KR940000586B1 - Method of jointing a distribution of speaker terminal - Google Patents
Method of jointing a distribution of speaker terminal Download PDFInfo
- Publication number
- KR940000586B1 KR940000586B1 KR1019910019695A KR910019695A KR940000586B1 KR 940000586 B1 KR940000586 B1 KR 940000586B1 KR 1019910019695 A KR1019910019695 A KR 1019910019695A KR 910019695 A KR910019695 A KR 910019695A KR 940000586 B1 KR940000586 B1 KR 940000586B1
- Authority
- KR
- South Korea
- Prior art keywords
- terminal
- speaker
- wires
- condenser
- wire
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Description
제1도는 종래 스피커단자의 접속구조.1 is a connection structure of a conventional speaker terminal.
제2도는 본 발명의 실시상태도로서,2 is an embodiment of the present invention,
(a)는 단자판에 틴셀와이어를 접속하는 상태도.(a) is a state diagram which connects a tinsel wire to a terminal board.
(b)는 단자에 콘덴서를 접속하는 상태도.(b) is a state diagram in which a capacitor is connected to a terminal.
제3도는 스피커의 배선상태도로서,3 is a wiring diagram of a speaker.
(a)는 단자판에 단자와 틴셀와이어가 접속된 상태도.(a) is a state where a terminal and a tinsel wire are connected to the terminal board.
(b)는 콘덴서 접속 상태도.(b) is a condenser connection state diagram.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 단자 2 : 전선1: terminal 2: wire
3 : 단자판 4 : 프레임3: terminal board 4: frame
5 : 콘덴서 6 : 스폿(Spot)용접용 전극5 Capacitor 6 Spot Welding Electrode
본 발명은 단자나 틴셀와이어, 콘덴서 등을 스폿용접으로 접속하는 스피커단자의 배선접속방법에 관한 것으로 전도율을 높이고, 또한 인체에 유해한 작업환경을 개선하기 위한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring connection method of a speaker terminal for connecting terminals, tinsel wires, condensers, etc. by spot welding, to improve conductivity and to improve a work environment harmful to a human body.
지금까지는 스피커에 틴셀와이어나 콘덴서 등을 접속함에 있어서, 첨부도면 제1도에서 되시된 바와같이 단자판(3)에 연설된 단자(1)의 결합공(7)에 틴셀와이어(2)를 삽입한 후 납(9)으로서 이들을 접속하였던 것이 통상적인 방법이었는던 바, 이는 단자와 틴셀와이어, 또는 콘덴시기 직접 접속되지 않고 납으로 연결되기 때문에 전도율이 떨어지는 것을 물론 납땜시에 발생하는 유해가스로 인하여 작업자의 건강을 해치는 등 작업환경이 극도로 나쁠뿐만 아니라 더 나아가서는 작업자가 납중독이라는 심각한 병을 앓게 되는등 직업병의 원인이 되어오고 있는 실정이다.Until now, when connecting a tinsel wire, a condenser, or the like to a speaker, the tinsel wire 2 is inserted into the coupling hole 7 of the terminal 1 that is extended to the terminal plate 3 as shown in FIG. It was common practice to connect them as the lead (9), which is not connected directly to the terminals and tinsel wires or condensates, but is connected by lead, so that the conductivity is lowered and the worker is caused by the harmful gas generated during soldering. In addition to extremely bad working conditions, such as harming the health of workers, furthermore, workers are suffering from a serious illness called lead poisoning.
본 발명은 이러한 문제점을 해소하고자 안출된 것으로 지금까지 납땜 용접을 하던 것을 전선이나 콘덴서를 고주파를 이용한 스폿(Spot)용접 하도록 함으로서 전도율을 높임과 동시에 작업환경을 개선하여 작업자를 보호하는데 그 목적이 있다.'The present invention has been made in order to solve such a problem, and the purpose of the present invention is to protect the operator by improving the working environment while improving the conductivity by spot welding the wires or capacitors using a high frequency to the solder welding. . '
상기한 목적을 달성하기 위하여 안출된 본 발명을 첨부도면 제2도에 의거 상세히 설명하면 다음과 같다.The present invention devised in order to achieve the above object will be described in detail with reference to FIG.
스피커에서 단자(1)의 틴셀와이어(2) 또는 콘덴서(5)외 단자(1)를 접합함에 있어서, 상기 단자(1) 및 단자판(3)에 천설된 결합공(7)에 상기 틴셀와이어(2)나 콘덴서(5)의 배선을 관통되도록 삽입하고, 여기에 스폿(Spot)용접용 전극봉(6)을 밀착시킨후 고주파 전류를 흘리므로써 배선과 단자가 일체로 융착되는 것이다.In joining the tinsel wire (2) of the terminal (1) or the terminal (1) other than the condenser (5) in the speaker, the tinsel wire (in the coupling hole 7 formed in the terminal 1 and the terminal plate 3) 2) or the wiring of the condenser 5 is inserted so that the spot welding electrode 6 is brought into close contact with each other, and then a high frequency current flows to fuse the wiring and the terminal together.
즉 스피커에 틴셀와이어(2)나 콘덴서(5)를 접속하되 상기 스피커의 단자판(3)과 여기에 결합되는 단자(1)에 결합공(7)을 천설하여 틴셀와이어(2)나 콘덴서(5)에서 연장되는 배선을 관통삽입시키고 여기에 상·하서로 대응하는 스폿용접 전극으로 압압하여 고주파 융착함을 특징으로 하는 스피커 단자의 배선 접속 방법에 관한 것이다. 상기한 본 발명을 그 실시예에 따라 상세히 설명하면 다음과 같다.That is, the tinsel wire 2 or the condenser 5 is connected to the speaker, but a coupling hole 7 is laid in the terminal plate 3 of the speaker and the terminal 1 coupled thereto, and the tinsel wire 2 or the condenser 5 is installed. The wire connection method of the loudspeaker terminal is characterized in that a high frequency fusion is performed by inserting a wire extending from the through hole and pressing it with a spot welding electrode. When the present invention described above in detail according to the embodiment as follows.
[실시예 1]Example 1
스피커의 단자판에 단자와 틴셀와이어를 접속하는 방법은, 첨부도면 제2도의 (a)에 도시된 바와같이 스피커의 단자판(3)에 결합공(7)을 천설하고 이와 결합되는 단자(1)에도 결합공(7)을 천설하여 이들이 서로 일치되게 중첩한 다음 틴셀와이어(2)를 상기 단자판(3)의 결합공(7)이 위치하도록 한다음 상기 전극봉(6)을 결합공(7)의 상·하측에 서로 압착시키고 고주파 전류를 흘리면 단자판(3)과 단자(1) 및 틴셀와이어(2)가 일체로 녹아서 첨부도면 제3도의 (a)와 같이 서로 융착되는 것이다.The method of connecting the terminal and the tinsel wire to the terminal plate of the speaker is also provided in the terminal 1 which is provided with a coupling hole 7 in the terminal plate 3 of the speaker as shown in FIG. The coupling holes 7 are laid out so that they overlap each other, and then the tinsel wire 2 is positioned so that the coupling holes 7 of the terminal plate 3 are positioned. Then, the electrode 6 is placed on the coupling holes 7. When the terminal plate 3, the terminal 1, and the tinsel wire 2 are melted together by pressing each other and flowing high frequency current, they are fused together as shown in FIG.
이와같이 서로 융착된 단자판과 단자 및 틴셀와이어는 다른 이 물질이 첨가되지 않은 상태로 접속됨으로서 도전율이 양호하게 되는 것이다.In this way, the terminal plate, the terminal, and the tinsel wire fused together are connected to each other in a state where no other substance is added, so that the electrical conductivity is good.
[실시예 2 ]Example 2
스피커의 단자에 콘덴서를 접속하는 방법은, 첨부도면 제2도의 (b)에 도시된 바와 같이 스피커의 프레임(4)에 설치된 단자(1)에 결합공(7)을 천설하고 콘덴서(5)에서 연장된 배선을 관통토록 삽입시키고 상기 콘덴서(15)의 배선이 관통토록 삽입된 단자(1)의 결합공(7)이 서로 대응토록 설치된 두개의 스폿용접용 전극봉(6) 사이에 위치시켜서 상기 전극봉(6)을 단자(1)의 상하양면에 압착시킨후 고주파 전류를 전극봉(6)에 흘리면 단자(1)와 콘덴서(5)에서 연장된 배선이 일체로 녹아서 융착되어 첨부도면 제3도의 (b)와 같이 형성되는 것이다. 이 또한 융착부위에 다른 이 물질이 첨가되지 않으므로서 도전율이 양호하다.In the method of connecting the capacitor to the terminal of the speaker, as shown in (b) of FIG. 2, the coupling hole 7 is installed in the terminal 1 provided in the frame 4 of the speaker, and the condenser 5 The electrode rod is inserted between the two spot welding electrodes 6 provided so that the coupling hole 7 of the terminal 1 through which the extended wiring is inserted and the wiring of the capacitor 15 is inserted therethrough. (6) is pressed onto the upper and lower surfaces of the terminal 1, and when a high frequency current flows through the electrode 6, the wires extending from the terminal 1 and the condenser 5 are melted and fused together, and then (b) of FIG. ) Is formed as This conductivity is also good because no other substance is added to the fusion site.
상기한 바와 같이 본 발명은 스피커에 단자나 틴셀와이어, 콘덴서 등을 접속함에 있어서, 납땜이 아닌 스폿용접을 함으로써 도전율을 높이는 것은 물론 작업환경을 개선하여 인체에 유해한 납 등의 사용을 배제토록 하여 작업자를 보호할 뿐만 아니라 더 나아가서 납 중독 등 작업병을 미연에 방지할수 있는 효과적인 스피커단자의 배선 접속방법인 것이다.As described above, in the present invention, when connecting a terminal, a tinsel wire, a condenser, etc. to a speaker, the spot welding, not soldering, improves the conductivity and improves the working environment, thereby eliminating the use of lead, which is harmful to the human body. In addition, it is an effective speaker terminal wiring connection method that can prevent the work disease such as lead poisoning in advance.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910019695A KR940000586B1 (en) | 1991-11-06 | 1991-11-06 | Method of jointing a distribution of speaker terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910019695A KR940000586B1 (en) | 1991-11-06 | 1991-11-06 | Method of jointing a distribution of speaker terminal |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930011765A KR930011765A (en) | 1993-06-24 |
KR940000586B1 true KR940000586B1 (en) | 1994-01-24 |
Family
ID=19322373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910019695A KR940000586B1 (en) | 1991-11-06 | 1991-11-06 | Method of jointing a distribution of speaker terminal |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR940000586B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100488655B1 (en) * | 2002-05-28 | 2005-05-11 | 에스텍 주식회사 | Fixed structure of tinselwire for speaker |
-
1991
- 1991-11-06 KR KR1019910019695A patent/KR940000586B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR930011765A (en) | 1993-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6920673B2 (en) | Installation of filter capacitors into feedthroughs for implantable medical devices | |
DE112008003425T5 (en) | Semiconductor device and method of making the same | |
JPS5842262A (en) | Connection of lead wire for hybrid integrated circuit | |
KR940000586B1 (en) | Method of jointing a distribution of speaker terminal | |
ES8600101A1 (en) | Method of joining aluminium wire to a copper part by welding or soldering | |
KR20060068965A (en) | Surface-mounted small fuse and manufacturing method of the same | |
CN113178329B (en) | SMD box-packed film capacitor | |
CN202888171U (en) | Thyristor module | |
CN214069020U (en) | Leakage protection plug suitable for automated processing | |
JPH0252425B2 (en) | ||
JPH03124094A (en) | Brazing apparatus for printed circuit board | |
CN209497671U (en) | A kind of pcb board structure of optimizing surface processing | |
JPH0722096A (en) | Hybrid integrated circuit | |
CN210467532U (en) | Electronic wire connecting structure of mutual inductor | |
MY114270A (en) | Terminal frame used to manufacture electronic devices and manufacturing system of terminal frames | |
CN214161246U (en) | Large-current high-voltage lead welding device of power filter | |
JPS5919424Y2 (en) | Package with magnetic capacitor | |
JPS5476130A (en) | Terminal leading-out method of speakers | |
JPH02205385A (en) | Large current substrate device | |
JPH0547508Y2 (en) | ||
CN102931175B (en) | Thyristor module | |
JPS60207231A (en) | Manufacture of magnetron | |
KR810001729B1 (en) | Semiconductor device | |
JPS6023911Y2 (en) | connector | |
CN114902495A (en) | Electrical device and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |