KR960001899A - 광가공장치 및 방법 - Google Patents

광가공장치 및 방법 Download PDF

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Publication number
KR960001899A
KR960001899A KR1019950014535A KR19950014535A KR960001899A KR 960001899 A KR960001899 A KR 960001899A KR 1019950014535 A KR1019950014535 A KR 1019950014535A KR 19950014535 A KR19950014535 A KR 19950014535A KR 960001899 A KR960001899 A KR 960001899A
Authority
KR
South Korea
Prior art keywords
processing device
optical processing
optical
processing
Prior art date
Application number
KR1019950014535A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960001899A publication Critical patent/KR960001899A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1019950014535A 1994-06-02 1995-06-01 광가공장치 및 방법 KR960001899A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12148294 1994-06-02
JP15760594A JP3209641B2 (ja) 1994-06-02 1994-07-08 光加工装置及び方法

Publications (1)

Publication Number Publication Date
KR960001899A true KR960001899A (ko) 1996-01-26

Family

ID=26458839

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950014535A KR960001899A (ko) 1994-06-02 1995-06-01 광가공장치 및 방법

Country Status (7)

Country Link
US (1) US5811754A (ko)
JP (1) JP3209641B2 (ko)
KR (1) KR960001899A (ko)
CN (1) CN1119975A (ko)
CA (1) CA2149949C (ko)
DE (1) DE19520213C2 (ko)
TW (1) TW336910B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970043549A (ko) * 1995-12-02 1997-07-26 김준웅 고심색성 폴리에스터 직물의 제조방법

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US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
US6255619B1 (en) * 1996-03-08 2001-07-03 Nippon Aspherical Lens Co., Lens, semiconductor laser element, device for machining the lens and element, process for producing semiconductor laser element, optical element, and device and method for machining optical element
DE69737991T2 (de) * 1996-11-20 2008-04-30 Ibiden Co., Ltd., Ogaki Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US6040552A (en) * 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure
US6120725A (en) 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
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GB9811557D0 (en) * 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
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US7111423B2 (en) * 1999-10-08 2006-09-26 Identification Dynamics, Llc Method and apparatus for reading firearm microstamping
US6833911B2 (en) 1999-10-08 2004-12-21 Identification Dynamics, Inc. Method and apparatus for reading firearm microstamping
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DE10017614B4 (de) * 2000-03-31 2005-02-24 Laser-Laboratorium Göttingen eV Verfahren zur Herstellung einer dielektrischen Reflexionsmaske
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DE10255628A1 (de) * 2002-11-28 2004-07-08 Siemens Ag Verfahren zur Bestimmung der Fokuslage eines Laserstrahls
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CN105796217B (zh) * 2016-05-17 2018-10-26 常州市第二人民医院 一种血管支架
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CN108941942B (zh) * 2018-09-06 2023-09-22 广西中科蓝谷半导体科技有限公司 一种光刻机小工件卡具的使用方法
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JPWO2023276745A1 (ko) * 2021-06-29 2023-01-05
WO2023062842A1 (ja) * 2021-10-15 2023-04-20 信越エンジニアリング株式会社 加工装置、加工方法及び基板の製造方法

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KR970043549A (ko) * 1995-12-02 1997-07-26 김준웅 고심색성 폴리에스터 직물의 제조방법

Also Published As

Publication number Publication date
TW336910B (en) 1998-07-21
JPH0847790A (ja) 1996-02-20
CA2149949A1 (en) 1995-12-03
JP3209641B2 (ja) 2001-09-17
CN1119975A (zh) 1996-04-10
DE19520213A1 (de) 1995-12-07
CA2149949C (en) 1998-10-27
US5811754A (en) 1998-09-22
DE19520213C2 (de) 1997-05-15

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