KR940002025Y1 - Semiconductor package carrier - Google Patents
Semiconductor package carrier Download PDFInfo
- Publication number
- KR940002025Y1 KR940002025Y1 KR2019880003392U KR880003392U KR940002025Y1 KR 940002025 Y1 KR940002025 Y1 KR 940002025Y1 KR 2019880003392 U KR2019880003392 U KR 2019880003392U KR 880003392 U KR880003392 U KR 880003392U KR 940002025 Y1 KR940002025 Y1 KR 940002025Y1
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- semiconductor package
- cavity
- package carrier
- carrier
- bent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래의 반도체 패키지 운반구의 일실시예를 나타낸 평면도.1 is a plan view showing an embodiment of a conventional semiconductor package carrier.
제2도는 제1도의 II-II'선 단면도.2 is a cross-sectional view taken along the line II-II 'of FIG.
제3도는 이 고안에 따른 반도체 패키지 운반구의 일실시예를 나타낸 평면도.3 is a plan view showing an embodiment of a semiconductor package carrier according to the present invention.
제4도는 제3도의 IV-IV'선 단면도.4 is a cross-sectional view taken along the line IV-IV 'of FIG.
제5도의 a도는 이 고안에 적용되는 반도체 패키지를 나타낸 사시도, b도는 상기 a도의 정면도.FIG. 5A is a perspective view showing a semiconductor package applied to the present invention, and FIG. 5B is a front view of the above FIG.
제6도는 이 고안에 따른 반도체 패키지 운반구의 사용상태를 나타낸 확대단면도이다.6 is an enlarged cross-sectional view showing a state of use of the semiconductor package carrier according to the present invention.
이 고안은 반도체 패키지 운반구에 관한 것으로써, 더욱 상세하게는 반도체 제조공정을 통하여 밑면이 사각평판(Quad flat) 형상으로 되고 사면의 리이드가 하향 절곡되어 돌출형성된 반도체 패키지를 개별 유니트(unit)로써 트림(Trim) 및 포옴(Form)한 후, 진공장치를 이용하여 운반구에 적재시켜서 운반할 때 운반구의 캐비티내에 반도체 패키지가 안정감있게 적재되어 운반될 수 있도록 한 반도체 패키지 운반구에 관한 것이다.The present invention relates to a semiconductor package delivery port, and more specifically, a semiconductor package, in which a bottom surface is formed into a quad flat shape and the lead of the slope is downwardly bent through the semiconductor manufacturing process, is trimmed as an individual unit. The present invention relates to a semiconductor package carrier which allows a semiconductor package to be stably loaded and transported in a cavity of the carrier when transported after being trimmed and formed into a carrier using a vacuum apparatus.
일반적으로 반도체 제조공정을 통하여 제조된 반도체 패키지는 운반구(tray)에 적재하여 수요자에게 공급하는데, 이때 상기 반도체 패키지는 실수요자에게 전달되기까지 완전한 상태로 유지되어야 하므로 상기 패키지 운반구는 운반도중 매우 중요한 역활을 하게 된다.In general, a semiconductor package manufactured through a semiconductor manufacturing process is loaded into a tray and supplied to a consumer. At this time, the semiconductor package has to be kept in a perfect state until it is delivered to a real user. Done.
제1도는 종래의 반도체 패키지 운반구의 일실시예를 나타낸 평면도이고, 제2도는 상기 제1도의 II-II'선 단면도이다.FIG. 1 is a plan view showing an embodiment of a conventional semiconductor package carrier, and FIG. 2 is a cross-sectional view taken along the line II-II 'of FIG.
제1도 내지 제2도를 참조하면 상기 종래의 반도체 패키지 운반구는 운반구 본체(11)의 상면에 적어도 하나이상의 캐비티(12)가 형성되어 있으며, 상기 캐비티(12)의 밑면이 평판형으로 형성되어 있다.1 to 2, at least one cavity 12 is formed on an upper surface of the carrier body 11, and a bottom surface of the cavity 12 is formed in a flat plate shape. have.
이와 같은 반도체 패키지 운반구에 밑면이 평판형이고 사면에는 하향 절곡되어 돌출형성된 다수개의 리드를 갖는 반도체 패키지를 캐비티(12)내에 적재하여 운반하거나 핸드링(Handling)할 경우, 상기 캐비티(12) 내에 적재된 반도체 패키지가 좌우로 요동하게 됨으로써 반도체 패키지의 사면으로 돌출형성된 리드가 충격등으로 인하여 변형 및 파손되는 경우가 많았으며, 상기 반도체 패키지의 표면에 표기된 마킹(Marking) 상태를 손상시키는 문제점이 있다.When the semiconductor package carrying the semiconductor package having a plurality of leads which is flat on the bottom surface and bent downward on the slope and is formed in the cavity 12 to be transported or handed, the semiconductor package is loaded in the cavity 12. Since the semiconductor package is swung from side to side, the leads protruding to the slopes of the semiconductor package are often deformed and broken due to impact, etc., and there is a problem of damaging the marking state marked on the surface of the semiconductor package.
이 고안은 상기한 문제점을 해결하기 위한 것으로써, 이 고안의 목적은 사면에 하향 절곡되어 돌출형성된 리드를 갖는 다수개의 반도체 패키지를 리드의 절곡 요홈부에 삽입 위치되도록 돌조를 돌출적재부에 적재하여 상기 리드 및 마킹부의 손상을 주지 않고 운반할 수 있도록 한 반도체 패키지 운반구를 제공하는데 있다.The object of the present invention is to solve the above-described problems, and an object of the present invention is to load a plurality of semiconductor packages having leads that are bent downwardly on an inclined surface to be inserted into the protrusion grooves so that the protrusions are inserted into the bent recesses of the leads. The present invention provides a semiconductor package carrying device which can be transported without damaging the lid and the marking part.
상기한 목적을 달성하기 위한 이 고안에 따른 반도체 패키지 운반구의 특징은, 다수개의 캐비티가 형성되어 있는 반도체 패키지 운반구에 있어서, 상기 캐비티내로 사면에 하향 절곡되어 돌출형성된 리드와 상기 리드의 절곡 요홈부를 갖는 반도체 패키지를 적재 수용할 수 있도록 상기 캐비티 밑면이 돌출적재부로 형성되며 상기 돌출적재부에서 연장된 돌조에 상기 절곡 요홈부가 안착되는 점에 있다.A feature of the semiconductor package carrier according to the present invention for achieving the above object is, in a semiconductor package carrier having a plurality of cavities, having a lead bent downwardly projected into a slope into the cavity and a bent recess of the lead The bottom surface of the cavity is formed as a protrusion loading portion to accommodate the semiconductor package, and the bending recess is seated on a protrusion extending from the protrusion loading portion.
이하, 이 고안에 따른 반도체 패키지 운반구의 하나의 실시예를 첨부된 도면에 의거하여 상세히 설명한다.Hereinafter, one embodiment of a semiconductor package carrier according to the present invention will be described in detail with reference to the accompanying drawings.
제3도는 이 고안에 따른 반도체 패키지 운반구의 일실시예를 나타낸 평면도이고, 제4도는 상기 제3도의 IV-IV' 선 단면도이다.3 is a plan view showing an embodiment of a semiconductor package carrier according to the present invention, and FIG. 4 is a cross-sectional view taken along the line IV-IV 'of FIG.
제3도 및 제4도를 참조하면, 상기 반도체 패키지 운반구는 운반구 본체(31)의 상면에 적어도 하나 이상의 캐비티(32)가 형성되어 있으며 상기 캐비티(32)의 하면에 사면으로 하향절곡되어 돌출형성된 리드의 절곡 요홈부를 갖는 반도체 패키지를 절재할 수 있는 돌출적재부(35)가 형성되어 있으며, 상기 돌출적재부(35)의 연장선에서 상기 리드의 절곡 요홈부를 안착하고 있는 사각형의 돌조(36)가 형성되어 있다.3 and 4, the semiconductor package carrier has at least one cavity 32 formed on an upper surface of the carrier body 31, and is bent downwardly on a lower surface of the cavity 32 to protrude. A protrusion loading part 35 is formed to cut a semiconductor package having a bending recess of the lead, and a rectangular protrusion 36 resting on the bending recess of the lead is formed on an extension line of the protrusion loading part 35. Formed.
따라서 제5도 a 및 b를 참조하면, 사면에 하향 절곡되어 돌출 형성된 리드들(54)과 상기 리드들(54)의 절곡요홈부를 갖는 반도체 패키지(50)가 캐비티(32)내에 형성된 각각의 돌출 적재부(35) 및 사각형의 돌조(36)에 적재된다.Accordingly, referring to FIGS. 5A and 5B, each protrusion formed in the cavity 32 may include the leads 54 formed by bending downwardly on the slope and the semiconductor package 50 having the bent recesses of the leads 54. The stack 35 and the square projection 36 are stacked.
제6도는 이 고안에 따른 반도체 패키지 운반구의 사용상태를 나타낸 확대단면도이다.6 is an enlarged cross-sectional view showing a state of use of the semiconductor package carrier according to the present invention.
제6도를 참조하면, 상기 반도체 패키지 운반구(61)의 캐비티(62)내에 마련된 돌출적재부(65) 및 상기 돌출적재부(65)에 연장되어 형성된 사각형의 돌조(66)에 반도체 패키지(60)가 적재되어 안착된다.Referring to FIG. 6, the semiconductor package 60 may be formed in the protruding portion 65 provided in the cavity 62 of the semiconductor package carrier 61 and the rectangular protrusion 66 extending from the protruding portion 65. ) Is loaded and seated.
따라서 상기한 바와 같이 운반구 본체의 캐비티내에 적재되어 있는 반도체 패키지는 돌출적재부 및 사각형의 돌조에 의해 요동되지 않고 안착되어 있으므로 다음 공정으로 이송시 리드의 변형이나 마킹부의 손상을 주지 않는다.Therefore, as described above, the semiconductor package loaded in the cavity of the carrier main body is not rocked by the protruding portion and the square protrusion, and thus does not deform the lead or damage the marking portion during transfer to the next step.
이와같은 이 고안의 반도체 패키지 운반구는 다수개의 캐비티가 형성되어 있는 반도체 패키지 운반구에 있어서, 상기 캐비티내로 사면에 하향 절곡되어 돌출형성된 리드와 상기 리드의 절곡 요홈부를 갖는 반도체 패키지를 적재하여 수용할 수 있도록 상기 캐비티 밑면이 돌출적재부로 형성되며 상기 돌출적재부에서 연장된 돌조에 상기 절곡 요홈부가 안착되어 있으므로 상기 반도체 패키지 운반구를 운반하거나 핸드링할때 반도체 패키지가 캐비티내에서 전혀 요동됨이 없이 안정감있게 적재되어서 운반될 수 있게 된다.The semiconductor package delivery device of this invention is a semiconductor package delivery device in which a plurality of cavities are formed, so as to accommodate a semiconductor package having leads and bent recesses formed by protruding downwardly into a slope into the cavity. Since the bottom surface of the cavity is formed as a protruding portion and the bending recess is seated on a protrusion extending from the protruding portion, the semiconductor package is stably loaded without any fluctuation in the cavity when carrying or handing the semiconductor package carrier. It can be transported.
이러한 이 고안은 운반구 캐비티내에 적재된 반도체 패키지가 안정감있게 적재 운반되므로서 다음공정시 불량율이 감소되고, 생산성 향상 및 품질향상에 기여할 수 있는 매우 실용적이며 유용한 이점이 있다.This design has a very practical and useful advantage that the semiconductor package loaded in the carrier cavity can be loaded and transported in a stable manner, thereby reducing the defect rate during the next process, and contributing to the improvement of productivity and quality.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019880003392U KR940002025Y1 (en) | 1988-03-14 | 1988-03-14 | Semiconductor package carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019880003392U KR940002025Y1 (en) | 1988-03-14 | 1988-03-14 | Semiconductor package carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890020030U KR890020030U (en) | 1989-10-05 |
| KR940002025Y1 true KR940002025Y1 (en) | 1994-04-01 |
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ID=19273200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019880003392U KR940002025Y1 (en) | 1988-03-14 | 1988-03-14 | Semiconductor package carrier |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940002025Y1 (en) |
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1988
- 1988-03-14 KR KR2019880003392U patent/KR940002025Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR890020030U (en) | 1989-10-05 |
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