KR930023435A - Flame Retardant Adhesive Composition - Google Patents

Flame Retardant Adhesive Composition Download PDF

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Publication number
KR930023435A
KR930023435A KR1019920007492A KR920007492A KR930023435A KR 930023435 A KR930023435 A KR 930023435A KR 1019920007492 A KR1019920007492 A KR 1019920007492A KR 920007492 A KR920007492 A KR 920007492A KR 930023435 A KR930023435 A KR 930023435A
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KR
South Korea
Prior art keywords
water
soluble
dispersible
adhesive composition
printed circuit
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Application number
KR1019920007492A
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Korean (ko)
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KR950012774B1 (en
Inventor
윤영주
유상현
김태명
Original Assignee
하기주
주식회사 코오롱
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Priority to KR1019920007492A priority Critical patent/KR950012774B1/en
Publication of KR930023435A publication Critical patent/KR930023435A/en
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Publication of KR950012774B1 publication Critical patent/KR950012774B1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

인쇄회로 기판용 접착제 조성물에 있어서, 1) 단말기 또는 측쇄에 아크릴기를 도입한 수분산성 또는 수용성의 폴리우레탄 접착제(a); 수용성 또는 수분산성 에폭시 화합물(b)및 ; 수용성 또는 수분산성 브롬화 에폭시 화합물(c)로 ; 이루어진 수용성 또는 수분산성 폴리머와, 2) 아크릴기를 갖는 인화합물(d)으로 이루어지는 수용성 또는 수분산성 접착제 조성물은 유연성, 내열성, 전기특성 및 내약품성이 좋고 특히 난연성이 우수하다.An adhesive composition for a printed circuit board, comprising: 1) a water-dispersible or water-soluble polyurethane adhesive having an acryl group introduced into a terminal or a side chain (a) ; Water-soluble or water-dispersible epoxy compounds (b) and; As a water-soluble or water-dispersible brominated epoxy compound (c) ; The water-soluble or water-dispersible adhesive composition which consists of the water-soluble or water-dispersible polymer which consists of these, and 2) the phosphorus compound (d) which has an acryl group is good in flexibility, heat resistance, an electrical property, chemical resistance, and especially excellent in flame retardance.

Description

난연성 접착제 조성물Flame Retardant Adhesive Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (6)

1) 단말기 또는 측쇄에 아크릴기를 도입한 수분산성 또는 수용성의 폴리우레탄 접착제(a); 수용성 또는 수분산성 에폭시 화합물(b)및 ; 수용성 또는 수분산성 브롬화 에폭시 화합물(c)로 ; 이루어진 수용성 또는 수분산성 폴리머와, 2) 아크릴기를 갖는 인화합물(d)으로 구성되는 것을 특징으로 하는 수용성 또는 수분산성의 인쇄회로 기판용 난연성 접착제 조성물.1) a water-dispersible or water-soluble polyurethane adhesive having an acrylic group introduced into the terminal or side chain (a) ; Water-soluble or water-dispersible epoxy compounds (b) and; As a water-soluble or water-dispersible brominated epoxy compound (c) ; A flame-retardant adhesive composition for water-soluble or water-dispersible printed circuit boards, comprising a water-soluble or water-dispersible polymer composed of 2 and a phosphorus compound (d) having an acryl group. 제1항에 있어서, 상기한 브롬화 에폭시 화합물(c)는 디브로모네오펜틸글리콜 디글리시딜 에테르, 디브로모페닐 글리시딜 에테르, 폴리브로모 비스페놀 A형 에폭시 유화물, 폴리브로모 노블락형 에폭시 유화물, 폴리브로모 비스페놀 F형 에폭시 유화물 중에서 1종 이상 선택되어지는 것을 특징으로 하는 인쇄회로 기판용 난연성 접착제 조성물.The method of claim 1, wherein the brominated epoxy compound (c) is dibromoneopentyl glycol diglycidyl ether, dibromophenyl glycidyl ether, polybromo bisphenol A epoxy emulsion, polybromo noblock type Flame retardant adhesive composition for printed circuit boards, characterized in that at least one selected from epoxy emulsions and polybromo bisphenol F-type epoxy emulsions. 제1항에 또는 제2항에 있어서, 상기 브롬화 에폭시 화합물(c)는 상기한(b)수용성 또는 수분산성 폴리머의 고형분 100중량부에 대하여 브롬 함량이 5∼20중량부 되도록 첨가하는 것을 특징으로 하는 인쇄회로 기판용 난연성 접착제 조성물.The brominated epoxy compound (c) is added in an amount of 5 to 20 parts by weight based on 100 parts by weight of the solid content of the water-soluble or water-dispersible polymer (b) . Flame-retardant adhesive composition for printed circuit boards. 제1항에 있어서, 상기 브롬화 에폭시 화합물(c)와 수용성 또는 수분산성 에폭시 화합물(b)를 합한 량이 상기한 수용성 또는 수분산성 폴리우레탄 접착제(a)100중량부에 대하여 20∼50중량부인 것을 특징으로 하는 인쇄회로 기판용 난연성 접착제 조성물The amount of the brominated epoxy compound (c) and the water-soluble or water-dispersible epoxy compound (b) combined is 20 to 50 parts by weight based on 100 parts by weight of the water-soluble or water-dispersible polyurethane adhesive (a). Flame retardant adhesive composition for printed circuit boards 제1항에 있어서, 상기한 아크릴기를 갖는 인화합물(d)은, 상기한 수용성 또는 수분산성 폴리머의 고형분 100중량부에 대하여 3∼20중량부 첨가되는 것을 특징으로 하는 인쇄회로 기판용 난연성 접착제 조성물.The flame-retardant adhesive composition for a printed circuit board according to claim 1, wherein the phosphorus compound (d) having an acryl group is added in an amount of 3 to 20 parts by weight based on 100 parts by weight of the solid content of the water-soluble or water-dispersible polymer. . 제1항에 있어서, 상기한 수분성 또는 수분산성 에폭시 화합물(d)는 지방족 글리세딜 에테르, 함질소헤테로시클릭 에폭시 화합물, 카르본산 글리시딜 에테르, 노블락형 에폭시 유화물, 크레졸형 에폭시 유화물, 비스페놀A형 에폭시 유화물 중에서 하나 이상 선택되어지는 것을 특징으로 하는 인쇄회로 기판용 난연성 접착제.The method of claim 1, wherein the water-soluble or water-dispersible epoxy compound (d) is an aliphatic glyceryl ether, nitrogen-containing heterocyclic epoxy compound, carboxylic acid glycidyl ether, noblock type epoxy emulsion, cresol type epoxy emulsion, bisphenol A flame-retardant adhesive for printed circuit boards, characterized in that at least one of the A-type epoxy emulsions is selected. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920007492A 1992-05-01 1992-05-01 Nonflammable adhesive composition KR950012774B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920007492A KR950012774B1 (en) 1992-05-01 1992-05-01 Nonflammable adhesive composition

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Application Number Priority Date Filing Date Title
KR1019920007492A KR950012774B1 (en) 1992-05-01 1992-05-01 Nonflammable adhesive composition

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KR930023435A true KR930023435A (en) 1993-12-18
KR950012774B1 KR950012774B1 (en) 1995-10-21

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KR1019920007492A KR950012774B1 (en) 1992-05-01 1992-05-01 Nonflammable adhesive composition

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GB201709925D0 (en) * 2017-06-21 2017-08-02 Royal College Of Art Composite structure

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