KR920015641A - 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법 - Google Patents
전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법 Download PDFInfo
- Publication number
- KR920015641A KR920015641A KR1019920000333A KR920000333A KR920015641A KR 920015641 A KR920015641 A KR 920015641A KR 1019920000333 A KR1019920000333 A KR 1019920000333A KR 920000333 A KR920000333 A KR 920000333A KR 920015641 A KR920015641 A KR 920015641A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- gate electrode
- semiconductor device
- field effect
- effect transistor
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 230000005669 field effect Effects 0.000 title claims 6
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/66583—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with initial gate mask or masking layer complementary to the prospective gate location, e.g. with dummy source and drain contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28114—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor characterised by the sectional shape, e.g. T, inverted-T
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7836—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a significant overlap between the lightly doped extension and the gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제6도∼제8도는 본 발명에 따른 반도체 디바이스 제조방법을 단계적으로 도시한 단면도.
Claims (8)
- 게이트 전극이 최소한 두부분으로 구성되어 그중 베이스 부분은 소오스 영역으로부터 드레인 영역으로의 방향에 있어서 치수가 중첩되는 제2부분보다 크고, 게이트 전격의 베이스 부분이 에칭된 제1층이 제공되고 상기 제1층은 제2층으로 코팅되며, 형성될 게이트 전극 영역의 제2층에 개구가 제공되고, 상기 개구가 제3층으로 채워진 게이트 전극과 소오스 영역 및 드레인 영역을 지니고 있는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법에 있어서, 상기 제3층이 어셈블리 전반에 걸쳐 코팅되고, 그리고 게이트 전극의 제2부분이 형성되도록 개구에 임의 부분이 남아있게 될때까지 제3층에 부피축소 처리가 가해지게 하는 것을 특징으로 하는 전계 효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 제1항에 있어서, 에칭처리가 부피축소 처리로 수행되는 것을 특징으로 하는 전계 효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 제2항에 있어서, 제3층이 다시 에칭되기전, 역시 이후에 다시 에칭되는 포토레지스터 층이 제공되는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 제1 또는 제2항에 있어서, 비정질 실리콘 층 및 다결정 실리콘이 각각 제1 및 제3층으로 이용되는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 제1항에 있어서, 폴리싱 처리가 부피 축소 처리로 수행되는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 전술한 항들중 임의 한 항에 있어서, 실리콘 산화물 층이 제2층으로 이용되는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 전술전 항들중 임의 한항에 있어서, 제3층이 다시 에칭된 후 실리콘 산화물 층이 제거되는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.
- 제7항에 있어서, 제2층의 제거후, 소오스 및 드레인 영역의 제1부분이 형성되도록 도핑 처리를 행하고, 이어서 게이트 전극의 제2부분을 따라 에지부를 형성시키고, 그후 제1층으로부터 게이트 전극의 베이스 부분을 에칭하고, 게이트 전극의 제2부분 및 에지부를 마스크로서의 역할을 하도록 하고 그리고 나서 크게 도핑된 소오스및 드레인 영역의 제2부분이 형성되도록 도핑 처리를 행하는 것을 특징으로 하는 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9100064A NL9100064A (nl) | 1991-01-16 | 1991-01-16 | Werkwijze voor het vervaardigen van een halfgeleiderinrichting voorzien van een veldeffecttransistor. |
NL9100064 | 1991-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920015641A true KR920015641A (ko) | 1992-08-27 |
Family
ID=19858727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920000333A KR920015641A (ko) | 1991-01-16 | 1992-01-13 | 전계효과 트랜지스터가 구비된 반도체 디바이스 제조방법 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0495541A1 (ko) |
JP (1) | JPH04334029A (ko) |
KR (1) | KR920015641A (ko) |
NL (1) | NL9100064A (ko) |
TW (1) | TW198132B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2718287B1 (fr) * | 1994-03-31 | 1996-08-02 | Alain Straboni | Procédé de fabrication d'un transistor à effet de champ à grille isolée, en particulier de longueur de canal réduite, et transistor correspondant. |
KR100295639B1 (ko) * | 1998-01-14 | 2001-08-07 | 김영환 | 플러그형성방법 |
CN103594368B (zh) * | 2012-08-15 | 2016-08-10 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4677736A (en) * | 1986-04-17 | 1987-07-07 | General Electric Company | Self-aligned inlay transistor with or without source and drain self-aligned metallization extensions |
US4907048A (en) * | 1987-11-23 | 1990-03-06 | Xerox Corporation | Double implanted LDD transistor self-aligned with gate |
US4895520A (en) * | 1989-02-02 | 1990-01-23 | Standard Microsystems Corporation | Method of fabricating a submicron silicon gate MOSFETg21 which has a self-aligned threshold implant |
US4984042A (en) * | 1989-02-13 | 1991-01-08 | Motorola, Inc. | MOS transistors using selective polysilicon deposition |
JPH0758701B2 (ja) * | 1989-06-08 | 1995-06-21 | 株式会社東芝 | 半導体装置の製造方法 |
-
1991
- 1991-01-16 NL NL9100064A patent/NL9100064A/nl not_active Application Discontinuation
- 1991-06-11 TW TW080104532A patent/TW198132B/zh active
-
1992
- 1992-01-07 EP EP92200022A patent/EP0495541A1/en not_active Withdrawn
- 1992-01-13 KR KR1019920000333A patent/KR920015641A/ko not_active Application Discontinuation
- 1992-01-16 JP JP4005805A patent/JPH04334029A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0495541A1 (en) | 1992-07-22 |
TW198132B (ko) | 1993-01-11 |
JPH04334029A (ja) | 1992-11-20 |
NL9100064A (nl) | 1992-08-17 |
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