KR950014325U - Sputtering device for semiconductor device manufacturing - Google Patents

Sputtering device for semiconductor device manufacturing

Info

Publication number
KR950014325U
KR950014325U KR2019930024187U KR930024187U KR950014325U KR 950014325 U KR950014325 U KR 950014325U KR 2019930024187 U KR2019930024187 U KR 2019930024187U KR 930024187 U KR930024187 U KR 930024187U KR 950014325 U KR950014325 U KR 950014325U
Authority
KR
South Korea
Prior art keywords
sputtering
semiconductor device
manufacturing
device manufacturing
semiconductor
Prior art date
Application number
KR2019930024187U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019930024187U priority Critical patent/KR950014325U/en
Publication of KR950014325U publication Critical patent/KR950014325U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
KR2019930024187U 1993-11-17 1993-11-17 Sputtering device for semiconductor device manufacturing KR950014325U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930024187U KR950014325U (en) 1993-11-17 1993-11-17 Sputtering device for semiconductor device manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930024187U KR950014325U (en) 1993-11-17 1993-11-17 Sputtering device for semiconductor device manufacturing

Publications (1)

Publication Number Publication Date
KR950014325U true KR950014325U (en) 1995-06-16

Family

ID=60670774

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930024187U KR950014325U (en) 1993-11-17 1993-11-17 Sputtering device for semiconductor device manufacturing

Country Status (1)

Country Link
KR (1) KR950014325U (en)

Similar Documents

Publication Publication Date Title
DE69328743D1 (en) Semiconductor device
DE69334253D1 (en) Semiconductor device
DE69325951D1 (en) Semiconductor device
DE69400694D1 (en) Semiconductor device
DE69433543D1 (en) SEMICONDUCTOR DEVICE.
DE69414277D1 (en) Semiconductor wafer cassette
FI945204A0 (en) semiconductor component
DE69424477D1 (en) Ceramic semiconductor device
KR950002227U (en) Sputtering device for semiconductor device manufacturing
DE4496282T1 (en) Semiconductor device
DE69431782D1 (en) Programmable semiconductor device
DE69429567D1 (en) Non-volatile semiconductor device
NO954863D0 (en) Semiconductor device
DE69325181D1 (en) SEMICONDUCTOR DEVICE
DE69432168D1 (en) Semiconductor packages
KR950014325U (en) Sputtering device for semiconductor device manufacturing
KR950021374U (en) Sputtering Device for Semiconductor Manufacturing
KR950021363U (en) Wafer bonding device
KR970046687U (en) Sputtering device for semiconductor device manufacturing
KR970046686U (en) Sputtering device for semiconductor device manufacturing
KR950010175U (en) Sputtering equipment for semiconductor manufacturing
KR980005325U (en) Sputtering device for semiconductor device manufacturing
KR970046639U (en) Metal sputtering device for semiconductor device manufacturing
KR950021398U (en) Coating device for semiconductor device manufacturing
KR940021348U (en) Semiconductor device

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid