KR940004952Y1 - Jig for laser diode mirror coating - Google Patents
Jig for laser diode mirror coating Download PDFInfo
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- KR940004952Y1 KR940004952Y1 KR2019910015979U KR910015979U KR940004952Y1 KR 940004952 Y1 KR940004952 Y1 KR 940004952Y1 KR 2019910015979 U KR2019910015979 U KR 2019910015979U KR 910015979 U KR910015979 U KR 910015979U KR 940004952 Y1 KR940004952 Y1 KR 940004952Y1
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- support
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- laser diode
- guide
- length
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래 레이저 다이오드 미러 코팅용 지그의 분해사시도.1 is an exploded perspective view of a jig for a conventional laser diode mirror coating.
제2도는 본 고안의 분해사시도.2 is an exploded perspective view of the present invention.
제3a도는 본 고안의 사용상태를 보인 단면도, 제3b도는 본 고안의 다른실시예를 보인 단면도이다.Figure 3a is a cross-sectional view showing a state of use of the present invention, Figure 3b is a cross-sectional view showing another embodiment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
3 : 좌우조정부 4 : 고정부3: left and right adjustment part 4: fixed part
5 : 가이드부 6 : 지지부5: guide part 6: support part
11, 30 : 지지간 12 : 수직간11, 30: support side 12: vertical side
12a : 안착홈 13 : 볼트12a: seating groove 13: bolt
14 : 고정대 14a : 돌출부14: holder 14a: protrusion
15 : 보조고정대 20 : 칩바15: auxiliary station 20: chip bar
31 : 조정간 31a : 결합공31: between adjustment 31a: coupling hole
32 : 요홈 33 : 삽입구32: groove 33: insertion hole
40 : 볼트공 41 : 조임부재40: bolt hole 41: tightening member
50 : 연결공 51 : 돌기50: connector 51: protrusion
51a : 가이드홈 52 : 가이드편51a: Guide groove 52: Guide piece
60 : 지지판 61 : 지지편60: support plate 61: support piece
본 고안은 길이조절을 할수있는 레이저 다이오드 미러 코팅용 지그에 관한 것으로, 특히, 레이저 다이오드의 길이 및 수량의 차이에 관계없이 사용할수 있는 길이 조절을 할수있는 레이저 다이오드 미러 코팅용 지그에 관한 것이다.The present invention relates to a jig for laser diode mirror coating that can be adjusted in length, and more particularly, to a jig for laser diode mirror coating that can adjust the length can be used irrespective of the difference in length and quantity of the laser diode.
일반적으로, 레이저 다이오드의 제작공정중 하나인 미러코팅(Mirror Coating)공정은, 칩이 여럿 연이어 형성되어 있는 칩바의 미러(Mirror)면을 보호 및 반사율을 조절목적으로 하는 공정이며, 칩바의 코팅작업시에는 별도의 코팅용 지고에 칩바을 다수 적층시킨후 동시에 코팅을 행하던 바는 주지와 같다.In general, the mirror coating process, which is one of the manufacturing processes of a laser diode, is a process for controlling the mirror surface of a chip bar in which several chips are formed in succession and controlling the reflectance. In the city, it is known that the coating was performed at the same time after stacking a plurality of chip bars on separate coating jigo.
일반적으로 이러한 레이저 다이오드의 미러 코팅시 사용하는 지그는 제1도와 같은 것으로, 지지간(11)과, 지지간(11) 양단에는 칩바(20)가 다수 적충되는 안착홈(12a)이 내측으로 절곡 형성되며 수직설치된 수직간(12)과, 안착홈(12a)에 삽입을 도모하는 돌출부(14a)가 형성되며 적층된 칩바(20)를 상측에서 하향압지하에 수직간(12)에 형성된 볼트(13)로서 고정하는 고정대(14)와, 칩바(20)의 수량이 적을때 보조사용하는 보조고정대(15)로 구성된다.In general, the jig used for mirror coating of such a laser diode is the same as that of FIG. 1, and the support groove 11 and the mounting groove 12a in which the chip bars 20 are stacked on both ends of the support shaft 11 are bent inwardly. And a vertical portion 12 formed vertically, and a protrusion portion 14a for inserting into the seating groove 12a, and the stacked chip bars 20 formed on the vertical portion 12 under downward pressure from the upper side. 13) and a fixing stand 14 for fixing, and an auxiliary fixing stand 15 for auxiliary use when the quantity of the chip bars 20 is small.
이와같은 구성의 종래 레이저 다이오드의 미러 코팅용 지그는 수지간(12)의 안착홈(12a)에 다수의 칩바(20)를 고정시킨후 코팅공정을 행함은 주지와 같다.The mirror coating jig of a conventional laser diode having such a configuration is known to perform a coating process after fixing a plurality of chip bars 20 in the mounting groove 12a of the resin intervening 12.
그러나 도시와 같이 칩바(20)가 적층되는 안착홈(12a)이 형성된 수직간(12)은 지지간(11)에 고정설치되어 있으므로 칩바(20)의 길이가 수직간(12)의 대향하는 안착홈(12a)의 폭보다 짧을 경우에는 종래의 지그를 사용하에 칩바(20)의 미러 코팅작업은 블가능하였고, 반면 칩바(20)의 길이가 지그보다 길경우에는 칩바(20)의 길이를 수직간(12)에 형성된 안착홈(12a)의 폭과 맞게 잘라내야 하는 낭비를 초래하였다.However, as shown in the figure, the vertical grooves 12 having the mounting grooves 12a on which the chip bars 20 are stacked are fixed to the support rods 11, so that the lengths of the chip bars 20 are opposite to the vertical rods 12. When the width of the groove 12a is shorter, mirror coating of the chip bar 20 is possible using a conventional jig, whereas when the length of the chip bar 20 is longer than the jig, the length of the chip bar 20 is vertical. It caused waste to be cut out to match the width of the seating groove 12a formed in the liver 12.
이에 국한되지 않고 칩바(20)의 수량이 일정하지 않을 경우, 즉, 지그 상측에 고정대(14)와 보조공정대(15)를 각각 설치한 상태에서 적충된 칩바(20)의 높이가 보조고정대(15)하면의 높이보다 낮을 경우에는 재차 보조고정대(15)를 크기에 맞춰 별도로 제작사용해야 하는 등 사용에 여려가지 제한이 뒤따랐으며 이는 칩바(20)의 수량이 바뀔때마다 또다른 보조고정대(15)를 제작해야 하는 문제점을 유발하였다.If not limited to this and the quantity of the chip bar 20 is not constant, that is, the height of the chip bar 20 is loaded in the state in which the fixing table 14 and the auxiliary process table 15 is respectively installed on the upper side of the jig is the secondary fixing table ( 15) If it is lower than the height of the lower surface was accompanied by a number of limitations, such as the need to manufacture and use the auxiliary fixing stand (15) again according to the size, which is another auxiliary fixing (15) each time the quantity of the chip bar (20) changes ) Caused a problem to be produced.
본 고안은 상기와 같은 문제점을 해결하기 위한 것으로, 칩바의 길이와 수량에 관계없이 적절히 대응하여 사용하는 길이조절을 할수 있는 레이저 다이오드의 미러 코팅용 지그를 제공함에 있다.The present invention is to solve the above problems, to provide a jig for the mirror coating of the laser diode that can adjust the length to use appropriately regardless of the length and quantity of the chip bar.
이하에서 상기 목적을 달성하는 본 고안의 바람직한 실시예를 첨부도면에 의거 상세히 설명한다.Hereinafter, preferred embodiments of the present invention for achieving the above object will be described in detail with reference to the accompanying drawings.
본 고안 길이조절을 할수있는 레이저 다이오드 미러 코팅용 지그는 제2도와 같이, 사각형상의 지지간(30)에 수직설치되며, 칩바의 길이에 따라 좌우이동시키며 길이조절을 하는 대향설치된 한쌍의 좌우 조정부(3)와, 좌우조정부(3) 하측에 설치되어 좌우조정부(3)의 유동을 방지하는 고정부(4)와, 좌우고정부(3) 상측에 설치되어 적층된 칩바를 지지안내하는 가이드부(5)와, 가이드부(5)에 안착지지되며, 적층된 칩바의 상면을 압지하며 칩바의 수량에 따라 조절사용하는 한쌍의 지지부(6)로 구성된다.The designed jig for laser diode mirror coating which can adjust the length of the present invention is vertically installed at the support bar 30 in a rectangular shape as shown in FIG. 2, and moves to the left and right according to the length of the chip bar. ), A fixing part 4 installed below the left and right adjusting part 3 to prevent the flow of the left and right adjusting part 3, and a guide part 5 installed and supported on the left and right fixing parts 3 to guide the stacked chip bars. ), And is supported by the guide portion (5), and consists of a pair of support portions (6) for holding the upper surface of the stacked chip bars and adjusting the number of chip bars.
좌우조정부(3)는 지지간(30)에 삽입 수직설치되며, 칩바(20)의 균일한 적층을 도모하는 요홈(32)이 하향형성된 한쌍의 조정간(31)과, 요홈(32) 상측에 연동설치되어 가이드부(5)와의 결합을 도모하는 결합공(31a)과, 조정간(31) 하측에 형성되며 지지간(30)과의 삽입 및 좌우 이동을 지지하는 삽입구(33)로 구성된다.The left and right adjustment unit 3 is vertically inserted into the support section 30, and interlocks with the pair of adjustment sections 31 in which the grooves 32 for downwardly forming the grooves 32 for uniform stacking of the chip bars 20 and the grooves 32. It is composed of a coupling hole (31a) that is provided to plan the engagement with the guide portion (5), and the insertion hole (33) formed in the lower side between the adjustment section 31 and supports the insertion and left and right movement with the support section (30).
고정부(4)는 조정간(31)에 형성된 삽입구(33) 하단면에 형성된 불트공(40)을 통하여 지지간(30)에 삽입된 조정간(31)의 유동을 조임력에 의해 견고히 지지하는 조임부재(41)로 구성된다.The fastening member 4 is a fastening member that firmly supports the flow of the adjustment section 31 inserted into the support section 30 by the tightening force through the bull hole 40 formed in the lower surface of the insertion hole 33 formed in the adjustment section 31. It consists of 41.
가이드부(5)는 조정간(31)의 요홈(32) 상측에 설치되며, 요홈(32)과의 삽입을 도모하는 연결공(50)이 형성된 돌기(51)와, 전방으로 연장 절곡형성되어 지지부(6)의 안내를 도모하는 가이드홈(51a)이 구비된 가이드편(52)으로 구성된다.The guide part 5 is installed above the groove 32 of the adjustment section 31, and has a protrusion 51 formed with a connection hole 50 for insertion with the groove 32, and is bent forwardly to form a support part. It consists of the guide piece 52 provided with the guide groove 51a which guides the guide of (6).
지지부(6)는 가이드부(5)에 삽입설치되며 적층된 칩바(20)의 수량에 따라 선택적으로 사용되는 판상의 지지판(60)과 지지편(61)으로 구성된다.The support part 6 is inserted into the guide part 5 and consists of a plate-shaped support plate 60 and a support piece 61 which are selectively used according to the number of stacked chip bars 20.
도면중 미설명 부호 53은 가이드부를 결합 지지하기 위한 볼트이다.Reference numeral 53 in the figure is a bolt for engaging and supporting the guide portion.
이와같이 구성된 본 고안에서는 최초 가이드부(5)가 분리된 상태에서 고정간(31)의 요홈(32)에 칩바(20)를 적층시킨 후 가이드부(5)를 요홈(32)에 삽입 조정간(31)의 결합공(31a)과 가이드부(5)의 연결공(50)을 통하여 상호 체결부재로서 체결사용하는 것이다.In the present invention configured as described above, the chip bar 20 is stacked in the groove 32 of the fixed section 31 in the state where the first guide portion 5 is separated, and then the guide section 5 is inserted into the groove 32. Through the coupling hole 31a of the coupling hole and the connecting hole 50 of the guide portion 5) to be used as a fastening member to each other.
그러나 본 고안은 칩바(20)의 길이가 길거나 혹은 짧은 경우에는 조정간(31) 하측의 조임부재(41)를 해지시킨 후 조정간(31)의 폭을 칩바(20)의 길이에 맞춰 좌우 이동시켜 조정후 조임부재(41)를 결합사용한다.However, in the present invention, if the length of the chip bar 20 is long or short, after adjusting the lowering of the fastening member 41 at the lower side of the adjusting section 31, the width of the adjusting section 31 is moved to the length of the chip bar 20 and then adjusted. The fastening member 41 is used in combination.
또한, 칩바(20)의 적층된 수량이 많거나 적을 경우는 가이드부(5)의 가이드홈(51a)을 통하여 판상의 지지판(60)이나 지지편(61)을 삽입시킨후 상기와 같이 사용하는 것이다(제3a도,제3b도 참조).In addition, when the stacked quantity of the chip bar 20 is large or small, the plate-like support plate 60 or the support piece 61 is inserted through the guide groove 51a of the guide part 5, and then used as described above. (See FIGS. 3a and 3b).
이와같은 본 고안은, 종래 임의로 길이조절을 할수 없었던 레이저 다이오드의 미러 코팅용지그의 구조에 기인한 칩바(20)의 길이가 안착홈(12a)의 폭보다 짧을 경우 발생한 미러코팅의 불가능 및 칩바(20)의 길이가 안착홈(12a)의 폭보다 길경우 칩바(20)의 길이를 안착홈(12a)의 폭에 맞추어 잘라내야 하는 문제점은 적극적으로 방지될 뿐만아니라 칩바(20)의 수량 다소에 따라서 별도의 보조고정대(15)를 필요시마다 제작해야 했던 낭비또한 적극적으로 해결된다.The present invention, as described above, is impossible to mirror coating and chip bar 20 generated when the length of the chip bar 20 due to the structure of the mirror coating jig of the laser diode, which cannot be arbitrarily arbitrarily adjusted in length, is shorter than the width of the mounting groove 12a. If the length of) is longer than the width of the seating groove 12a, the problem of cutting the length of the chip bar 20 to the width of the seating groove 12a is not only actively prevented, but also depending on the quantity of the chip bar 20. Waste that had to be produced each time a separate auxiliary fixture 15 is also actively resolved.
이와같이 본 고안은 레이저 다이오드의 미러 코팅시 칩바의 길이와 수량의 차이에 관계없이 적절히 대응하며 사용할수 있는 등의 여려가지 잇점이 있다.As such, the present invention has several advantages, such as being able to respond appropriately regardless of the difference in the length and quantity of the chip bar when mirror coating the laser diode.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910015979U KR940004952Y1 (en) | 1991-09-30 | 1991-09-30 | Jig for laser diode mirror coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910015979U KR940004952Y1 (en) | 1991-09-30 | 1991-09-30 | Jig for laser diode mirror coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930007567U KR930007567U (en) | 1993-04-26 |
| KR940004952Y1 true KR940004952Y1 (en) | 1994-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910015979U KR940004952Y1 (en) | 1991-09-30 | 1991-09-30 | Jig for laser diode mirror coating |
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| KR (1) | KR940004952Y1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040041261A (en) * | 2002-11-09 | 2004-05-17 | 엘지전자 주식회사 | Method for depositing reflection layer on the facet of semiconductor laser diode chip bar |
| WO2008154582A2 (en) * | 2007-06-11 | 2008-12-18 | Vertical Circuits, Inc. | Semiconductor die coating and interconnection fixture and method |
| WO2008154580A2 (en) * | 2007-06-11 | 2008-12-18 | Vertical Circuits, Inc. | Method for optimized integrated circuit chip interconnection |
| US9666513B2 (en) | 2015-07-17 | 2017-05-30 | Invensas Corporation | Wafer-level flipped die stacks with leadframes or metal foil interconnects |
| US9728524B1 (en) | 2016-06-30 | 2017-08-08 | Invensas Corporation | Enhanced density assembly having microelectronic packages mounted at substantial angle to board |
| US9825002B2 (en) | 2015-07-17 | 2017-11-21 | Invensas Corporation | Flipped die stack |
| US9824999B2 (en) | 2007-09-10 | 2017-11-21 | Invensas Corporation | Semiconductor die mount by conformal die coating |
| US9859257B2 (en) | 2015-12-16 | 2018-01-02 | Invensas Corporation | Flipped die stacks with multiple rows of leadframe interconnects |
| US9871019B2 (en) | 2015-07-17 | 2018-01-16 | Invensas Corporation | Flipped die stack assemblies with leadframe interconnects |
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-
1991
- 1991-09-30 KR KR2019910015979U patent/KR940004952Y1/en not_active IP Right Cessation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040041261A (en) * | 2002-11-09 | 2004-05-17 | 엘지전자 주식회사 | Method for depositing reflection layer on the facet of semiconductor laser diode chip bar |
| WO2008154582A2 (en) * | 2007-06-11 | 2008-12-18 | Vertical Circuits, Inc. | Semiconductor die coating and interconnection fixture and method |
| WO2008154580A2 (en) * | 2007-06-11 | 2008-12-18 | Vertical Circuits, Inc. | Method for optimized integrated circuit chip interconnection |
| WO2008154580A3 (en) * | 2007-06-11 | 2009-02-19 | Vertical Circuits Inc | Method for optimized integrated circuit chip interconnection |
| WO2008154582A3 (en) * | 2007-06-11 | 2009-02-19 | Vertical Circuits Inc | Semiconductor die coating and interconnection fixture and method |
| US9824999B2 (en) | 2007-09-10 | 2017-11-21 | Invensas Corporation | Semiconductor die mount by conformal die coating |
| US9666513B2 (en) | 2015-07-17 | 2017-05-30 | Invensas Corporation | Wafer-level flipped die stacks with leadframes or metal foil interconnects |
| US9825002B2 (en) | 2015-07-17 | 2017-11-21 | Invensas Corporation | Flipped die stack |
| US9871019B2 (en) | 2015-07-17 | 2018-01-16 | Invensas Corporation | Flipped die stack assemblies with leadframe interconnects |
| US9859257B2 (en) | 2015-12-16 | 2018-01-02 | Invensas Corporation | Flipped die stacks with multiple rows of leadframe interconnects |
| US10566310B2 (en) | 2016-04-11 | 2020-02-18 | Invensas Corporation | Microelectronic packages having stacked die and wire bond interconnects |
| US9728524B1 (en) | 2016-06-30 | 2017-08-08 | Invensas Corporation | Enhanced density assembly having microelectronic packages mounted at substantial angle to board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR930007567U (en) | 1993-04-26 |
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