KR950016486A - Electronic component mounting method and device - Google Patents

Electronic component mounting method and device Download PDF

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Publication number
KR950016486A
KR950016486A KR1019930024852A KR930024852A KR950016486A KR 950016486 A KR950016486 A KR 950016486A KR 1019930024852 A KR1019930024852 A KR 1019930024852A KR 930024852 A KR930024852 A KR 930024852A KR 950016486 A KR950016486 A KR 950016486A
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KR
South Korea
Prior art keywords
adsorption
data
component
correction data
position correction
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KR1019930024852A
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Korean (ko)
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KR0155748B1 (en
Inventor
성필영
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김광호
삼성전자 주식회사
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Priority to KR1019930024852A priority Critical patent/KR0155748B1/en
Publication of KR950016486A publication Critical patent/KR950016486A/en
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Publication of KR0155748B1 publication Critical patent/KR0155748B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은 전자제품의 생산공정에 사용되는 전자부품의 실장장치 및 방법에 관한 것으로, 부품공급기에 흡착위치 보정데이타를 기억시키는 흡착위치 보저데이타 기억단계와 장착된 부품공급기로부터 흡착위치 보정데이타를 독출하는 독출단계와 흡착위치 데이타와 흡착위치 보정데이타로부터 새로운 흡착위치 데이타를 산출하는 제1흡착위치 산출단계와 산출된 흡착위치 데이타에 따라 부품들을 흡착하여 실장하는 제1흡착단계와 부품흡착 동작의 량여부를 판단하는 불량판단단계와 부품흡착동작에서 불량이 발생하면 부품흡착위치 보정데이타를 입력하는 부품흡착위치 보정데이타 입력단계와 부품흡착위치 보정데이타에 따라 새로운 흡착위치 데이타를 산출하는 제2흡착위치 산출단계와 새로 산출된 흡착위치 데이타에 따라 부품을 흡착하여 실장하는 제2흡착단계와 부품흡착에 불량이 발생하지 않으면 다음 부품들을 반복적으로 흡착하여 실장하는 제3흡착단계를 구비하여 장비의 가동율을 향상시킨다.The present invention relates to a device and a method for mounting electronic components used in the production process of electronic products. The adsorption position compensation data storage step of storing the adsorption position correction data in the component feeder and the adsorption position correction data from the mounted component feeder are read. The first adsorption step and the first adsorption step for calculating the new adsorption position data from the adsorption position data and the adsorption position data and the adsorption position correction data, and the first adsorption step and the adsorption Second adsorption which calculates new adsorption position data according to the part of adsorbed position correction data inputting the part adsorbed position correction data and the part adsorbed position correction data when a defect occurs in the defect determination step of determining the quantity and the part adsorbed operation data. According to the position calculation step and the newly calculated suction position data, Zhangjiajie has a second adsorption step and a third adsorption step for repeatedly adsorbing and mounting the next parts if a defect does not occur in the parts adsorption to improve the operation rate of the equipment.

Description

전자부품 실장방법 및 장치Electronic component mounting method and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 의한 전자부품 실장방법의 개념을 개략적으로 도시한 개념도이고,3 is a conceptual diagram schematically showing a concept of an electronic component mounting method according to the present invention,

제4a,4b도는 본 발명에 의한 흡착위치 설정 및 이에 따른 기준좌표를 도시한 것이고,4a and 4b show the adsorption position setting and reference coordinates according to the present invention,

제5a,5b도는 본 발명에 의한 흡착위치 보정중심점 설정 및 이에 따른 보정좌표축을 도시한 것이고,5a and 5b show the adsorption position correction center point setting and the correction coordinate axis according to the present invention,

Claims (3)

프린트기판상에 다수의 부품공급기로부터 특정한 부품들을 흡착위치 데이타에 따라 흡착하여 실장하는 전자부품 실장장치의 실장방법에 있어서, 상기 부품공급기에 흡착위치 보정데이타를 기억시키는 흡착위치 보정데이타 기억단계; 장착된 상기 부품공급기로부터 상기 흡착위치 보정데이타를 독출하는 독출단계; 흡착위치 데이타와 상기 흡착위치 보정데이타로부터 새로운 흡착위치 데이타를 산출하는 제1흡착위치 산출단계; 상기 산출된 흡착위치 데이타에 따라 상기 부품들을 흡착하여 실장하는 제1흡착단계; 부품흡착 동작의 불량여부를 판단하는 불량판단단계; 부품흡착동작에서 불량이 발생하면 부품흡착위치 보정데이타를 입력하는 부품흡착위치 보정데이타 입력단계; 상기 부품흡착위치 보정데이타에 따라 새로운 흡착위치 데이타를 산출하는 제2흡착위치 산출단계; 새로 산출된 흡착위치 데이타에 따라 부품을 흡착하여 실장하는 제2흡착단계; 및 부품흡착에 불량이 발생하지 않으면 다음 부품들을 반복적으로 흡착하여 실장하는 제3흡착단계를 구비한 것을 특징으로 하는 전자부품 실장방법.A method of mounting an electronic component mounting apparatus for adsorbing and mounting specific components from a plurality of component supplies on a printed board according to suction position data, the method comprising: a suction position correction data storing step of storing suction position correction data in the component feeder; A reading step of reading the suction position correction data from the mounted component supplier; A first adsorption position calculation step of calculating new adsorption position data from the adsorption position data and the adsorption position correction data; A first adsorption step of adsorbing and mounting the parts according to the calculated adsorption position data; A defect determination step of determining whether or not the component adsorption operation is defective; A component adsorption position correction data input step of inputting a component adsorption position correction data when a defect occurs in the component adsorption operation; A second suction position calculation step of calculating new suction position data according to the component suction position correction data; A second adsorption step of adsorbing and mounting the component according to the newly calculated adsorption position data; And a third adsorption step of repeatedly absorbing and mounting the next parts if a defect does not occur in the parts adsorption. 프린트기판상에 특정한 부품들을 자동으로 실장하는 전자부품 실장장치에 있어서, 상기 부품들을 흡착하기 위한 흡착위치 보정데이타와 부품흡착위치 보정데이타를 입력하는 입력수단; 상기 흡착위치 보정데이타를 저장하고 상기 실장될 부품들을 담고있는 다수의 부품공급기; 상기 장치의 조립 및 조정시에 상기 흡착위치 보정데이타를 상기 부품공급기에 저장시키고, 실제 사용시에 상기 보정데이타를 상기 부품공급기에 저장시키고, 실제 사용시에 상기 부품공급기로부터 흡착위치 보정데이타를 독출하고, 상기 부품흡착위치 보정데이타를 입력하여 새로운 흡착위치 데이타를 산출하여 상기 부품들을 흡착·실장하는 부품실장장치; 및 상기 부품실장장치의 동작상태를 표시하는 모니터를 구비하는 것을 특징으로 하는 전자부품 실장장치.An electronic component mounting apparatus for automatically mounting specific components on a printed board, comprising: input means for inputting suction position correction data and component suction position correction data for attracting the components; A plurality of component feeders storing the suction position correction data and containing the components to be mounted; Storing the suction position correction data in the parts supply when assembling and adjusting the apparatus, storing the correction data in the parts supply in actual use, reading the suction position correction data from the parts supply in actual use, A component mounting apparatus which inputs the component adsorption position correction data to calculate new adsorption position data to adsorb and mount the components; And a monitor for displaying an operation state of the component mounting apparatus. 제2항에 있어서, 상기 부품실장장치는 데이타 및 프로그램을 저장하는 기억장치와, 상기 부품실장장치는데이타 및 프로그램을 저장하는 기억장치와, 상기 부품공급기를 장착하기 위한 부품공급부와, 상기 부품을 흡착하는 실장헤드와, 상기 실장헤드를 구동하는 헤드구동기와, 상기 부품공급기로 데이타를 입출력하는 입출력장치와, 상기 흡착위치 데이타, 흡착위치 보정데이타 및 부품흡착위치 보정데이타로부터 새로운 흡착위치 데이타를 산출하고 상기 실장헤드, 기억장치 및 입출력장치를 제어하는 제어기를 구비한 것을 특징으로 하는 전자부품 실장장치.The apparatus of claim 2, wherein the component mounting apparatus comprises a memory device for storing data and a program, a memory device for storing the component mounting device data and a program, a component supply unit for mounting the component supplier, and the component. Calculate new adsorption position data from the mounting head for adsorption, the head driver for driving the mounting head, the input / output device for inputting and outputting data to the parts feeder, the adsorption position data, the adsorption position correction data, and the components adsorption position correction data. And a controller for controlling the mounting head, the memory device, and the input / output device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930024852A 1993-11-20 1993-11-20 Electronic parts mounting method and its apparatus KR0155748B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930024852A KR0155748B1 (en) 1993-11-20 1993-11-20 Electronic parts mounting method and its apparatus

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Application Number Priority Date Filing Date Title
KR1019930024852A KR0155748B1 (en) 1993-11-20 1993-11-20 Electronic parts mounting method and its apparatus

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KR950016486A true KR950016486A (en) 1995-06-17
KR0155748B1 KR0155748B1 (en) 1998-12-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990044958A (en) * 1997-11-05 1999-06-25 루이스 올리비에르 Method and apparatus for mounting array of contact pins on printed circuit board
KR100260490B1 (en) * 1997-03-10 2000-07-01 윤종용 A component adhesion system and the adhesion method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050896A (en) * 2000-08-03 2002-02-15 Sony Corp Apparatus and method for correcting part grasping position

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100260490B1 (en) * 1997-03-10 2000-07-01 윤종용 A component adhesion system and the adhesion method
KR19990044958A (en) * 1997-11-05 1999-06-25 루이스 올리비에르 Method and apparatus for mounting array of contact pins on printed circuit board

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Publication number Publication date
KR0155748B1 (en) 1998-12-15

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