KR930007567U - Jig for laser diode meter coating with adjustable length - Google Patents

Jig for laser diode meter coating with adjustable length

Info

Publication number
KR930007567U
KR930007567U KR2019910015979U KR910015979U KR930007567U KR 930007567 U KR930007567 U KR 930007567U KR 2019910015979 U KR2019910015979 U KR 2019910015979U KR 910015979 U KR910015979 U KR 910015979U KR 930007567 U KR930007567 U KR 930007567U
Authority
KR
South Korea
Prior art keywords
jig
laser diode
adjustable length
meter coating
diode meter
Prior art date
Application number
KR2019910015979U
Other languages
Korean (ko)
Other versions
KR940004952Y1 (en
Inventor
이정훈
Original Assignee
주식회사 금성사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 금성사 filed Critical 주식회사 금성사
Priority to KR2019910015979U priority Critical patent/KR940004952Y1/en
Publication of KR930007567U publication Critical patent/KR930007567U/en
Application granted granted Critical
Publication of KR940004952Y1 publication Critical patent/KR940004952Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)
KR2019910015979U 1991-09-30 1991-09-30 Jig for laser diode mirror coating KR940004952Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910015979U KR940004952Y1 (en) 1991-09-30 1991-09-30 Jig for laser diode mirror coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910015979U KR940004952Y1 (en) 1991-09-30 1991-09-30 Jig for laser diode mirror coating

Publications (2)

Publication Number Publication Date
KR930007567U true KR930007567U (en) 1993-04-26
KR940004952Y1 KR940004952Y1 (en) 1994-07-23

Family

ID=19319906

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910015979U KR940004952Y1 (en) 1991-09-30 1991-09-30 Jig for laser diode mirror coating

Country Status (1)

Country Link
KR (1) KR940004952Y1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040041261A (en) * 2002-11-09 2004-05-17 엘지전자 주식회사 Method for depositing reflection layer on the facet of semiconductor laser diode chip bar
WO2008154580A2 (en) * 2007-06-11 2008-12-18 Vertical Circuits, Inc. Method for optimized integrated circuit chip interconnection
WO2008154582A2 (en) * 2007-06-11 2008-12-18 Vertical Circuits, Inc. Semiconductor die coating and interconnection fixture and method
WO2009035849A2 (en) 2007-09-10 2009-03-19 Vertical Circuits, Inc. Semiconductor die mount by conformal die coating
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

Also Published As

Publication number Publication date
KR940004952Y1 (en) 1994-07-23

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee