 상기 하부차폐커버(20)의 내측에는 기판(1)이 안착되어지는 단턱부(22)와, 소정갯수의 체결편(23)을 형성하고, 상기 기판(1)에는 체결편(23)이 관통되는 체결공(1a)을 체결편(23)과 대응되는 부위에 형성한다.On the other hand, the upper shield cover 10 forms a guide end 12 at the lower end, and the punching hole 13 is formed in a predetermined portion of the front, left, right surface, the substrate inside the lower shield cover 20 A stepped portion 22 on which (1) is to be seated and a predetermined number of fastening pieces 23 are formed, and a fastening hole 1a through which the fastening pieces 23 pass is formed in the substrate 1. In the corresponding area.
도면중 미설명 부호 14는 납땜으로 고정된 상태를 보인 것이고, 종래 구성과 동일부분은 동일부호를 사용하였다.In the figure, reference numeral 14 denotes a state fixed by soldering, and the same reference numerals are used for the same parts as in the conventional configuration.
이와 같이 구성되는 본 고안에 의한 전자제품의 전자파 차폐장치를 기판(1)에 결합고정할 때에는 먼저, 기판(1)의 체결공(1a)에 하부차폐커버(20)의 체결편(23)을 삽입관통하면서 기판(1)을 단턱부(22)에 안착시키고, 제4도에서와 같이, 체결공(1a)에 삽입된 체결편(23)의 단부를 구부려서 기판(1)을 하부차폐커버(20)에 완전히 결합고정되도록 한 다음, 상기 상부차폐커버(10)를 기판(1)에서 전자파 노이즈가 가장 많이 발생되는 회로소자(2) 부위를 복개하면서 안내단(12)에 의해 하부차폐커버(20)의 외측부위에 일차적으로 체결되도록 하고, 제5도에서와 같이 상부차폐커버(10)의 타발공(13)을 납땜(14)하여 상부차폐커버(10)와 하부차폐커버(20)를 전기적, 기계적으로 완벽하게 접속 및 고정되도록 한다.When fastening and fixing the electromagnetic shielding device of the electronic product according to the present invention configured as described above to the substrate 1, first, the fastening piece 23 of the lower shielding cover 20 is fastened to the fastening hole 1a of the substrate 1. While inserting through, the substrate 1 is seated on the stepped portion 22, and as shown in FIG. 4, the end of the fastening piece 23 inserted into the fastening hole 1a is bent to cover the substrate 1 with a lower shielding cover ( 20 and then the upper shielding cover 10 is closed by the guide 12 while the upper shielding cover 10 covers the portion of the circuit element 2 where electromagnetic wave is most generated in the substrate 1. 20 to be first fastened to the outer part of the upper part, and as shown in FIG. 5, the punching hole 13 of the upper shielding cover 10 is soldered 14 to electrically connect the upper shielding cover 10 and the lower shielding cover 20. To be completely connected and secured mechanically.
이상에서 설명한 바와 같은, 본 고안에 의한 전자제품의 전자파 차폐장치에 의하면, 기판의 회로소자 및 각종 소자들로 연결된 회로에서 전자파 노이즈가 발생하게 될 때, 기판의 상면에 형성된 회로소자에서 발생되는 전자파 노이즈는 상부차폐커버에 의해 외부로 누설되는 것이 방지되고, 또한, 기판의 하면에 형성된 회로에서 발생되는 전자파 노이즈는 하부차폐커버에 의해 외부누설이 완전하게 차폐되며, 동시에 기판에서 발생되는 열은 상, 하부차폐커버에 형성된 방열공을 통해 방열 작용이 이루어지게 되어 기판의 주변에 설치되어 있는 각종 부품이 전자파 간섭으로부터 보호되어 제품의 신뢰성이 향상되는 효과가 있다.As described above, according to the electromagnetic shielding apparatus of the electronic product according to the present invention, when electromagnetic noise is generated in the circuit elements of the substrate and the circuit connected to the various elements, electromagnetic waves generated in the circuit element formed on the upper surface of the substrate Noise is prevented from leaking to the outside by the upper shielding cover, and electromagnetic noise generated in a circuit formed on the lower surface of the substrate is completely shielded from external leakage by the lower shielding cover, and at the same time, heat generated from the substrate Heat dissipation is performed through the heat dissipation hole formed in the lower shielding cover, so that various components installed around the substrate are protected from electromagnetic interference, thereby improving reliability of the product.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92025792U KR960003945Y1 (en) | 1992-12-17 | 1992-12-17 | Electromagnetic wave shielding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92025792U KR960003945Y1 (en) | 1992-12-17 | 1992-12-17 | Electromagnetic wave shielding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940018676U KR940018676U (en) | 1994-07-30 |
| KR960003945Y1 true KR960003945Y1 (en) | 1996-05-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92025792U KR960003945Y1 (en) | 1992-12-17 | 1992-12-17 | Electromagnetic wave shielding equipment |
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| Country | Link |
|---|---|
| KR (1) | KR960003945Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100332964B1 (en) * | 1998-03-13 | 2002-08-21 | 삼성전자 주식회사 | Notebook computer for cutting off electromagnetic wave being discharged through external connection port |
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1992
- 1992-12-17 KR KR92025792U patent/KR960003945Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR940018676U (en) | 1994-07-30 |
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