KR950021363U - Wafer bonding device - Google Patents

Wafer bonding device

Info

Publication number
KR950021363U
KR950021363U KR2019930026350U KR930026350U KR950021363U KR 950021363 U KR950021363 U KR 950021363U KR 2019930026350 U KR2019930026350 U KR 2019930026350U KR 930026350 U KR930026350 U KR 930026350U KR 950021363 U KR950021363 U KR 950021363U
Authority
KR
South Korea
Prior art keywords
wafer bonding
bonding device
wafer
bonding
Prior art date
Application number
KR2019930026350U
Other languages
Korean (ko)
Other versions
KR0108386Y1 (en
Inventor
박규찬
이병훈
이경욱
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR2019930026350U priority Critical patent/KR0108386Y1/en
Publication of KR950021363U publication Critical patent/KR950021363U/en
Application granted granted Critical
Publication of KR0108386Y1 publication Critical patent/KR0108386Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
KR2019930026350U 1993-12-04 1993-12-04 Wafer bonding machine KR0108386Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930026350U KR0108386Y1 (en) 1993-12-04 1993-12-04 Wafer bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930026350U KR0108386Y1 (en) 1993-12-04 1993-12-04 Wafer bonding machine

Publications (2)

Publication Number Publication Date
KR950021363U true KR950021363U (en) 1995-07-28
KR0108386Y1 KR0108386Y1 (en) 1997-10-21

Family

ID=19369802

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930026350U KR0108386Y1 (en) 1993-12-04 1993-12-04 Wafer bonding machine

Country Status (1)

Country Link
KR (1) KR0108386Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101256711B1 (en) * 2004-01-07 2013-04-19 가부시키가이샤 니콘 Stacked device and method for stacking integrated circuit devices
KR20220093307A (en) * 2019-05-24 2022-07-05 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Systems and methods for wafer bond monitoring

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101256711B1 (en) * 2004-01-07 2013-04-19 가부시키가이샤 니콘 Stacked device and method for stacking integrated circuit devices
KR20220093307A (en) * 2019-05-24 2022-07-05 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Systems and methods for wafer bond monitoring
US11815471B2 (en) 2019-05-24 2023-11-14 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer bond monitoring

Also Published As

Publication number Publication date
KR0108386Y1 (en) 1997-10-21

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Legal Events

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
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Payment date: 20060728

Year of fee payment: 10

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