KR950016486A - Electronic component mounting method and device - Google Patents
Electronic component mounting method and device Download PDFInfo
- Publication number
- KR950016486A KR950016486A KR1019930024852A KR930024852A KR950016486A KR 950016486 A KR950016486 A KR 950016486A KR 1019930024852 A KR1019930024852 A KR 1019930024852A KR 930024852 A KR930024852 A KR 930024852A KR 950016486 A KR950016486 A KR 950016486A
- Authority
- KR
- South Korea
- Prior art keywords
- adsorption
- data
- component
- correction data
- position correction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
본 발명은 전자제품의 생산공정에 사용되는 전자부품의 실장장치 및 방법에 관한 것으로, 부품공급기에 흡착위치 보정데이타를 기억시키는 흡착위치 보저데이타 기억단계와 장착된 부품공급기로부터 흡착위치 보정데이타를 독출하는 독출단계와 흡착위치 데이타와 흡착위치 보정데이타로부터 새로운 흡착위치 데이타를 산출하는 제1흡착위치 산출단계와 산출된 흡착위치 데이타에 따라 부품들을 흡착하여 실장하는 제1흡착단계와 부품흡착 동작의 량여부를 판단하는 불량판단단계와 부품흡착동작에서 불량이 발생하면 부품흡착위치 보정데이타를 입력하는 부품흡착위치 보정데이타 입력단계와 부품흡착위치 보정데이타에 따라 새로운 흡착위치 데이타를 산출하는 제2흡착위치 산출단계와 새로 산출된 흡착위치 데이타에 따라 부품을 흡착하여 실장하는 제2흡착단계와 부품흡착에 불량이 발생하지 않으면 다음 부품들을 반복적으로 흡착하여 실장하는 제3흡착단계를 구비하여 장비의 가동율을 향상시킨다.The present invention relates to a device and a method for mounting electronic components used in the production process of electronic products. The adsorption position compensation data storage step of storing the adsorption position correction data in the component feeder and the adsorption position correction data from the mounted component feeder are read. The first adsorption step and the first adsorption step for calculating the new adsorption position data from the adsorption position data and the adsorption position data and the adsorption position correction data, and the first adsorption step and the adsorption Second adsorption which calculates new adsorption position data according to the part of adsorbed position correction data inputting the part adsorbed position correction data and the part adsorbed position correction data when a defect occurs in the defect determination step of determining the quantity and the part adsorbed operation data. According to the position calculation step and the newly calculated suction position data, Zhangjiajie has a second adsorption step and a third adsorption step for repeatedly adsorbing and mounting the next parts if a defect does not occur in the parts adsorption to improve the operation rate of the equipment.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명에 의한 전자부품 실장방법의 개념을 개략적으로 도시한 개념도이고,3 is a conceptual diagram schematically showing a concept of an electronic component mounting method according to the present invention,
제4a,4b도는 본 발명에 의한 흡착위치 설정 및 이에 따른 기준좌표를 도시한 것이고,4a and 4b show the adsorption position setting and reference coordinates according to the present invention,
제5a,5b도는 본 발명에 의한 흡착위치 보정중심점 설정 및 이에 따른 보정좌표축을 도시한 것이고,5a and 5b show the adsorption position correction center point setting and the correction coordinate axis according to the present invention,
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930024852A KR0155748B1 (en) | 1993-11-20 | 1993-11-20 | Electronic parts mounting method and its apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930024852A KR0155748B1 (en) | 1993-11-20 | 1993-11-20 | Electronic parts mounting method and its apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950016486A true KR950016486A (en) | 1995-06-17 |
KR0155748B1 KR0155748B1 (en) | 1998-12-15 |
Family
ID=19368606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930024852A KR0155748B1 (en) | 1993-11-20 | 1993-11-20 | Electronic parts mounting method and its apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0155748B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990044958A (en) * | 1997-11-05 | 1999-06-25 | 루이스 올리비에르 | Method and apparatus for mounting array of contact pins on printed circuit board |
KR100260490B1 (en) * | 1997-03-10 | 2000-07-01 | 윤종용 | A component adhesion system and the adhesion method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002050896A (en) * | 2000-08-03 | 2002-02-15 | Sony Corp | Apparatus and method for correcting part grasping position |
-
1993
- 1993-11-20 KR KR1019930024852A patent/KR0155748B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100260490B1 (en) * | 1997-03-10 | 2000-07-01 | 윤종용 | A component adhesion system and the adhesion method |
KR19990044958A (en) * | 1997-11-05 | 1999-06-25 | 루이스 올리비에르 | Method and apparatus for mounting array of contact pins on printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
KR0155748B1 (en) | 1998-12-15 |
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