KR950021862A - 칩형 트랜스 - Google Patents

칩형 트랜스 Download PDF

Info

Publication number
KR950021862A
KR950021862A KR1019940032896A KR19940032896A KR950021862A KR 950021862 A KR950021862 A KR 950021862A KR 1019940032896 A KR1019940032896 A KR 1019940032896A KR 19940032896 A KR19940032896 A KR 19940032896A KR 950021862 A KR950021862 A KR 950021862A
Authority
KR
South Korea
Prior art keywords
stripline
dielectric substrate
main surface
transformer
chip
Prior art date
Application number
KR1019940032896A
Other languages
English (en)
Other versions
KR100309656B1 (ko
Inventor
야스히로 후시끼
Original Assignee
무라다 야스다까
가부시끼가이샤 무라다세이샤꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무라다 야스다까, 가부시끼가이샤 무라다세이샤꾸쇼 filed Critical 무라다 야스다까
Publication of KR950021862A publication Critical patent/KR950021862A/ko
Application granted granted Critical
Publication of KR100309656B1 publication Critical patent/KR100309656B1/ko

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H03H7/422Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns comprising distributed impedance elements together with lumped impedance elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F2017/0066Printed inductances with a magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Waveguides (AREA)

Abstract

칩형 트랜스로서의 발룬 트랜스(10)는 적층체(12)를 포함하고, 적층체(12)는 적층되는 제1∼제5의 유전체기판(14a)∼(14e)를 포함한다.
제1의 유전체기판(14a) 및 제5의 유전체기판(14e)의 일방 주면에는 어스전극(16) 및 (30)이 각각 형성된다.
제2의 유전체기판(14b)의 일방 주면에는 접속전극(20)이 형성된다.
제3의 유전체기판(14c)의 일방 주면에는 제1의 스트립라인(22)이 형성된다. 제1의 스트립라인(22)은 나선상의 제1 및 제2의 부분(24a) 및 (24b)으로서 된다. 제4의 유전체기판(14d)의 일방 주면에는 나선상의 제2 및 제3의 스트립라인(26) 및 (28)이 형성된다.
제2 및 제3의 스트립라인(26) 및 (28)은 제1의 스트립라인(22)의 제1및 제2의 부분(24a) 및 (24b)에 각각 전자 결합한다.

Description

칩형 트랜스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 일실시예를 나타내는 사시도이다.
제2도는 제1도에 나타내는 실시예의 적층체의 분해 사시도이다.
제3도는 제1도에 나타내는 실시예의 등가회로도(等價回路圖)이다.

Claims (4)

  1. 유전체기판, 전기 유전체기판의 일방 주면에 사행하여 또는 소용돌이 모양으로 형성되는 제1의 스트립라인, 전기 유전체기판의 타방 주면에 사행하여 또는 소용돌이 모양으로 형성되고, 전기 제1의 스트립라인의 일부분에 전자 결합하는 제2의 스트립라인 및 유전체기판의 타방 주면에 사행하여 또는 소용돌이 모양으로 형성되고, 전기 제1의 스트립라인의 다른 부분에 전자 결합하는 제3의 스트립라인을 포함하는 칩형 트랜스.
  2. 제1항에 있어서, 전기 제1의 스트립라인의 일부분과 전기 제2의 스트립라인과는 같은 길이로 형성되고, 또한 전기 제1의 스트립라인의 다른 부분과 전기 제3의 스트립라인과는 같은 길이로 형성되는 칩형 트랜스.
  3. 제2항에 있어서, 전기 제2의 스트립라인과 전기 제3의 스트립라인과는 같은 길이로 형성되는 칩형 트랜스.
  4. 제2항에 있어서, 전기 제2의 스트립라인과 전기 제3의 스트립라인과는 다른 길이로 형성되는 칩형 트랜스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940032896A 1993-12-17 1994-12-06 칩형트랜스 KR100309656B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5344361A JP2773617B2 (ja) 1993-12-17 1993-12-17 バルントランス
JP1993-344361 1993-12-17

Publications (2)

Publication Number Publication Date
KR950021862A true KR950021862A (ko) 1995-07-26
KR100309656B1 KR100309656B1 (ko) 2002-04-06

Family

ID=18368649

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940032896A KR100309656B1 (ko) 1993-12-17 1994-12-06 칩형트랜스

Country Status (3)

Country Link
US (1) US5497137A (ko)
JP (1) JP2773617B2 (ko)
KR (1) KR100309656B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526239B1 (ko) * 2002-09-27 2005-11-08 삼성전기주식회사 3 라인 발룬 트랜스포머

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3487461B2 (ja) * 1994-12-17 2004-01-19 ソニー株式会社 変成器及び増幅器
US5628057A (en) * 1996-03-05 1997-05-06 Motorola, Inc. Multi-port radio frequency signal transformation network
JP2990652B2 (ja) * 1996-03-22 1999-12-13 株式会社村田製作所 積層型バルントランス
US5801602A (en) * 1996-04-30 1998-09-01 3Com Corporation Isolation and signal filter transformer
US6263198B1 (en) 1996-06-14 2001-07-17 Wj Communications, Inc. Multi-layer printed wiring board having integrated broadside microwave coupled baluns
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
JPH10200360A (ja) * 1997-01-07 1998-07-31 Tdk Corp 積層バルントランス
JP3033704B2 (ja) * 1997-02-27 2000-04-17 日本電気株式会社 マイクロ波回路
JP3576754B2 (ja) * 1997-03-31 2004-10-13 日本電信電話株式会社 バラン回路及びバランス型周波数変換器
US6201439B1 (en) * 1997-09-17 2001-03-13 Matsushita Electric Industrial Co., Ltd. Power splitter/ combiner circuit, high power amplifier and balun circuit
JPH11102839A (ja) * 1997-09-26 1999-04-13 Murata Mfg Co Ltd 電子部品
US6114932A (en) * 1997-12-12 2000-09-05 Telefonaktiebolaget Lm Ericsson Inductive component and inductive component assembly
JP3307307B2 (ja) * 1997-12-19 2002-07-24 株式会社村田製作所 多層型高周波電子部品
US6252532B1 (en) 1998-02-26 2001-06-26 3Com Corporation Programmable compensation and frequency equalization for network systems
JP3706485B2 (ja) * 1998-10-29 2005-10-12 京セラ株式会社 弾性表面波装置
JP3402252B2 (ja) * 1998-12-22 2003-05-06 株式会社村田製作所 共振器、フィルタ、デュプレクサおよび通信装置
JP2000223905A (ja) * 1999-02-02 2000-08-11 Toko Inc 電子装置
EP1080530B1 (en) * 1999-03-23 2009-09-16 Nxp B.V. Assembly of an impedance transformer and a balun transformer
US6133806A (en) * 1999-03-25 2000-10-17 Industrial Technology Research Institute Miniaturized balun transformer
US6351192B1 (en) 1999-03-25 2002-02-26 Industrial Technology Research Institute Miniaturized balun transformer with a plurality of interconnecting bondwires
JP3528044B2 (ja) * 1999-04-06 2004-05-17 株式会社村田製作所 誘電体フィルタ、誘電体デュプレクサおよび通信機
US6278340B1 (en) 1999-05-11 2001-08-21 Industrial Technology Research Institute Miniaturized broadband balun transformer having broadside coupled lines
SE513470C2 (sv) * 1999-07-08 2000-09-18 Ericsson Telefon Ab L M Balunkrets
JP2001211010A (ja) * 1999-11-16 2001-08-03 Murata Mfg Co Ltd 平衡−不平衡変換回路、平衡−不平衡変換器および通信機
US6396362B1 (en) 2000-01-10 2002-05-28 International Business Machines Corporation Compact multilayer BALUN for RF integrated circuits
US6380821B1 (en) * 2000-08-24 2002-04-30 International Business Machines Corporation Substrate shielded multilayer balun transformer
US6407647B1 (en) * 2001-01-23 2002-06-18 Triquint Semiconductor, Inc. Integrated broadside coupled transmission line element
JP3800121B2 (ja) 2001-04-19 2006-07-26 株式会社村田製作所 積層型バラントランス
JP3780414B2 (ja) 2001-04-19 2006-05-31 株式会社村田製作所 積層型バラントランス
JP4783996B2 (ja) * 2001-05-02 2011-09-28 株式会社村田製作所 積層型複合バラントランス
JP2002343643A (ja) * 2001-05-18 2002-11-29 Murata Mfg Co Ltd 積層型バラントランス
US6483415B1 (en) 2001-05-21 2002-11-19 Industrial Technology Research Institute Multi-layer LC resonance balun
US6424227B1 (en) 2001-05-23 2002-07-23 National Scientific Corporation Monolithic balanced RF power amplifier
JP2003087008A (ja) 2001-07-02 2003-03-20 Ngk Insulators Ltd 積層型誘電体フィルタ
EP1412955A1 (en) * 2001-07-31 2004-04-28 Herman Allison Electromagnetic interference suppressor
CN1249848C (zh) 2001-08-03 2006-04-05 松下电器产业株式会社 复合高频组件及具有该复合高频组件的通信设备
US6970064B2 (en) * 2001-09-05 2005-11-29 Zhang Minghao Mary Center-tap transformers in integrated circuits
JP2003143033A (ja) * 2001-11-01 2003-05-16 Hitachi Metals Ltd 高周波スイッチモジュール
JP4214700B2 (ja) * 2002-01-22 2009-01-28 株式会社村田製作所 コモンモードチョークコイルアレイ
US6937128B2 (en) * 2002-02-12 2005-08-30 Broadcom Corp. On-chip inductor having a square geometry and high Q factor and method of manufacture thereof
US6806558B2 (en) 2002-04-11 2004-10-19 Triquint Semiconductor, Inc. Integrated segmented and interdigitated broadside- and edge-coupled transmission lines
US7091813B2 (en) * 2002-06-13 2006-08-15 International Business Machines Corporation Integrated circuit transformer for radio frequency applications
CN1495963A (zh) * 2002-08-30 2004-05-12 ���µ�����ҵ��ʽ���� 滤波器、高频模块、通信设备以及滤波方法
EP1416575A1 (fr) 2002-10-30 2004-05-06 STMicroelectronics S.A. Transformateur à changement de mode
US6873221B2 (en) * 2003-04-30 2005-03-29 Motorola, Inc. Multilayer balun with high process tolerance
FR2862158B1 (fr) * 2003-11-07 2006-11-17 St Microelectronics Sa Balun distribue a rapport d'impedance non unitaire
JP4678572B2 (ja) * 2004-05-20 2011-04-27 日立金属株式会社 積層型バラントランス及びそれを用いた高周波スイッチモジュール
WO2005124922A1 (fr) * 2004-06-09 2005-12-29 Thomson Licensing Dispositif de symetrisation de l’acces a une antenne
JP4834551B2 (ja) * 2004-08-27 2011-12-14 宏 畑 平面結合器を一体成形したアンテナシステム
US7068122B2 (en) * 2004-09-28 2006-06-27 Industrial Technology Research Institute Miniaturized multi-layer balun
US7570129B2 (en) * 2005-09-02 2009-08-04 Northrop Grumman Corporation 3D MMIC balun and methods of making the same
CN1983712B (zh) * 2005-12-16 2010-05-19 财团法人工业技术研究院 具滤波器功能的平衡至非平衡转换器
JP4736808B2 (ja) * 2006-01-05 2011-07-27 パナソニック株式会社 積層型バルントランスおよびこれを用いた電子機器
KR100806298B1 (ko) * 2006-04-12 2008-02-22 한국과학기술원 전송선 변압기를 이용한 전력 증폭기
WO2007138800A1 (ja) * 2006-06-01 2007-12-06 Murata Manufacturing Co., Ltd. 積層型バルントランス
JP4500840B2 (ja) 2006-12-08 2010-07-14 太陽誘電株式会社 積層型バラン及び混成集積回路モジュール並びに積層基板
US7724484B2 (en) * 2006-12-29 2010-05-25 Cobham Defense Electronic Systems Corporation Ultra broadband 10-W CW integrated limiter
US8106739B2 (en) * 2007-06-12 2012-01-31 Advanced Magnetic Solutions United Magnetic induction devices and methods for producing them
US7633353B2 (en) * 2007-10-22 2009-12-15 Advantest Corporation Balun circuit and frequency converting apparatus
TWI351784B (en) * 2008-05-29 2011-11-01 Cyntec Co Ltd Balun
CN102084439A (zh) * 2008-05-29 2011-06-01 意法爱立信有限公司 8字形射频平衡变换器
WO2010055682A1 (ja) * 2008-11-14 2010-05-20 株式会社フジクラ 樹脂多層デバイスおよびその製造方法
JP5142089B2 (ja) 2008-12-26 2013-02-13 Tdk株式会社 薄膜バラン
WO2010133969A1 (en) 2009-05-19 2010-11-25 Marvell World Trade Ltd. Circuits and methods combining signal power
US8648667B2 (en) * 2009-06-30 2014-02-11 Tdk Corporation Thin film balun
US8193781B2 (en) * 2009-09-04 2012-06-05 Apple Inc. Harnessing power through electromagnetic induction utilizing printed coils
FR2953650B1 (fr) * 2009-12-04 2012-12-14 Thales Sa Trasformateur d'impedance de puissance vhf/uhf planaire compact
DE112009005442B4 (de) 2009-12-15 2018-05-17 Snaptrack, Inc. Koppler und Verstärkeranordnung
US8653904B2 (en) 2010-06-25 2014-02-18 Tdk Corporation Thin film balun
FR2965112B1 (fr) * 2010-09-21 2013-06-07 Thales Sa Symetriseur large bande sur circuit multicouche pour antenne reseau
US9059494B2 (en) * 2013-01-18 2015-06-16 International Business Machines Corporation Marchand balun structure and design method
DE102013101768A1 (de) 2013-02-22 2014-08-28 Intel Mobile Communications GmbH Transformator und elektrische Schaltung
EP2814113B1 (en) * 2013-06-14 2019-08-07 Ampleon Netherlands B.V. Marchand balun and power amplifier using the same
CN103337682B (zh) * 2013-07-24 2015-03-25 东南大学 一种宽带、低损耗、高平衡度的片上巴伦
US9543068B2 (en) * 2014-06-17 2017-01-10 Qualcomm Technologies International, Ltd. Inductor structure and application thereof
CN104362989B (zh) * 2014-10-10 2017-09-19 中国电子科技集团公司第三十六研究所 一种传输线平衡器和功放阻抗匹配电路
US9350316B1 (en) * 2014-12-17 2016-05-24 Freescale Semiconductor, Inc. Wideband baluns and methods of their manufacture
US9691540B2 (en) 2014-12-19 2017-06-27 Mediatek Inc. Hybrid passive device and hybrid manufacturing method
US10181629B2 (en) * 2016-02-26 2019-01-15 Sumitomo Electric Industries, Ltd. Marchand balun
US20170345546A1 (en) * 2016-05-27 2017-11-30 Qualcomm Incorporated Stacked inductors
JP2018098701A (ja) * 2016-12-15 2018-06-21 Tdk株式会社 平衡不平衡変換器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002260A (en) * 1961-10-03 shortt etal
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
JPS63209203A (ja) * 1987-02-25 1988-08-30 Murata Mfg Co Ltd 位相反転器
JPS6427305A (en) * 1987-07-22 1989-01-30 Murata Manufacturing Co Lc filter
WO1989001258A1 (en) * 1987-08-03 1989-02-09 Minebea Co., Ltd. Armature coil and method of producing the same
US5039964A (en) * 1989-02-16 1991-08-13 Takeshi Ikeda Inductance and capacitance noise filter
FR2652197B1 (fr) * 1989-09-18 1992-09-18 Motorola Semiconducteurs Borde Transformateurs du type symetrique-dissymetrique perfectionnes.
FR2679374B1 (fr) * 1991-07-17 1993-12-31 Accumulateurs Fixes Et Traction Bobinage de transformateur constitue d'un ruban isolant comportant des motifs electriquement conducteurs.
JPH0574004U (ja) * 1992-03-06 1993-10-08 株式会社村田製作所 平面型平衡不平衡変換器
US5381124A (en) * 1993-12-29 1995-01-10 General Electric Company Multi-turn z-foldable secondary winding for a low-profile, conductive film transformer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526239B1 (ko) * 2002-09-27 2005-11-08 삼성전기주식회사 3 라인 발룬 트랜스포머

Also Published As

Publication number Publication date
JP2773617B2 (ja) 1998-07-09
KR100309656B1 (ko) 2002-04-06
JPH07176918A (ja) 1995-07-14
US5497137A (en) 1996-03-05

Similar Documents

Publication Publication Date Title
KR950021862A (ko) 칩형 트랜스
US6294965B1 (en) Stripline balun
US5880925A (en) Surface mount multilayer capacitor
KR950007185A (ko) 스트립라인 공진기
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR900013820A (ko) 프린트 배선기판
TW351911B (en) Laminar stackable circuit board structure with capacitor
EP0848447A3 (en) Transmission circuit using strip line in three dimensions
EP0903801A3 (en) Nonreciprocal circuit device
SE7407961L (ko)
KR930007001A (ko) 마이크로스트립 대 슬롯라인 광대역 전이 장치
KR940012709A (ko) 고주파 전송로용의 커넥터 소자
JP2840814B2 (ja) チップ型トランス
KR920015970A (ko) 복동조 회로용 프린트코일
KR930018626A (ko) 마그네트론 장치
CA2230420A1 (en) Planar dielectric integrated circuit
KR900019354A (ko) Lc 노이즈 필터
KR960701491A (ko) 마이크로파용 비가역 회로소자
KR920702563A (ko) 마이크로파 회로
KR960030104A (ko) 자기헤드장치 및 그 제조방법
JPH09306738A (ja) インダクタ素子
KR100314629B1 (ko) 전자기적 특성이 안정된 비가역회로소자
JP2005286495A (ja) 不等電力分配合成器
KR930020490A (ko) 판형 초전도체회로의 구조
JPH0396002A (ja) ストリップ線路と同軸線路との接続構造

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120821

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20130819

Year of fee payment: 13

FPAY Annual fee payment

Payment date: 20140826

Year of fee payment: 14

EXPY Expiration of term