KR920005677A - 전자장치 및 전자장치의 냉각방법 - Google Patents

전자장치 및 전자장치의 냉각방법 Download PDF

Info

Publication number
KR920005677A
KR920005677A KR1019910013068A KR910013068A KR920005677A KR 920005677 A KR920005677 A KR 920005677A KR 1019910013068 A KR1019910013068 A KR 1019910013068A KR 910013068 A KR910013068 A KR 910013068A KR 920005677 A KR920005677 A KR 920005677A
Authority
KR
South Korea
Prior art keywords
refrigerant
cooling
coolant
electronic device
unit
Prior art date
Application number
KR1019910013068A
Other languages
English (en)
Other versions
KR940008382B1 (ko
Inventor
시게루 고이즈미
시즈오 즈시
미쓰오 고미야
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2204690A external-priority patent/JPH0488517A/ja
Priority claimed from JP2256409A external-priority patent/JPH04133497A/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR920005677A publication Critical patent/KR920005677A/ko
Application granted granted Critical
Publication of KR940008382B1 publication Critical patent/KR940008382B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음

Description

전자장치 및 전자장치의 냉각방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전자장치의 전체구성의 단면도,
제2도는 전자장치의 전체구성의 사시도,
제8도는 냉매누출검출과 냉매감소속도검출의 동작을 설명하는 플로차트,
제9도는 정보처리장치가 실행중의 처리를 기억매체에 퇴피시키는 동작을 설명하는 플로차트.

Claims (19)

  1. 발열전자부품과, 냉매가 공급되어 이 발열전자부품을 냉각하는 냉각재킷을 가진 전자회로부와, 상기 냉각재킷으로부터의 냉매를 냉각하는 냉매냉각수단과, 냉각된 냉매를 상기 냉각재킷에 공급하는 냉매공급수단을 가진 냉매 냉각부와, 칸막이판을 구비하고, 상기 전화회로브와 상기 냉매냉각부가 동일상자체내에 수납되고, 상기 칸막이판이 상기 전자회로부와 상기 냉매냉각부의 사이를 칵막이하는 위치에 배치되는 전자장치.
  2. 제1항에 있어서, 상기 냉매냉각부는 상기 전자회로부에 대하여 최소한 바로 위가 되지 않도록 배치되는 전자장치.
  3. 제1항에 있어서, 상기 냉매냉각부는 상기 전자회로부측에 칸막이판이 배설되어 있는 하나의 프레임체 또는 기대(基)에 배설되어서, 일체적이 냉각유닛구성으로 이루어지는 전자장치.
  4. 제1항에 있어서, 상기 냉매냉각수단은 상기 냉매가 통과하는 핀부착냉매배관과, 이 핀부착냉매배관에 바람을 보내는 냉각팬을 구비하는 전자장치.
  5. 제1항에 있어서, 상기 전자회로부내로부터의 냉매배관의 단부가 상기 칸막이판보다 상기 냉매냉각부측에 위치하고, 그곳에서 이 냉매냉각부로부터의 냉매배관과 접속되는 전자장치.
  6. 제1항에 있어서, 상기 냉매의 누출을 검출하는 냉매누출검출수단과, 이 냉매의 누출이 검출되면 경보를 발하는 냉매누출경보수단을 더 구비하는 전자장치.
  7. 제6항에 있어서, 상기 냉매의 누출이 검출되면, 상기 전자회로부에서 실행중인 처리 또는 동작을 적절한 양태로 종료시키는 처리 종료수단을 구비하는 전자장치.
  8. 제6항에 있어서, 상기 냉매의 누출이 검출되면, 상기 전자회로부로의 상기 냉매의 공급을 정지시키는 냉매공급정지수단을 구비하는 전자장치.
  9. 제3항에 있어서, 상기 냉각유닛은 냉매를 냉각하는 냉매냉각수단과, 상기 냉매를 냉각대상측에 공급하는냉매공급수단과, 상기 냉매의 누출을 검출하는 냉매누출검출수단과, 상기 냉매의 누출이 검출되면, 경보를 발하는 냉매누출경보수단과, 상기 냉매의 누출이 검출되면, 상기 냉매공급수단을 정지시키는 냉매공급정지수단을 구비하는 전자장치.
  10. 제9항에 있어서, 상기 냉매냉각수단과 상기 냉매공급수단과 상기 냉매누출검출수단과 상기 냉매누출경보수단과 상기 냉매공급정지수단을 가진 상기 냉매냉각부가 고정되어 최소한 한쪽의 면에 칸막이판이 배설되어 있는 프레임체를 구비하고, 상기 칸막이판에는 냉각대상측의 냉매배관과 상기 냉매냉각부측의 냉매배관을 접속하는 접속수단이 배설되는 전자장치.
  11. 제6항에 있어서, 상기 냉매누출검출수단은 상기 냉각대상측에 공급하는 냉매의 가속속도를 검출하는 냉매감속속도검출수단을 가지며, 상기 냉매의 감소속도가 미리 정해져 있는 값을 초과하면 냉매가 누출되고 있다는 결정하는 전자장치.
  12. 제9항에 있어서, 상기 냉매누출검출수단은 상기 냉각대상측에 공급하는 냉매의 가속속도를 검출하는 냉매감속속도검출수단을 가지며, 상기 냉매의 감소속도가 미리 정해져 있는 값을 초과하면 냉매가 누출되고 있다는 결정하는 전자장치.
  13. 제1항에 있어서, 또한 상기 냉각재킷과 상기 냉매냉각수단과 상기 냉매공급수단과의 사이에서 냉매를 송출하는 관로를 가지며, 이 관로가 U자를 형성하는 부분의 하부에 냉매배출용 드레인을 배설하는 전자장치.
  14. 제3항에 있어서, 또한 상기 냉각재킷과 상기 냉매냉각수단과 상기 냉매공급수단과의 사이에서 냉매를 송출하는 관로를 가지며, 이 관로가 U자를 형성하는 부분의 하부에 냉매배출용 드레인을 배설하는 전자장치.
  15. 발열전자부품과, 상기 발열전자부품을 냉각하는 냉매의 순환경로로 이루어지고, 이 순환경로는 (a)상기 발열전자부품을 냉각하는 냉각재킷과, (b)상기 냉각재킷으로부터의 냉매를 냉각하는 냉매냉각수단과, (c)냉각된 냉매를 상기 냉각재킷에 공브하는 냉매공급수단과, (d)냉각재킷과 냉매냉각수단과 냉매공급수단과의 사이에서 냉매를 송출하는 관로를 구비하고, 상기 발열전자부품과, 상기 순환경로가 동일상자채내에 수납되고, 상기 순환경로가 U자를 형성하는 하부에 냉매배출용 드레인을 배설하는 전자장치.
  16. 제15항에 있어서, 상기 순환경로에는 또한 대기개방형 탱크가 배설되고, 이 대기개방형 탱크는 이 순환경로의 최상뷔에 배설되는 전자장치.
  17. 제15항에 있어서, 상기 순환경로가 역U자를 형성하는 부분의 상부에 공기밸브를 배설하는 전자장치.
  18. 전자장치의 발열전자부품에 냉각재킷을 배설하는 스텝과, 상기 전자장치의 냉매를 냉각하는 냉매냉각장치와, 냉각된 냉매를 상기 냉각재킷에 공급하는 냉매공급장치를 전자장치의 동일상 자체내에 배설하는 스텝과, 상기 전자부품과 상기 냉매냉각장치와 냉매공급장치의 사이에 칸막이판을 배설하는 스텝과, 상기 냉매냉각장치에서 냉각된 냉매를 상기 냉매공급장치에 의해 상기 냉각재킷에 공급하고, 상기 냉각재킷에서 상기 발열전자부품을 냉각하는 스텝으로 이루어지는 발열전자부품을 가진 전자장치의 냉각방법.
  19. 제18항에 있어서, 또한 상기 냉각재킷과 냉매냉각장치와 냉매 공급장치와의 사이에서 냉매를 순환시키는 순환경로의 U자부의 하부에 냉매배출용 드레인을 배설하는 스텝을 더 포함하는 발열전자부품을 가진 전자장치의 냉각방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910013068A 1990-08-01 1991-07-30 전자장치 및 전자장치의 냉각방법 KR940008382B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP90-204690 1990-08-01
JP2204690A JPH0488517A (ja) 1990-08-01 1990-08-01 電子装置
JP90-204,690 1990-08-01
JP2256409A JPH04133497A (ja) 1990-09-26 1990-09-26 電子装置の冷却構造
JP90-256409 1990-09-26
JP90-256,409 1990-09-26

Publications (2)

Publication Number Publication Date
KR920005677A true KR920005677A (ko) 1992-03-28
KR940008382B1 KR940008382B1 (ko) 1994-09-12

Family

ID=26514595

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910013068A KR940008382B1 (ko) 1990-08-01 1991-07-30 전자장치 및 전자장치의 냉각방법

Country Status (3)

Country Link
US (1) US5323847A (ko)
KR (1) KR940008382B1 (ko)
DE (1) DE4125528C2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100371593B1 (ko) * 1999-02-04 2003-02-17 이병오 다기능 조명대

Families Citing this family (165)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
DE4327444A1 (de) * 1993-08-14 1995-02-16 Indramat Gmbh Kühleinrichtung für einen Schaltschrank
DE4330924C1 (de) * 1993-09-13 1994-11-17 Loh Kg Rittal Werk Kühleinrichtung für einen Schaltschrank oder ein Elektronikgehäuse
DE4413130C2 (de) * 1994-04-19 1997-12-18 Loh Kg Rittal Werk Kühlgerät
DE4413128C2 (de) * 1994-04-19 1997-12-18 Loh Kg Rittal Werk Kühlgerät
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
GB2297153B (en) * 1995-01-23 1999-05-19 Pfannenberg Otto Gmbh Cooling device for cooling electric and electronic components and batteries in a switch cabinet
SE511417C2 (sv) * 1997-02-04 1999-09-27 Telia Ab Förfarande och anordning för kylning av elektronik/ datorutrustning samt användning därav
US5927094A (en) * 1997-12-15 1999-07-27 Gateway 2000, Inc. Apparatus for cooling an electronic device
DE19815645C1 (de) * 1998-04-07 1999-08-19 Siemens Ag Umrichteranordnung mit Kühleinrichtung
US6305406B1 (en) * 1998-06-02 2001-10-23 Emerson Electric Co. Spray hood protector in a fluid-based cooling system
US9119705B2 (en) 1998-06-08 2015-09-01 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
JP2000101273A (ja) * 1998-07-22 2000-04-07 Denso Corp 電子部品の冷却構造
JP3315649B2 (ja) * 1998-08-11 2002-08-19 富士通株式会社 電子機器
JP2000216575A (ja) * 1999-01-22 2000-08-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
AU4033100A (en) * 1999-03-29 2000-10-16 Caterpillar Inc. Modular chilled fluid system and method for providing chilled fluid for cooling
DE29912206U1 (de) 1999-07-13 1999-10-07 Gutgesell, Karsten, 68305 Mannheim Aktivkühler für Microprozessoren
WO2001035199A1 (en) * 1999-11-08 2001-05-17 Lee Mok Hyoung Heat transfer apparatus using refrigerant and computer having the same
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US7630198B2 (en) 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6307746B1 (en) 1999-12-06 2001-10-23 Gateway, Inc. Power adapter having a thermal cooling assembly for a digital information appliance
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US6462949B1 (en) 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
US6422304B1 (en) * 2000-08-07 2002-07-23 Shari Lynn Slovikosky System and method for cooling a central processing unit
US6371157B1 (en) 2000-09-29 2002-04-16 Thales Broadcast & Multimedia, Inc. Method, system and computer program product for self-draining plumbing for liquid-cooled devices
KR100359828B1 (ko) * 2000-12-01 2002-11-07 엘지전자 주식회사 반도체용 냉동식 냉각장치
KR100909544B1 (ko) * 2001-03-02 2009-07-27 산요덴키가부시키가이샤 전자 장치
US6616469B2 (en) * 2001-03-12 2003-09-09 Tyco Electronics Logistics Ag Electrical and fluid interconnect
DE10112389A1 (de) * 2001-03-15 2002-10-02 Martin Hess Mobilfunkstation
US6421240B1 (en) * 2001-04-30 2002-07-16 Hewlett-Packard Company Cooling arrangement for high performance electronic components
US6646879B2 (en) 2001-05-16 2003-11-11 Cray Inc. Spray evaporative cooling system and method
CA2352997A1 (en) 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
WO2003007372A2 (en) * 2001-07-13 2003-01-23 Coolit Systems Inc. Cooling apparatus for electronic devices
DE10136006A1 (de) 2001-07-24 2003-02-20 Infineon Technologies Ag Vorrichtung zum Kühlen elektrischer oder elektronischer Geräte
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
JP4512296B2 (ja) * 2001-08-22 2010-07-28 株式会社日立製作所 可搬型情報処理装置の液冷システム
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
CA2473792C (en) * 2002-01-29 2010-11-30 Telefonaktiebolaget L M Ericsson (Publ) A method and system of cooling a cabinet using dynamically controlled ciculating cooling fluid
KR100464046B1 (ko) * 2002-03-14 2005-01-03 엘지전자 주식회사 컴퓨터의 냉각장치
US6749012B2 (en) * 2002-04-30 2004-06-15 Intel Corporation Liquid cooling system for processors
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US7143615B2 (en) * 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
JP3641258B2 (ja) * 2002-08-26 2005-04-20 株式会社東芝 電子機器
US6714412B1 (en) * 2002-09-13 2004-03-30 International Business Machines Corporation Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
AU2003270279A1 (en) * 2002-09-28 2004-04-23 Ebm-Papst St. Georgen Gmbh And Co. Kg Arrangement and method for removing heat from a component which is to be cooled
JP2004139187A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
US6754076B2 (en) * 2002-10-30 2004-06-22 International Business Machines Corporation Stackable liquid cooling pump
US6970355B2 (en) * 2002-11-20 2005-11-29 International Business Machines Corporation Frame level partial cooling boost for drawer and/or node level processors
US6775137B2 (en) * 2002-11-25 2004-08-10 International Business Machines Corporation Method and apparatus for combined air and liquid cooling of stacked electronics components
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US6809928B2 (en) * 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
US20040190253A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Channeled heat sink and chassis with integrated heat rejector for two-phase cooling
US20040215764A1 (en) * 2003-04-23 2004-10-28 Sun Microsystems, Inc. Method, system, and program for rendering a visualization of aggregations of network devices
DE10326803B4 (de) * 2003-06-13 2005-09-22 Rittal Gmbh & Co. Kg Anordnung zur Kühlung eines Schaltschrankes
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
WO2005007060A2 (en) 2003-07-18 2005-01-27 Thermotek, Inc. Compression sequenced thermal therapy system
DE10334798B4 (de) * 2003-07-30 2005-06-23 Fujitsu Siemens Computers Gmbh Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten
DE10341246B3 (de) * 2003-09-01 2005-02-17 Lg Thermotechnologies Gmbh Kühlsystem für elektronische Geräte, insbesondere für Computer
US6999316B2 (en) * 2003-09-10 2006-02-14 Qnx Cooling Systems Inc. Liquid cooling system
JP4140495B2 (ja) * 2003-09-25 2008-08-27 株式会社日立製作所 冷却モジュール
US7000467B2 (en) * 2003-12-16 2006-02-21 International Business Machines Corporation Method, system and program product for monitoring rate of volume change of coolant within a cooling system
US7484552B2 (en) * 2003-12-19 2009-02-03 Amphenol Corporation Modular rackmount chiller
US6966358B2 (en) * 2004-01-27 2005-11-22 Gateway Inc. Portable augmented silent cooling docking station
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US7003971B2 (en) * 2004-04-12 2006-02-28 York International Corporation Electronic component cooling system for an air-cooled chiller
US7151667B2 (en) * 2004-04-12 2006-12-19 Nvidia Corporation Modular, scalable thermal solution
US6955212B1 (en) * 2004-04-20 2005-10-18 Adda Corporation Water-cooler radiator module
US7330350B2 (en) * 2004-06-04 2008-02-12 Cray Inc. Systems and methods for cooling computer modules in computer cabinets
US7304842B2 (en) * 2004-06-14 2007-12-04 Cray Inc. Apparatuses and methods for cooling electronic devices in computer systems
US7257000B2 (en) * 2004-07-07 2007-08-14 Amphenol Corporation Thermally enhanced pressure regulation of electronics cooling system
US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
US7086247B2 (en) * 2004-08-31 2006-08-08 International Business Machines Corporation Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
KR100624092B1 (ko) * 2004-09-16 2006-09-18 잘만테크 주식회사 컴퓨터
US7355852B2 (en) * 2004-09-30 2008-04-08 Amphenol Corporation Modular liquid cooling of electronic assemblies
US20060113066A1 (en) * 2004-12-01 2006-06-01 Intel Corporation Heat exchanger configuration for pumped liquid cooling computer systems
US7219714B1 (en) * 2005-08-04 2007-05-22 Sun Microsystems, Inc. Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
US7190583B1 (en) * 2005-08-29 2007-03-13 Verigy Pte Ltd Self contained, liquid to air cooled, memory test engineering workstation
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
US7265975B2 (en) * 2005-11-01 2007-09-04 Hua-Hsin Tsai CPU heat dissipating device structure
US8051897B2 (en) * 2005-11-30 2011-11-08 International Business Machines Corporation Redundant assembly for a liquid and air cooled module
US20070121295A1 (en) * 2005-11-30 2007-05-31 International Business Machines Corporation Hybrid liquid-air cooled module
US7681410B1 (en) * 2006-02-14 2010-03-23 American Power Conversion Corporation Ice thermal storage
US7412844B2 (en) * 2006-03-07 2008-08-19 Blue Zone 40 Inc. Method and apparatus for cooling semiconductor chips
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
JP4842040B2 (ja) * 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP2008027370A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP5283836B2 (ja) * 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP2008027374A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP4781929B2 (ja) 2006-07-25 2011-09-28 富士通株式会社 電子機器
US20080082219A1 (en) * 2006-09-29 2008-04-03 Belady Christian L Heat sink system management
US7400505B2 (en) * 2006-10-10 2008-07-15 International Business Machines Corporation Hybrid cooling system and method for a multi-component electronics system
US7408776B2 (en) * 2006-10-10 2008-08-05 International Business Machines Corporation Conductive heat transport cooling system and method for a multi-component electronics system
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
US20080196858A1 (en) * 2007-02-20 2008-08-21 Cheng-Fu Yang Heat exchanger assembly
USD662212S1 (en) 2007-04-10 2012-06-19 Thermotek, Inc. Butterfly wrap
BRPI0704566A2 (pt) * 2007-09-18 2009-05-12 Whirlpool Sa estação de docagem para um computador
US8611083B2 (en) * 2007-11-28 2013-12-17 Hewlett-Packard Development Company, L.P. System and method for cooling a computer
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US8701746B2 (en) 2008-03-13 2014-04-22 Schneider Electric It Corporation Optically detected liquid depth information in a climate control unit
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
DE102008030308A1 (de) * 2008-06-30 2009-12-31 Lindenstruth, Volker, Prof. Gebäude für ein Rechenzentrum mit Einrichtungen zur effizienten Kühlung
WO2010025129A1 (en) * 2008-08-25 2010-03-04 Despatch Industries Limited Partnership Enclosure and method for temperature-sensitive components
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US20100124022A1 (en) * 2008-11-14 2010-05-20 Suad Causevic Thermoelectric cooling apparatus and method for cooling an integrated circuit
US20100129140A1 (en) * 2008-11-26 2010-05-27 Coolit Systems Inc. Connector for a liquid cooling system in a computer
US8844609B2 (en) * 2009-03-11 2014-09-30 Alcatel Lucent Cooling manifold
US8035972B2 (en) * 2009-07-31 2011-10-11 Oracle America, Inc. Method and apparatus for liquid cooling computer equipment
US8416572B2 (en) 2010-01-20 2013-04-09 Dell Products L.P. System and method for cooling information handling resources
US20110247780A1 (en) * 2010-04-12 2011-10-13 Alcatel-Lucent Usa, Incorporated Electronic system cooler
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8472182B2 (en) 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
US8248801B2 (en) 2010-07-28 2012-08-21 International Business Machines Corporation Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat
US9874413B2 (en) 2011-05-25 2018-01-23 International Business Machines Corporation Data center with dual radiator cabinets for redundant operation
CN102819303A (zh) * 2011-06-09 2012-12-12 鸿富锦精密工业（深圳）有限公司 计算机机箱
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
EP2746110B1 (en) * 2011-08-17 2016-04-20 Hitachi, Ltd. Vehicle equipment temperature adjusting system
US9869499B2 (en) 2012-02-10 2018-01-16 Carrier Corporation Method for detection of loss of refrigerant
EP2841121B1 (en) 2012-04-24 2020-12-02 Thermotek, Inc. System for therapeutic use of ultra-violet light
EP2663172A1 (en) 2012-05-11 2013-11-13 eCube Computing GmbH Method for operating a data centre with efficient cooling means
US20140190568A1 (en) * 2013-01-08 2014-07-10 GM Global Technology Operations LLC Coolant Activated Rechargeable Energy Storage System Drain Plug
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US20140262158A1 (en) * 2013-03-15 2014-09-18 Parker-Hannifin Corporation Two-phase cooling system
EP3068481B1 (en) 2013-11-11 2020-01-01 Thermotek, Inc. System for wound care
DE102014013653B4 (de) * 2014-09-15 2016-04-07 Adwatec Oy Anordnung und Verfahren zum Kühlen flüssigkeitsgekühlter Elektronik
DE102015215558B4 (de) 2015-08-14 2018-10-18 SCHäFER WERKE GMBH Rohrleitungsdurchführung in einem Schrank für elektronische Komponenten
DE102015215535B4 (de) 2015-08-14 2019-02-21 SCHäFER WERKE GMBH Kühleinrichtung mit einem Wärmetauscher und einem Spritzschutz sowie Vorrichtung mit einem Gehäuse und einer solchen Kühleinrichtung
FR3042886B1 (fr) * 2015-10-26 2018-05-11 Calyos Sa Equipement informatique avec bloc d'alimentation electrique refroidi
DE102016201723B4 (de) 2016-02-04 2019-03-07 SCHäFER WERKE GMBH Sidecooler mit einem Wärmetauscher zur Anordnung neben einem Schrank für elektronische Komponenten
FR3048640B1 (fr) * 2016-03-11 2018-04-06 Alstom Transport Technologies Coffre de traction d'un vehicule ferroviaire avec systeme de refroidissement, procede de mise en oeuvre et vehicule ferroviaire associes
CN106058675B (zh) * 2016-06-12 2018-01-16 如东县燕川供水服务有限公司 一种适用性强的电源箱
FR3057341B1 (fr) * 2016-10-10 2019-05-24 Bull Sas Module compact de refroidissement liquide de serveur informatique
US10162396B2 (en) * 2017-04-18 2018-12-25 Baidu Usa Llc Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks
US10888023B2 (en) 2018-09-17 2021-01-05 Hewlett Packard Enterprise Development Lp Leak mitigation system for a cooling system
JP7231721B2 (ja) 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド 搬送システム
US11284535B2 (en) * 2019-08-30 2022-03-22 Hewlett Packard Enterprise Development Lp Leak mitigation in a cooling system for computing devices
US11284543B2 (en) * 2020-05-21 2022-03-22 Baidu Usa Llc Data center point of delivery layout and configurations
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
CN112164997B (zh) * 2020-10-19 2022-08-02 广东海洋大学 一种内置散热防护结构的户外用防爆型立式电气控制柜
CN112490915B (zh) * 2020-12-21 2022-05-13 保定富阳电力科技有限公司 一种具有散热功能的配电箱
CN112911905B (zh) * 2021-02-04 2022-05-24 华南理工大学 一种机柜式服务器间接冷板式液冷防漏***及控制方法
CN113097897B (zh) * 2021-04-13 2022-10-28 硕维科技（杭州）有限公司 一种便于安装和检修的配电箱

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1140613B (de) * 1959-07-09 1962-12-06 Decca Ltd Elektronische Baugruppe mit einem geschlossenen Gehaeuse und mit einer Kuehlanlage
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
DE1806029A1 (de) * 1968-10-30 1970-05-21 Bbc Brown Boveri & Cie Kuehlvorrichtung fuer el. Schalt- und Steuerschraenke,die hermetisch abgeschlossen sind
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
GB1521464A (en) * 1975-10-15 1978-08-16 Thorn Automation Ltd Mounting of electrical equipment for cooling
DE2618262C3 (de) * 1976-04-27 1980-01-10 Ing. Rolf Seifert Electronic, 5828 Ennepetal Wärmetauscher
DE2638702C3 (de) * 1976-08-27 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kühlvorrichtung
DE2651015C2 (de) * 1976-11-09 1980-09-04 Honeywell-Elac-Nautik Gmbh, 2300 Kiel Chassis für einen elektrischen Leistungsverstärker
DE3003398A1 (de) * 1979-02-02 1980-08-07 Sperry Corp Kupplung fuer fluessige oder gasfoermige medien
US4365666A (en) * 1979-05-12 1982-12-28 Rolf Seifert Heat exchanger
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
CH639517A5 (en) * 1980-10-31 1983-11-15 Appelsa Applic Electr Sa Cooling device for an installation containing electronic equipment
CH658511A5 (de) * 1982-04-21 1986-11-14 Ernst H Furrer Fa Kuehlaggregat fuer ein geschlossenes geraet, insbesondere fuer einen schaltschrank.
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
KR910004026B1 (ko) * 1985-03-20 1991-06-22 도오꾜오덴끼 가부시끼가이샤 잉크 도트 프린터
DE3679978D1 (de) * 1985-12-13 1991-08-01 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
DE3602489A1 (de) * 1986-01-28 1987-07-30 Siemens Ag Vorrichtung zur erfassung von undichtigkeiten und leckagen einer fluessigkeitsgekuehlten vorrichtung
DE3602511A1 (de) * 1986-01-28 1987-07-30 Siemens Ag Vorrichtung zur erfassung von undichtigkeiten und leckagen einer fluessigkeitsgekuehlten vorrichtung
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
DE3784921T2 (de) * 1986-10-14 1993-09-30 Unisys Corp Flüssigkeitskühlsystem für integrierte schaltungen.
DE3721901A1 (de) * 1987-07-02 1989-01-12 Heidelberger Druckmasch Ag Schaltschrank
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
GB2213920B (en) * 1987-12-18 1991-11-27 William Armond Dunne Cooling system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100371593B1 (ko) * 1999-02-04 2003-02-17 이병오 다기능 조명대

Also Published As

Publication number Publication date
DE4125528C2 (de) 1997-04-17
DE4125528A1 (de) 1992-02-13
KR940008382B1 (ko) 1994-09-12
US5323847A (en) 1994-06-28

Similar Documents

Publication Publication Date Title
KR920005677A (ko) 전자장치 및 전자장치의 냉각방법
CA2046689A1 (en) Liquid cooling apparatus
US6971442B2 (en) Method and apparatus for dissipating heat from an electronic device
KR850008576A (ko) 냉각장치의 전기모우터식 압축기를 보호하는 제어장치와 그방법
ES2177234T3 (es) Elemento de refrigeracion para dispositivo electronico de potencia y dispositivo electronico de potencia que comprende tal elemento.
FR2393250A1 (fr) Dispositif de commande de pression pour dispositif de refrigeration
EP1158389A3 (en) Computer having cooling apparatus and heat exchanging device of the cooling apparatus
DE69408379D1 (de) Verfahren und Vorrichtung zur Kühlung einer Vakuumvorrichtung
DK0641980T3 (da) Anordning til varmeudveksling med et fluid under delvis frysning
JPH07165200A (ja) 宇宙空間模擬試験装置
JPH01260274A (ja) 冷却装置
JP3254041B2 (ja) 断続的に作動する収着冷凍装置を備えた冷蔵庫
JPS55135665A (en) Dampening water cooling device in printing press
JP2000146393A (ja) 冷凍装置
CN217955095U (zh) 一种内存检测设备
CN216123211U (zh) 一种震动试验台控制器
KR970029197A (ko) 자동 판매기
KR100322180B1 (ko) 반도체칩 성형프레스의 오일 냉각장치
DE58903073D1 (de) Kuehleinschubeinheit fuer schalt- und steuerschraenke.
JPH06318656A (ja) 集積回路素子の冷却装置
JPS5856536Y2 (ja) 直射日光による過熱防止装置
SE9703391L (sv) Anordning för att snabbkyla ett förmål i ett kylskåp
KR0127892Y1 (ko) 수냉식 에어콘의 냉각수 보조냉각장치
KR970020530A (ko) 에어컨의 응축기 냉각방법
EP1445559A3 (de) Vorrichtung zum Kühlen einer in einer Kühlkammer eines Fahrzeugs gelagerten und/oder transportierten Ladung

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20010714

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee