KR950005952B1 - Electricity conductor - Google Patents

Electricity conductor Download PDF

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KR950005952B1
KR950005952B1 KR1019930017143A KR930017143A KR950005952B1 KR 950005952 B1 KR950005952 B1 KR 950005952B1 KR 1019930017143 A KR1019930017143 A KR 1019930017143A KR 930017143 A KR930017143 A KR 930017143A KR 950005952 B1 KR950005952 B1 KR 950005952B1
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powder particles
compounds
embedded
tungsten
copper alloy
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KR1019930017143A
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KR950006004A (en
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김창주
오충섭
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한국기계연구원
서상기
영일특수금속주식회사
오충섭
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The conducting material improves the durability of electrodes of resistance welder and spot welder by spraying metal, alloy, or ceramic powders. The powder includes silicon dioxide, tungsten, alumina terroaluminum, tungsten compound, molybden, titanium, chromium, and chrominum compound of high melting point and high hardness.

Description

순금속, 합금 및 화합물의 단독 또는 복합 분말입자를 표면 접촉면에 박은 도전재료Conductive material embedding pure or composite powders of pure metals, alloys and compounds on surface contact surfaces

제1도는 규사(SiO2) 분말입자가 동 합금재 표면의 전자현미경 사진 예(X 1500).FIG. 1 shows an example of an electron micrograph of a surface of a copper alloy material of silica sand (SiO 2 ) powder particles (X 1500).

제2도는 규사(SiO2) 분말입자가 박힌 동 합금재 표면의 성분분석 예(전자현미경에 의한 EPMA 분석).2 is an example of the component analysis of the surface of the copper alloy material embedded with silica (SiO 2 ) powder particles (EPMA analysis by electron microscope).

제3도는 텅그스텐(W) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진 예(X 1500).3 shows an electron micrograph (X 1500) of the surface of a copper alloy material embedded with tungsten (W) powder particles.

제4도는 텅그스텐(W) 분말입자가 박힌 동 합금재 표면의 성분분석 예(전자현미경에 의한 EPMA 분석).4 is a component analysis example of the surface of the copper alloy material embedded with tungsten (W) powder particles (EPMA analysis by electron microscope).

제5도는 알루미나(Al2O3) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진 예(X 1,500).5 is an electron micrograph (X 1500) of the surface of the copper alloy material embedded with alumina (Al 2 O 3 ) powder particles.

제6도는 알루미나(Al2O3) 분말입자가 박힌 동 합금재 표면의 성분분석 예(전자현미경에 의한 EPMA 분석).6 is an example of component analysis of the surface of the copper alloy material embedded with alumina (Al 2 O 3 ) powder particles (EPMA analysis by electron microscope).

제7도는 알루미늄철(FeAl) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진 예(X 1,500).7 shows an electron micrograph (X 1,500) of the surface of a copper alloy material embedded with aluminum iron (FeAl) powder particles.

제8도는 알루미늄철(FeAl) 분말입자가 박힌 동 합금재 표면의 성분분석 예(전자현미경에 의한 EPMA 분석).8 is an example of component analysis (EPMA analysis by electron microscope) on the surface of copper alloy material embedded with aluminum iron (FeAl) powder particles.

본 발명은 순금속, 합금 및 화합물 등의 단독 또는 혼합된 복합 분말입자를 접점의 접촉부 표면에 박은 도전재료에 관한 것이다. 예를들어 저항용접기나 스포트 용접기의 전극과 같이 대전류와 높은 가압력이 걸리는 접점 부품의 접촉부 표면은 높은 도전률(전기전도도)과 함께 높은 경도를 함께 유지하여야 접촉 중에 발생하는 발열상황에 대해서도 가능상의 효과와 아울러 내마모성에 따른 장시간 내구성을 갖는다.The present invention relates to a conductive material in which single or mixed composite powder particles such as pure metals, alloys, and compounds are embedded on the contact surface of a contact. For example, contact surfaces of contact parts that are subjected to high current and high pressing force, such as electrodes of resistance welders or spot welders, must maintain high hardness together with high conductivity (electrical conductivity). And also has a long time durability according to the wear resistance.

그러나 금속재료 자체로써 특성을 개선하기 위하여 합금을 하거나, 화합물의 상태로써, 제조하는 경우에 재료가 나타나는 특성인 경도와 도전률을 서로 상반되는 경향을 보여 만족한 수준의 경도와 도전률을 얻기는 매우 어렵다.However, in order to improve the properties of the metal material itself or alloys, or as a state of the compound, the hardness and conductivity, which are characteristics of the material appearing when the material is produced, tend to be opposite to each other to obtain a satisfactory level of hardness and conductivity. Very difficult.

이에 본 발명에서는 기존의 저항용접기나 스포트 용접기의 전극재로 사용하는 크롬동(Cu-Cr) 합금재 전극을 한가지 예의 대상으로 적용하였다. 이는 일반 전기용 접점에 비해 대전류와 높은 가압력 하에서 빠른 속도로 반복 접촉작용하는 가혹한 상태이므로 수명평가에 긴 시간을 요하지 않는 장점이 있기 때문이다. 여기서 높은 경도와 높은 융점을 갖으므로 고온에서도 안정한 특성을 유지할 수 있는 물질은 규사(SiO2), 텅그스텐(W), 알루미나(Al2O3) 및 알루미늄철(FeAl)등의 분말입자이다. 샌드 블라스트(Sand Blast)에서 적용하는 것과 같이, 압축공기의 분사에 의해 이들의 분말을 전극 접점부 표면에 박아 재료자체는 변화하지 않았으므로 높은 도전률을 그대로 유지하며, 접점부 만이 박힌 분말입자들에 의해 내마모성이 개선되었다.Accordingly, in the present invention, a chromium copper (Cu-Cr) alloy electrode used as an electrode material of a conventional resistance welding machine or a spot welding machine is applied as an example. This is because it has the advantage that it does not require a long time for life evaluation because it is a harsh state of repeated contact at high speed under high current and high pressing force compared to general electrical contacts. Here, materials having high hardness and high melting point and capable of maintaining stable properties even at high temperatures are powder particles such as silica sand (SiO 2 ), tungsten (W), alumina (Al 2 O 3 ), and aluminum iron (FeAl). As applied in sand blast, the powder is embedded in the surface of the electrode contact portion by the injection of compressed air, so that the material itself is not changed, thus maintaining high conductivity, and powder particles embedded only in the contact portion Abrasion resistance was improved by.

이상의 발명개요에 대하여 실시예에 따른 각각의 내용을 상세히 설명하면 다음과 같다.Hereinafter, the respective contents according to the embodiments will be described in detail with reference to the present invention.

본 발명에서 시험한 동 합금재를 대상으로 규사(SiO2), 텅그스텐(W), 알루미나(Al2O3)등의 분말입자를 공압분사에 의해 표면에 박고, 이를 주사전자현미경에 의해 관찰한 것과 표면의 성분을 분석한 결과는 도면과 같다.Powder particles such as silica sand (SiO 2 ), tungsten (W), alumina (Al 2 O 3 ), etc. were put on the surface by pneumatic injection and observed by scanning electron microscope in the copper alloy material tested in the present invention. The results of the analysis of the surface components were as shown in the drawing.

제1도는 규사(SiO2) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진예로서 규사(SiO2), 분말입자의 고압투사로 표면은 거칠게 패였으며 화살표에서와 같이 규사(SiO2)의 입자가 박혀 있음을 볼 수 있다. 제2도는 규사(SiO2) 분말입자가 박힌 동 합금재 표면의 성분분석 예로서 기지의 합금원소인 동(Cu)과 크롬(Cr)외에 분말입자가 원소인 규소(Si)와 산소(O)가 화살표에서와 같이 검출되고 있다.1 is an electron micrograph of the surface of the copper alloy material embedded with silica (SiO 2 ) powder particles. The surface of the silica alloy (SiO 2 ) and the powder particles are roughly sloping and the surface of the silica sand (SiO 2 ) particles is as shown in the arrow. You can see that it is stuck. 2 is a component analysis of the surface of a copper alloy material embedded with silica (SiO 2 ) powder particles. Examples are silicon (Si) and oxygen (O), in which powder particles are elements other than the known alloy elements copper (Cu) and chromium (Cr). Is detected as in the arrow.

제3도는 텅그스텐(W) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진 예로서 텅그스텐(W) 분말입자의 고압투사로 표면은 거칠게 패였으며 화살표에서와 같이 텅그스텐(W)의 입자가 박혀 있음을 볼 수 있다.3 is an electron micrograph of the surface of the copper alloy material embedded with tungsten (W) powder particles. For example, the surface of the tungsten (W) powder was roughened by high pressure projection. You can see it stuck.

제4도는 텅그스텐(W) 분말입자가 박힌 동 합금재 표면의 성분분석예로서 기지의 합금원소인 동(Cu)과 크롬(Cr)외에 분말입자의 원소인 텅그스텐(W)이 화살표에서와 같이 검출되고 있다.4 is an example of the analysis of the surface of the copper alloy material embedded with tungsten (W) powder particles, tungsten (W) as an element of the powder particles in addition to the known alloying elements copper (Cu) and chromium (Cr) as shown in the arrow It is detected together.

제5도는 알루미나(Al2O3) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진예로서 알루미나(Al2O3) 분말입자의 고압투사로 표면은 거칠게 패였으며 화살표에서와 같이 알루미나(Al2O3)의 입자가 박혀 있음을 볼 수 있다.The fifth turn of alumina (Al 2 O 3) to the high-pressure projection of alumina as an electron micrograph example of the copper alloy material surface studded the powder (Al 2 O 3) powder particle surface is roughened was L of alumina, as shown in an arrow (Al 2 It can be seen that particles of O 3 ) are embedded.

제6도는 알루미나(Al2O3) 분말입자가 박은 동 합금재 표면의 성분분석예로서 기지의 합금원소인 동(Cu)과 크롬(Cr) 외에 분말입자의 원소인 알루미늄(Al)과 산소(O)가 화살표에서와 같이 검출되고 있다.6 is an example of the analysis of the surface of the copper alloy material embedded with alumina (Al 2 O 3 ) powder particles, aluminum (Al) and oxygen (elements of the powder particles other than the known alloying elements copper (Cu) and chromium (Cr)) O) is detected as in the arrow.

제7도는 알루미늄철(FeAl) 분말입자가 박힌 동 합금재 표면의 전자현미경 사진 예로서 알루미늄철(FeAl) 분말입자의 고압투사로 표면은 거칠게 패였으며 화살표에서와 같이 알루미늄철(FeAl)의 입자가 박혀 있음을 볼 수 있다.7 is an electron micrograph of the surface of copper alloy embedded with aluminum iron (FeAl) powder particles. For example, the surface of the aluminum alloy (FeAl) particles was roughened by high pressure projection. You can see it stuck.

제8도는 알루미늄철(FeAl) 분말입자가 박힌 동 합금재 표면의 성분분석예로서 기지의 합금원소인 동(Cu)과 크롬(Cr)외에 분말입자의 원소인 알루미늄(Al)과 철(Fe)등의 화살표에서와 같이 검출되고 있다.8 is an example of the component analysis of the surface of copper alloy material embedded with aluminum iron (FeAl) powder particles. In addition to the known alloying elements copper (Cu) and chromium (Cr), aluminum (Al) and iron (Fe) are elements of powder particles. It is detected as in the arrow of the back.

다음의 표 1과 표 2는 접점의 수명시험을 짧은 시간에 평가하기 위하여 가혹한 상태인 9,000∼13,000 암페어의 대 전류와, 350㎏/㎠의 높은 가압력하에서 15㎐의 접촉속도로, 전극의 접점 사이에 각각 0.8㎜ 두께의 유기피막 강판과 아연도금 강판을 두장씩 끼우고, 접촉시험한 결과의 예이다.Tables 1 and 2 below show the contact between the contacts of the electrodes at a contact speed of 15 kW under a high current of 9,000 to 13,000 amperes and a high pressing force of 350 kg / cm 2, in order to evaluate the life test of the contacts in a short time. This is an example of the results of a contact test with two sheets of 0.8 mm thick organic coated steel sheet and two galvanized steel sheets.

여기서 보면, 반복 통전 후 두장의 강판이 용접되어 붙은 직경의 크기가 점차 작아지고 있으며, 그 유효 직경의 크기를 약 ø3.8㎜로 하였을때, 유기피막 강판에 대하여 발명품의 경우는 400∼500회의 접촉횟수를 나타내고 있으나, 박음처리하지 않는 경우는 350회 정도로 낮아 박음처리의 효과를 확인할 수 있다. 그리고 아연도금 강판에 대한 시험결과에서는 전자의 경우에 1,200회에 이르나 후자의 경우는 600회 정도로 낮아 역시 박음처리의 효과를 확인할 수 있다.In this case, the diameter of the two steel sheets welded to each other gradually decreases after repeated energization. When the effective diameter is about ø3.8 mm, 400 to 500 times in the case of the invention for an organic coated steel sheet Although the number of contact is shown, the case of not sewage treatment can be confirmed as low as 350 times. In the test results for the galvanized steel sheet, the former reaches 1,200 times, but the latter case is about 600 times, which can confirm the effect of the sewage treatment.

[표 1a]TABLE 1a

[유기피막 강판에 대한 스포트 용접시험 결과][Spot Welding Test Results for Organic Coating Steel Sheet]

[표 2a]TABLE 2a

[아연도금 강판에 대한 스포트 용접시험 결과][Spot Welding Test Result on Zinc Plated Steel Sheet]

[표 2b]TABLE 2b

Claims (2)

전기 전자용 접점 및 전극 등의 재료나 부품의 내구성 향상을 위해 그 표면에 각종 고융점이나 고경도를 갖는 순금속, 합금 및 안정화합물 등의 분발입자를 100㎛이하로 하여 단독 또는 복합물로서 투사나 압입에 의해 재료나 부품의 표면에 박아 활용하는 것을 특징으로 하는 순금속, 합금 및 화합물의 단독 또는 복합 분말입자를 표면 접촉면에 박은 도전재료.In order to improve durability of materials and components such as contacts and electrodes for electric and electronic parts, powders such as pure metals, alloys, and stable compounds having various high melting points or hardnesses on the surface thereof should be 100 µm or less, or projected or pressed as a composite. A conductive material in which single or composite powder particles of pure metals, alloys, and compounds are embedded in a surface contact surface by being embedded in a surface of a material or a component. 제1항에 있어서, 분말은 규사, 알루미나, 텅그스텐 및 텅그스텐 화합물, 몰리브덴 및 몰리브덴화합물, 티탄 및 티탄화합물, 크롬 및 크롬화합물 등의 각종 고융점, 고경도의 순금속, 합금 및 화합물의 단독 및 복합분말임을 특징으로 하는 순금속, 합금 및 화합물의 단독 또는 복합 분말입자를 표면 접촉면에 박은 도전재료.2. The powder according to claim 1, wherein the powder is made of silica, alumina, tungsten and tungsten compounds, molybdenum and molybdenum compounds, titanium and titanium compounds, chromium and chromium compounds, etc. A conductive material in which single or composite powder particles of pure metals, alloys and compounds are embedded on a surface contact surface, which is a composite powder.
KR1019930017143A 1993-08-31 1993-08-31 Electricity conductor KR950005952B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100699428B1 (en) * 2005-09-28 2007-03-26 전자부품연구원 Method Of Forming Conductive Paticle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100699428B1 (en) * 2005-09-28 2007-03-26 전자부품연구원 Method Of Forming Conductive Paticle

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