KR940000622B1 - Laminated sheet - Google Patents

Laminated sheet Download PDF

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Publication number
KR940000622B1
KR940000622B1 KR1019900005613A KR900005613A KR940000622B1 KR 940000622 B1 KR940000622 B1 KR 940000622B1 KR 1019900005613 A KR1019900005613 A KR 1019900005613A KR 900005613 A KR900005613 A KR 900005613A KR 940000622 B1 KR940000622 B1 KR 940000622B1
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South Korea
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yarn
fabric
weft
yarns
warp
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KR1019900005613A
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Korean (ko)
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KR900015916A (en
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테츠오 마츠이
시게오 야마구치
타다시게 사토
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닛토보세키 가부시키가이샤
스즈키 신지
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • D03D1/0082—Fabrics for printed circuit boards
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
    • D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
    • D03D15/267—Glass
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/40—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads
    • D03D15/41—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads with specific twist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2331/00—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products
    • D10B2331/04—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products polyesters, e.g. polyethylene terephthalate [PET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Abstract

내용 없음.No content.

Description

적층판Laminate

제1도 및 제2도는 본 발명의 유리섬유 직물의 예를 나타낸 조직도이다.1 and 2 are organization charts showing examples of the glass fiber fabric of the present invention.

1 : 유리섬유경사(EGC 75 1/0-1 Z)1: Glass fiber slope (EGC 75 1 / 0-1 Z)

2 : 유리섬유경사(EGC 75 1/0-1 S)2: Glass fiber slope (EGC 75 1 / 0-1 S)

3 : 유리섬유위사(EGC 75 1/0-0.7 Z)3: glass fiber weft (EGC 75 1 / 0-0.7 Z)

1' : 유리섬유경사(ECE-225 1/0-1 Z)1 ': Glass fiber slope (ECE-225 1 / 0-1 Z)

2' : 유리섬유경사(ECE-225 1/0-1 S)2 ': Glass fiber slope (ECE-225 1 / 0-1 S)

3' : 유리섬유경사(ECE-255 1/0-1 Z)3 ': Glass fiber slope (ECE-255 1 / 0-1 Z)

본 발명은 인쇄배선판 등의 기판으로서 사용될 수 있는 적층판에 관한 것이며, 특히 휘어짐 및 뒤틀림이 적은 적층판에 관한 것이다. 본 발명의 적층판으로 직물을 기재로 하는 것 이외에, 직물과 부직포의 조합을 기재로 하는 소위 복합을(composite)형의 적층판도 포함된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to laminates that can be used as substrates such as printed wiring boards, and more particularly, to laminates with less warpage and distortion. In addition to the base material of the laminated board of the present invention, a so-called composite type laminated board based on a combination of a woven fabric and a nonwoven fabric is also included.

적층판 또는 동판금 적층판(copper-clad laminate)은 기판에 수지를 함침시키고 건조시켜 수득된 프리프레그를 소정 매수로 적층하고, 필요에 따라 표면에 동박을 입히고 가압하여 제조할 수 있다. 동판금 적층판의 주용도인 인쇄 배선판의 분야에 있어서는, 고밀도 자동 실장기술의 진보에 따라, 인쇄배선판의 성능에 대한 요구가 한층 커지고 있으며 인쇄 배선판의 기판인 적층판에 대해 휘어짐 및 뒤틀림이 적은 것이 한층크게 요구되고 있다The laminated sheet or copper-clad laminate can be produced by laminating a predetermined number of prepregs obtained by impregnating a resin into a substrate and drying, and coating and pressing copper foil on the surface as necessary. In the field of printed wiring boards, which are the main use of copper-clad laminates, the demands on the performance of printed wiring boards are increasing with the development of high-density auto-mounting technology, and there is a greater demand for less bending and warping of laminates, which are substrates of printed wiring boards. Becoming

적층판에 휘어짐 및 뒤틀림이 생기는 원인은 적층판의 종류, 제조방법 및 재료의 종류에 따라 그 정도는 약간 다르지만 다음의 이유로 생각될 수 있다. 즉, (가) 제조공정에 있어서 경방향, 위방향의 장력차의 존재, (나) 압축 압력의 부여, (다) 매트릭스 수지의 압축시의 유동, 및, (라) 온도차와 선팽창계수의 차이에 기인하여 팽창 또는 수축이 기재와 매트릭스 수지에 있어서 상이한 것 등에 의해 응력, 변형이 주로 응력 담체인 기재 직물 또는 직물과 부직포에 작용하여 그 결과 휘어짐 및 뒤틀림이 생긴다고 생각되며, 종래 기술에 의한 적층판에서는 이러한 휘어짐 및 뒤틀림이 크기 때문에 인쇄 배선판을 설치한 자동장치가 작동중 단 또는 작동불능이 되는 경우가 있었다.The cause of warpage and warpage of the laminate is slightly different depending on the type of the laminate, the manufacturing method and the type of material, but may be considered for the following reasons. That is, (a) presence of tension differences in the radial and upper directions in the manufacturing process, (b) application of compression pressure, (c) flow during compression of the matrix resin, and (d) difference in temperature difference and linear expansion coefficient. Due to the expansion or contraction caused by the difference between the substrate and the matrix resin, the stress and deformation mainly act on the base fabric or the fabric and the nonwoven fabric which are the stress carriers, resulting in warpage and warpage. Due to the large amount of warpage and warpage, automatic devices in which printed wiring boards are installed may sometimes stop or become inoperable.

본 발명자는, 종래 알려진 원인에 추가하여 다음과 같은 휘어짐과 뒤틀림의 원인을 발견하였다.The present inventor has found the following causes of warping and distortion in addition to the known causes.

즉, 적충판의 기재가 되는 직물 자체에 내부응력과 변형의 발생요인이 있으며, 상기 (가) 내지 (나)의 요인에 의한 외부로부터의 응력 및 변형이 합쳐진 형태로 직물 자체의 내부응력과 변형에 추가되어, 결과적으로 큰 응력 및 변형이 생겨 적층판의 휘어짐과 뒤틀림으로 나타나므로, 이러한 휘어짐과 뒤틀림을 감소시키기 위해서 직물 자체의 내부응력과 변형을 적게하는 것이 필요하다.In other words, there is a cause of internal stress and deformation in the fabric itself, which is the substrate of the red worm board, and the internal stress and deformation of the fabric itself in the form of the combined stress and deformation from the outside due to the factors (a) to (b). In addition, as a result of the large stresses and strains resulting in warpage and warpage of the laminate, it is necessary to reduce the internal stress and deformation of the fabric itself in order to reduce such warpage and warpage.

본 발명은, 이와 같은 종래의 문제점 및 본 발명자의 지식과 발견을 기초로 하여 이루어진 것으로서, 적층판의 기재를 구성하고 있는 위사에 대하여는 꼬임 방향이 Z인 연사(또는 S인 연사)를 사용할 때, 경사에 대하여는 위사의 꼬입수, 위사의 텍스(tex) 및 위사의 삽입 가닥수(가닥/25mm)에 따라, 꼬임방향이 S인 연사(Z인 연사) 1가닥에 대하여, Z연사(S연사)를 2 내지 8의 비율로 거의 균일하게 배치한 경사를 사용하므로써, 적층판의 휘어짐과 뒤틀림을 현저히 향상시켜 문제점을 해결하는 것을 목적으로 한다.The present invention has been made on the basis of such a conventional problem and the inventor's knowledge and findings, and when the weft yarn constituting the base material of the laminated board uses twisted yarns (or twisted yarns of S) with a twisting direction of Z, With respect to the number of twisted yarns of the weft, the number of strands of the weft (tex / 25mm), Z twisted yarn (S twisted yarn) is applied to one strand of twisted yarn (twisted yarn with Z) in the twisting direction S. By using the inclination arrange | positioned substantially uniformly in the ratio of 2-8, it aims at resolving the problem by remarkably improving the curvature and distortion of a laminated board.

이 경우, 경사에 사용되는 S연사 및 Z연사의 꼬임수는 동수가 바람직하다. 적층판의 기재로 사용되는 직물은 유리섬유 직물, 폴리에스테르 섬유 직물 및 특수용도로서 아라미드 섬유 직물 등이 있다.In this case, the number of twists of S yarn and Z yarn used for warp is the same. Fabrics used as substrates for laminates include glass fiber fabrics, polyester fiber fabrics, and aramid fiber fabrics for special purposes.

일반적으로는 유리섬유 직물이 적층판용의 기재로서 널리 사용되고 있으므로, 적층판의 기재인 직물이 유리섬유 직물인 경우에 대해 도면으로 본 발명을 설명한다. 유리섬유 직물은 현재 단사직물이 주류가 되고 있다. 단사직물이란 직물을 구성하고 있는 사가 감연(꼬임수가 작은 것)인 편연사로 구성된 직물이다.In general, glass fiber fabrics are widely used as substrates for laminates, and therefore, the present invention will be described with reference to the case where the fabrics as substrates for laminates are glass fibers. Fiberglass fabrics are now the mainstream single yarn. A single yarn fabric is a fabric composed of single yarns, which are yarns with a small twist.

제1도에 도시된 조직도는 유리섬유 평직직물의 조직도이다. 이 직물은 경사가 경사1의 ECG-75 1/0-1Z의 유리섬유 단사와 경사2의 ECG-75 1/0-lS의 유리섬유 단사로 3대 1로 구성되고, 위사3이 ECG-75 1/0-0.72의 유리섬유 단사로 이루어지는 것이다.The organization chart shown in FIG. 1 is the organization chart of the glass fiber plain weave. This fabric is composed of three to one pieces of glass fiber yarn of ECG-75 1 / 0-1Z of warp yarn 1 and glass fiber yarn of ECG-75 1 / 0-lS of warp warp 2, and ECG-75 of weft 3 It consists of single glass fibers of 1 / 0-0.72.

유리섬유 직물에 사용되는 사의 번수 범위는, Tex표시로 5 내지 150이 바람직하다. 사를 구성하는 필라멘트의 형상과 굵기 등에 대하여는 특별히 한정할 필요가 없으며, 수지와의 접착성을 저해하지 않는 것이면 좋다.As for the number-of-count range of the yarn used for a glass fiber cloth, 5-150 are preferable by Tex mark. The shape, thickness, and the like of the filaments constituting the yarn need not be particularly limited, and may be any one that does not impair adhesion with the resin.

사의 꼬임수는 0.3 내지 3t/25mm이다. 꼬임수가 0.3 미만인 경우는, 사를 구성하는 필라멘트의 집속성이 불충분해져서, 제직공정에서 양호한 작업성이 수득되지 못하며, 한편 꼬임수가 3보다 큰 경우는 꼬임수가 큰 편연사가 되기 때문에 취급성이 나빠진다.The twist count of the yarn is 0.3 to 3 t / 25 mm. If the number of twists is less than 0.3, the filaments constituting the yarns become insufficient, and good workability is not obtained in the weaving process. On the other hand, if the number of twists is greater than 3, the twisted yarn has a large twisted yarn, resulting in poor handleability. Falls out.

직물의 구성에 대하여, 삽입 가닥수는 20 내지 80 가닥/25mm이고, 직물의 질량은 20 내지 400g/m2이며, 직물의 직조 방법은 평직, 주자직 및 능직 등이 사용된다.For the construction of the fabric, the number of insert strands is 20 to 80 strands / 25 mm, the mass of the fabric is 20 to 400 g / m 2 , and the weaving method of the fabric is plain weave, runner weave and twill weave.

일반적으로 적층판의 기재로서 사용되는 직물은 매트릭스 수지와의 접착을 향상시키기 위해 여러가지 처리제에 의한 처리가 실시되지만, 이들의 종류 및 부착량등에 있어서도 특별한 제한은 없다.Generally, the fabric used as the base material of the laminated board is treated with various treatment agents in order to improve adhesion with the matrix resin, but there are no particular limitations on the type and amount of adhesion thereof.

또한 직물의 균일성 및 경사와 위사의 눈구부러짐등에 대해서도 본 발명은 특별한 제한이 없으며, 이들이 개량되면 본 발명에 의한 효과도 한층 개량된다.In addition, the present invention is not particularly limited with respect to the uniformity of the fabric and the warping of the warp yarn and the weft yarn, and if these are improved, the effect of the present invention is further improved.

본 발명의 대상이 되는 적층판의 두께는 0.1 내지 3.0mm에서 본 발명의 효과가 가장 현저히 나타난다.The thickness of the laminate to be the object of the present invention is most remarkable effect of the present invention at 0.1 to 3.0mm.

적층판의 매트릭스 수지로서는, 에폭시 수지, 페놀수지, 폴리이미드 수지, 불포화 폴리에스테르 수지 및 실리콘 수지 등의 열경화성 수지, 또는 불소계 수지 등의 열가소성 수지 등이 사용된다. 또는 이들의 수지를 복수종류 혼합하여 매트릭스 수지로서 사용할 수 있다.As a matrix resin of a laminated board, thermosetting resins, such as an epoxy resin, a phenol resin, a polyimide resin, an unsaturated polyester resin, and a silicone resin, or thermoplastic resins, such as a fluororesin, are used. Or these resin can be mixed in multiple types and can be used as matrix resin.

본 발명의 적층판은, 상기 구성의 직물을 종래 공지의 방법에 의해 매트릭스 수지로 처리하여 프리프레그를 형성하고, 이러한 프리프레그를 복수장 적층시켜, 필요에 따라 양면 또는 한면에 금속박을 겁쳐서 가열 및 가압하여 수득된다.The laminated board of this invention processes the fabric of the said structure with matrix resin by a conventionally well-known method, forms a prepreg, laminates several sheets of such prepregs, and heats metal foil on both surfaces or one side as needed, and Obtained by pressurization.

또한, 본 발명의 복합물형 적층판은, 상기 직물과 부직포를 조합하여 기재로 사용하고, 이들 상기의 수지를 함침처리하여 프리프레그를 형성시켜, 이 프리프레그를 복수장 적층시킨 후에 가열 및 가압하여 수득된다.In addition, the composite laminate of the present invention is obtained by combining the woven fabric and the nonwoven fabric as a substrate, impregnating these resins to form a prepreg, and laminating a plurality of the prepregs, followed by heating and pressing. do.

기재 자체가 갖는 휘어짐과 뒤틀림의 발생요인으로서는, 종래 직물의 위사의 눈구부러짐이 생각되고 있었다.As a cause of the warping and the distortion which the base material itself has, the eyelash of the weft of the woven fabric was considered conventionally.

본 발명자는, 이외에 직물의 구성 자체에 휘어짐과 뒤틀림의 요인이 존재함을 알았다. 종래는 적층판에 사용되는 유리 단사 직물의 경우, 사는 감면의 편연사였으나, 그 제조 도중의 탈유공정에서 열경화 효과 및 그후의 표면처리에서 경화효과에 의해, 꼬임의 편향에 의한 변형이 가압(假押)되어 있기 때문과, 적층판에 요구되는 휘어짐 및 뒤틀림이 지금과 같이 심하지 않았으므로, 꼬임의 편향을 깨닫지 못했다고 생각된다.The inventors found out that there are factors of warping and warping in the fabric itself. Conventionally, in the case of glass single yarn fabrics used in laminates, yarns were single yarns of exempt yarns, but deformation due to the deflection of twist was pressed by the heat curing effect in the deoiling process during the manufacturing process and the curing effect in the subsequent surface treatment. Iii) and because the warpage and warpage required for the laminate are not as severe as they are now, it is considered that the deflection of the twist is not realized.

본 발명자는, 적층판의 휘어짐과 뒤틀림의 수준을 향상시키기 위한 연구 중에 꼬임의 편향을 알게되어, 직물의 경사와 위사의 관계를 분명히 하였다. 즉, 경사 방향의 꼬임 편향을 없애기 위하여 S연사와 Z연사를 하나 걸러서 사용함으로써, 적층판의 휘어짐과 뒤틀림을 감소시킬 수 있음을 알아내었다. 그러나, 위사 방향의 꼬임의 편향이 남아있기 때문에 불충분하였다.The inventors have learned the deflection of the twist during the study to improve the level of warping and warping of the laminate, thereby clarifying the relationship between the warp and the weft of the fabric. In other words, it was found that the warp and the distortion of the laminated board can be reduced by using S and Z yarns every other time in order to eliminate the twist deflection in the oblique direction. However, this was insufficient because the deflection of twist in the weft direction remained.

그래서, 경사에 사의 꼬임방향과는 역방향인 S연사와 Z연사를 특정 비율로, 거의 균일하게 삽입하므로써 꼬임의 편향에 의한 직물전체에 내재하는 변형을 감소시켜, 결과로서 그 직물을 기재로 사용한 적층판의 휘어짐과 뒤틀림을 감소시킬 수 있었다. 삽입비율은 1/2 내지 1/8범위가 적당하며, 그 범위내에서 직물의 종류 예를 들면, 경사와 위사의 사용사 및 삽입 가닥수에 따라 적절히 선택된다.Therefore, by inserting the S yarn and Z yarn which are opposite to the twisting direction of the yarn in the warp at a specific ratio, the deformation inherent in the whole fabric due to the deflection of the twist is reduced, resulting in a laminated board using the fabric as a substrate. Could reduce the warping and warping of The insertion ratio is suitably in the range of 1/2 to 1/8, and is appropriately selected depending on the type of fabric, for example, the yarn used and warp yarn and the number of strands within the range.

[실시예]EXAMPLE

[실시예 1]Example 1

본 발명의 적층판의 기재로서 유리섬유 직물을 사용한다.Glass fiber fabrics are used as the substrate of the laminate of the present invention.

상기 유리섬유 직물은 WEA-l8W 형태 및 WEA-19 형태(모두 닛토보세키가부시키가이샤 제품)의 2종류를 사용하고, 각 유리직물에 본 발명을 적용하여 제직하고, 공지 방법에 의해 탈유 및 표면처리를 실시하여 제1표에 나타낸 유리섬유 직물을 제조한다. 비교예로서는, Z연사만을 사용하고 있는 현행품 WEA-18W 및 WEA-19를 사용한다.The fiberglass fabrics are made of two types, WEA-l8W and WEA-19 (both manufactured by Nitto Boseki Co., Ltd.), and are woven by applying the present invention to the respective glass fabrics. Surface treatment is carried out to produce the glass fiber fabrics shown in Table 1. As a comparative example, current products WEA-18W and WEA-19 using only Z-twisted yarns are used.

제1표에 나타낸 4종류의 각각의 유리섬유직물 및 에폭시 수지(FR-4 형태)를 사용하여 공지의 방법으로 프리프레그를 만들고, 이 프리프레그를 8장 포개어서, 최상부면과 최하부면에 두께 18㎛의 동박을 겹쳐, 이것을 압력 80kg/cm2, 온도 170℃ 및 유지시간 90분의 조건에서 압축하여 동판금 적층판을 제조한다.Four prepregs are made by a known method using each of the four types of glass fiber fabrics and epoxy resins (FR-4 form) shown in Table 1, and eight pieces of the prepregs are stacked to have a thickness on the top and bottom surfaces. The copper foil of 18 micrometers was piled up, and it compressed on the conditions of 80 kg / cm <2> of pressure, 170 degreeC of temperature, and 90 minutes of holding time, and manufactures a copper plate laminated sheet.

이 시험에 사용된 유리섬유직물을 장방형(10×200cm)으로 잘라내어, 한쪽을 고정하여 매달았을 때의 뒤틀림 각 및, 동판금 적층판에 대하여는 JIS C 6481. 5. 4. 3에서 규정된 시험법에 의해 휘어짐과 뒤틀림을 측정한다. 그 결과를 제1표 및 제2표에 나타낸다.The fiberglass fabric used for this test was cut into rectangular (10 x 200 cm) cutouts, and the warping angles when they were fixed by one side and the copper sheet metal laminates were subjected to the test method specified in JIS C 6481 5.5.4. Measure warpage and distortion by The results are shown in the first and second tables.

[표 1]TABLE 1

Figure kpo00001
Figure kpo00001

[표 2]TABLE 2

Figure kpo00002
Figure kpo00002

* 가열조건 ; 170℃에서 30분가열* Heating condition; 30 minutes heating at 170 ℃

제2표로부터 명백히 알 수 있는 바와 같이 본 발명에 따른 동판금 적층판의 실시예 1에 있어서는 비교예와 비교하여 휘어짐 및 뒤틀림이 대폭 감소된 것이 확인되었다.As can be clearly seen from the second table, in Example 1 of the copper-clad laminate according to the present invention, it was confirmed that the warpage and the warp were greatly reduced as compared with the comparative example.

[실시예 2]Example 2

본 발명의 적층판의 기재로서 통칭 박물(薄物 ; 두께 100㎛)유리섬유직물을 사용한다.As a base material of the laminated board of the present invention, a generically named thin glass fiber cloth is used.

이러한 유리섬유직물은 WEA-ll6E형태(닛토보세키 가부시키가이샤 제품)를 사용하여 유리직물에 본 발명을 적용하여 제직하고, 공지의 방법으로 탈유 및 표면처리를 수행하여 제3표에 나타낸 유리섬유직물을 제조한다. 비교예로서 Z연사만을 사용하고 있는 현행품 WEA-ll6E를 사용한다.Such glass fiber fabrics are woven by applying the present invention to glass fabrics using the WEA-ll6E type (Nitto Boseki Co., Ltd.), and subjected to deoiling and surface treatment by a known method to glass fibers shown in Table 3. Manufacture fabrics. As a comparative example, current product WEA-ll6E using only Z-twisted yarn is used.

제3표에 나타낸 각각 2종류의 유리섬유직물과 에폭시 수지(FR-4 형태)를 사용하여 공지의 방법으로 프리프레그를 만들고, 당해 프리프레그 10장을 포개어서 최상부면과 최하부면에 두께 18㎛의 동박을 입히고 이것을 압력 80kg/cm2, 온도 170℃, 유지시간 90분의 조건으로 압축하여 동판금 적층판을 제조한다.Prepreg is made by a known method using two kinds of glass fiber fabrics and epoxy resin (FR-4 type) shown in Table 3, and 10 pieces of the prepregs are stacked to have a thickness of 18 µm on the top and bottom surfaces. Copper foil was coated and it was compressed under conditions of a pressure of 80 kg / cm 2, a temperature of 170 ° C., and a holding time of 90 minutes to prepare a copper plate laminate.

상기 시험에 사용된 유리섬유직물을 장방형 (10×200cm)으로 잘라내어서 한쪽을 고정하고 매달았을 때의 뒤틀림 각도와 동판금 적층판에 대해서 JIS C 6481. 5. 4. 3에 규정된 시험법에 따라 휘어짐 및 뒤틀림을 측정한다. 그 결과는 제3표 및 제4표에 나타내었다.The fiberglass fabric used for the above test was cut into rectangular pieces (10 × 200 cm) to fix one side of the fiberglass fabric, and the warping angle when hanging and the copper sheet metal laminate according to the test method specified in JIS C 6481. 5. 4. 3 Measure warpage and warpage. The results are shown in Tables 3 and 4.

제2도에 본 실시예의 유리섬유직물의 조직도를 나타내었다. 경사는 경사 1' 의 ECE 225 1/0-1Z의 유리섬유단사와 경사 2'의 ECE 225 1/0-lS의 유리섬유 단사가 5대1로 구성되며 위사 3'가 ECE 225 1/0-1Z의 유리섬유단사로 이루어진 평직직물이다.2 shows the structure of the glass fiber fabric of this example. The warp consists of 5 '1' of ECE 225 1 / 0-1Z's fiberglass yarn and 1'0 'of ECE 225 1 / 0-lS of warp yarn and 3' of ECE 225 1 / 0- Plain weave fabric consisting of 1Z fiberglass yarn.

[표 3]TABLE 3

Figure kpo00003
Figure kpo00003

[표 4]TABLE 4

Figure kpo00004
Figure kpo00004

[실시예 3]Example 3

실시예 1 및 비교예 1에 나타낸 유리섬유직물 중에서 WEA-l8W 형태의 유리섬유 직물과, 유리 페이퍼 즉 유리 부직포를 조합하여 적층판(통상적으로 복합물 적층판이라고 함)을 공지의 방법에 의해 제조한다. 그 제조공정은 이하와 같다. 유리 페이퍼는 100g/m2의 것을 사용하고, 이것과 에폭시 수지 (FR-4 형태)에 의해 수지량 67%의 유리 페이퍼 프리프레그를 만드는 한편, 유리섬유 직물은 209g/m2의 것을 사용하고 이것과 에폭시 수지 (FR-4 형태)에 의해 수지량 42%의 유리섬유직물 프리프레그를 만들며, 유리 페이퍼 프리프레그를 4장 포개어 그의 최상부.최하부면에 유리섬유직물 프리프레그를 각각 1장씩 배치하고 그의 양면에 두께 18㎛의 동박을 입혀서 압력 30kg/cm2, 온도 170℃에서 90분간 유지시켜 2종류의 적층판(복합물 적층판)을 제조한다. 상기 적층판의 치수는 45cm×45cm이며 두께는 1.6mm이다.Among the glass fiber fabrics shown in Example 1 and Comparative Example 1, a laminated plate (commonly referred to as a composite laminated plate) is produced by combining a glass fiber fabric of the WEA-8W form and a glass paper, ie, a glass nonwoven fabric, by a known method. The manufacturing process is as follows. The glass paper uses 100g / m2, and this and epoxy resin (FR-4 form) make the glass paper prepreg of 67% of resin, while the fiberglass fabric uses 209g / m2 and this and epoxy Resin (form FR-4) is used to make glass fiber prepreg with 42% resin content. Four sheets of glass paper prepreg are stacked and one glass fiber fabric prepreg is placed on the top and bottom of each one. Two kinds of laminates (composite laminates) were produced by applying a copper foil having a thickness of 18 µm and holding them at a pressure of 30 kg / cm 2 and a temperature of 170 ° C for 90 minutes. The laminate had dimensions of 45 cm x 45 cm and a thickness of 1.6 mm.

본 발명의 제3실시예에 의한 적층판과 비교예의 적층판을 실시예1과 동일한 시험방법에 의해 휘어짐 및 뒤틀림을 측정한다.The laminated sheet according to the third embodiment of the present invention and the laminated sheet of the comparative example were measured for warpage and warpage by the same test method as in Example 1.

그 결과를 제5표에 나타낸다.The results are shown in Table 5.

[표 5]TABLE 5

Figure kpo00005
Figure kpo00005

*가열조건 ; 압축성형후 170℃에서 30분가열* Heating condition; 30 minutes heating at 170 ℃ after compression molding

제5표에서 명백히 알 수 있는 바와 같이, 본 발명의 제3실시예에 의한 복합물형의 적층판에 있어서도 비교예인 종래 형태의 복합물 적층판과 비교하여 휘어짐 및 뒤틀림이 대폭 감소되는 것이 확인되었다.As can be clearly seen from Table 5, it was confirmed that the warpage and the warpage were greatly reduced in the composite laminate of the composite type according to the third embodiment of the present invention as compared with the composite laminate of the conventional type as a comparative example.

본 발명의 적층판에서는 기재직물의 경사에 Z연사와 S연사의 비율을 특정한 비율로 배치함으로써 직물 자체가 가진 내부응력이 감소되고 이러한 기재직물을 사용하여 제조한 적층판을 종래 기술에 의한 적층판과 비교하여 휘어짐 잊 뒤틀림을 현저히 감소시키는 것이 가능해졌다. 이에 의해 특히 인쇄배선판으로서 상기 적층판을 사용한 경우, 어려움 없이 고밀도 자동실장 장비에서의 처리가 가능해진다.In the laminate of the present invention, the internal stress of the fabric itself is reduced by arranging the ratio of Z yarn and S yarn in a specific ratio on the inclination of the base fabric, and the laminate produced using the base fabric is compared with the laminate according to the prior art. It is now possible to significantly reduce warpage distortion. Thereby, especially when the said laminated board is used as a printed wiring board, it becomes possible to process by high density automatic mounting equipment without difficulty.

Claims (6)

복수의 중첩 유리섬유 직물층 및 당해 직물층에 함침되는 동시에 복수의 직물층을 일체화하고 있는 합성수지를 포함하며, 직물은 경사와 위사로 구성되고 위사가 Z연사(또는 S연사)로 이루어지며 경사는 위사의 꼬임수, 위사의 텍스(tex) 및 위사의 위입가닥수(가닥/25mm)에 따라 S(또는 Z)연사/Z(또는 S)연사=1/2 내지 8의 비로 거의 균일하게 배치되어 있는 적층판.A plurality of overlapping glass fiber fabric layers and a synthetic resin impregnated in the fabric layer and simultaneously integrating a plurality of fabric layers, wherein the fabric is composed of warp yarns and weft yarns, and the weft yarns are made of Z twisted yarns (or S twisted yarns) Depending on the number of twists of the weft yarn, the tex of the weft yarn, and the number of weaving strands of the weft yarn (strands / 25mm), it is arranged almost uniformly at a ratio of S (or Z) yarn / Z (or S) yarn = 1/2 to 8. That laminate. 제1항에 있어서, 직물의 경사를 구성하고 있는 Z연사와 S연사의 꼬임수가 동일한 적층판.The laminated board according to claim 1, wherein the twisted yarns of the Z yarn and the S yarn that constitute the warp of the fabric are the same. 제1항에 있어서, 양면 또는 한면에 동박이 접합되어 있는 적층판.The laminated sheet of Claim 1 in which copper foil is bonded to both surfaces or one side. 복수의 중첩 부직포층, 당해 부직포층의 양쪽에서 부직포층에 중첩된 직물층 및 부직포층과 직물층에 함침되는 동시에 이들 층을 일체화하고 있는 합성수지를 포함하며, 직물은 경사와 위사로 구성되고, 위사가 Z연사(또는 S연사)로 이루어지며 경사는 위사의 꼬임수, 위사의 텍스 및 위사의 위입가닥수(가닥/25mm)에 따라 S(또는 Z)연사/Z(또는 S)연사=1/2 내지 8의 비로 거의 균일하게 배치되어 있는 적층판.A plurality of overlapping nonwoven layers, a fabric layer superimposed on the nonwoven layer on both sides of the nonwoven layer, and a synthetic resin impregnated with the nonwoven layer and the fabric layer and simultaneously integrating these layers, the fabric comprising warp and weft yarns, Is composed of Z yarn (or S yarn), and the slope is S (or Z) yarn / Z (or S) yarn = 1 / depending on the number of twists of the weft, the tex of the weft and the number of weft strands of the weft (strand / 25mm). The laminated board arrange | positioned substantially uniformly at the ratio of 2-8. 제4항에 있어서, 직물의 경사를 구성하고 있는 S연사와 Z연사의 꼬임수가 동일한 적층판.The laminated board according to claim 4, wherein the twisted yarns of S yarn and Z yarn which constitute the warp of the fabric are the same. 제4항에 있어서, 양면 또는 한면이 동박이 접합되어 있는 적층판.The laminated board of Claim 4 with which copper foil is joined to both surfaces or one side.
KR1019900005613A 1989-04-21 1990-04-21 Laminated sheet KR940000622B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP10291389 1989-04-21
JP1-102913 1989-04-21
JP102913/89 1989-04-21
JP2019184A JPH072389B2 (en) 1989-04-21 1990-01-31 Laminated board for printed wiring board
JP19184/90 1990-01-31
JP2-19184 1990-01-31

Publications (2)

Publication Number Publication Date
KR900015916A KR900015916A (en) 1990-11-10
KR940000622B1 true KR940000622B1 (en) 1994-01-26

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KR1019900005613A KR940000622B1 (en) 1989-04-21 1990-04-21 Laminated sheet

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JP (1) JPH072389B2 (en)
KR (1) KR940000622B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5795494B2 (en) * 2011-05-24 2015-10-14 帝人株式会社 Sandwich material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691030A (en) * 1979-12-24 1981-07-23 Mitsubishi Gas Chemical Co Glass fabric substrate for copper cladded laminate plate
JPS6336060Y2 (en) * 1985-10-31 1988-09-26

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JPH0347746A (en) 1991-02-28
JPH072389B2 (en) 1995-01-18
KR900015916A (en) 1990-11-10

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