KR920001691A - 제로 전력 ic 모듈 - Google Patents

제로 전력 ic 모듈 Download PDF

Info

Publication number
KR920001691A
KR920001691A KR1019910009439A KR910009439A KR920001691A KR 920001691 A KR920001691 A KR 920001691A KR 1019910009439 A KR1019910009439 A KR 1019910009439A KR 910009439 A KR910009439 A KR 910009439A KR 920001691 A KR920001691 A KR 920001691A
Authority
KR
South Korea
Prior art keywords
battery
power
device package
terminal
lead
Prior art date
Application number
KR1019910009439A
Other languages
English (en)
Other versions
KR100206534B1 (ko
Inventor
퀴작 다니엘
Original Assignee
리챠드 케이. 로빈슨
에스지에스-톰슨 마이크로일렉트로닉스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리챠드 케이. 로빈슨, 에스지에스-톰슨 마이크로일렉트로닉스, 인코포레이티드 filed Critical 리챠드 케이. 로빈슨
Publication of KR920001691A publication Critical patent/KR920001691A/ko
Application granted granted Critical
Publication of KR100206534B1 publication Critical patent/KR100206534B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/141Battery and back-up supplies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49593Battery in combination with a leadframe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • H01L2224/85207Thermosonic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01055Cesium [Cs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1581Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304Protecting a component during manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Battery Mounting, Suspending (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Semiconductor Memories (AREA)

Abstract

내용 없음

Description

제로 전력 IC 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따라 백업 배터리의 음극 단자상에 집적회로 칩이 장착되어 있는 리이드 프레임 조립체의 평면도.
제2도는 단일 모울딩 패키지내의 반도체 집적회로와 리이드 프레임의 부분 파단 측면도.
제3도는 제2도의 집적회로, 백업 배터리 및 핑거 리이드 조립체의 부분 파단평면도.

Claims (14)

  1. 전지회로 소자에 전력을 공급하는 소자 패키지에 있어서; 비전도성 재료의 본체와; 상기 비전도성 재료의 본체내에 캡슐화되고, 핑거 리이드들중 하나는 전력리이드를 형성하는 다수의 전도성 핑거 리이드들을 포함하는 핑거 리이드 조립체와; 양극 전력 단자와 음극 전력 단자를 가지며, 상기 단자들중의 하나는 상기 전력 리이드상에 장착되는 배터리와; 상기 비전도성 재료의 본체내에 캡슐화되어 상기 다른 배터리 전력 단자상에 장착되는 전자회로들로 구성됨을 특징으로 하는 소자 패키지.
  2. 제1항에 있어서, 상기 전도성 핑거 리이드들과 상기 전력 리이드가 서로 거의 동일 평면상에 있음을 특징으로 하는 소자 패키지.
  3. 제1항에 있어서, 상기 전력 리이드에는 핑거 리이드 상호 접속 영역내에 배치된 베이스 지지부가 있고 상기 배터리 단자들중 하나는 상기 베이스 지지부에 장착되어 전기적으로 연결됨을 특징으로 하는 소자 패키지.
  4. 제1항에 있어서, 상기 전자회로 소자는 반도체 칩상에서 수행되는 집적회로이고; 상기 칩은 상기나머지 배터리 단자에 스태크된 관계로 기계적으로 장착되어 전기적으로 연결되며; 상기 집적회로는 다수의 입력/출력 노드들과 상기 입력/출력 노드들을 상기 전도성 핑거 리이들에 연결하는 다수의 와이어 도체들과, 상기 칩이 장착된 배터리 단자와 상기 전력 리이드 각각에 상기 와이어 도체들에 의해 전기적으로 연결되는 양극 및 음극 전력 노드들을 갖는 것을 특징으로 하는 소자 패키지.
  5. 제1항에 있어서, 상기 배터리에는 양극 접속 단자와 음극 접속 단자가 있고, 상기 음극 접속 단자는 상기 전력 리이드에 장착되어 전기적으로 연결됨을 특징으로하는 소자 패키지.
  6. 제1항에 있어서, 상기 배터리에는 양극 접속 단자와 음극 접속 단자가 있고, 상기 양극 접속 단자는 상기 전력 리이드에 장착되어 전기적으로 연결됨을 특징으로 하는 소자 패키지.
  7. 제1항에 있어서, 상기 소자 패키지는 상기 회로 소자와 상기 다른 배터리 전력단자 사이에 삽입된 비-전도성 결합 기판을 포함함을 특징으로 하는 소자 패키지.
  8. 제7항에 있어서, 상기 결합 기판에는 연결 구멍이 뚫려있고; 상기 전자회로 소자는 반도체 칩상에서 수행되는 집적회로이며; 상기 칩은 상기 결합 기판위에 스태크된 관계로 장착되고; 상기 집적회로 소자는 다수의 입력/출력노드들과 상기 입력/출력 노드들을 상기 전도성 핑거 리이드들에 연결하는 다수의 와이어 도체들과, 상기 결합 기판이 장착되는 배터리 단자와 상기 오프셋 젼력 리이드 각각에 상기 와이어 도체에 전기적으로 연결되는 양극 및 음극 전력 노드들을 가지며; 상기 와이어 도체들중 하나는 상기 집적회로 소자로부터 상기 연결구멍을 통해 상기 결합 기판이 장차괸 배터리 단자까지 연장됨을 특징으로 하는 소자 패키지.
  9. 제1항에 있어서, 상기 배터리는 기밀 봉착됨을 특징으로 하는 소자 패키지.
  10. 제1항에 있어서, 상기 배터리의 내부 저항은 단락 회로의 전류 흐름에 응답하여 비선형으로 증가함을 특징으로 하는 소자 패키지.
  11. 제1항에 있어서, 상기 소자 배터리가 재충전 가능함을 특징으로 하는 소자 패키지.
  12. 제1항에 있어서, 상기 소자 패키지는 표면 장착에 적합하고, 상기 비전도성 본체의 표면 장착측의 외면에 부착된 열 반사성 금속층을 포함함을 특징으로 하는 소자 패키지.
  13. 비전도성 재료의 본체내에 캡슐화된 다수의 입력/추력 노드들, 상기 비전도성 재료의 본체에 장착되어 본체 외부로 돌출하는 다수의 커넥터 리이드들, 및 상기 비전도성 재료의 본체내에 캡슐화되어 상기 입력/출력 노드들을 상기 커넥터 리이드들에 전기적으로 연결하는 다수의 전도성 핑거 리이드로 이루어지는 핑거 리이드 조립체를 포함하는 회로 소자를 갖는 형태의 전자회로 패키지에 있어서; 다수의 상기 전도성 핑거 리이드들에는 상호 접속 영역에 대하여 이격되어 있는 내단부들이 있고; 상기 전도성 핑거 리이드들중의 하나는 전력 리이드를 형성하고 상기 상호 접속 영역을 가로지르는 베이스 지지부를 가지며; 배터리에는 양극 및 음극 전력 단자들이 있으며, 상기 전력 단자들중의 하나는 상기 전력 리이드의 기판 지지부에 장착되어 전기적으로 연결되며, 상기 회로 소자는 다른 배터리 전력 단자에 장착됨을 특징으로 하는 전자회로 패키지.
  14. 전자 회로 소자에 전력을 공급하는 배터리와 전자 회로 소자를 패키지하는 방법에 있어서; 핑거 리이드 조립체의 핑거 리이드상에 배터리의 전력 단자를 장착하는 단계와; 상기 배터리의 다른 전력 단자에 상기 전자회로를 장착하는단계와 상기 전자 회로 소자, 배터리, 및 전력 리이드의 상기 스태크된 조립체를 비전도성 재료의 본체내에 캡슐화하는 단계들로 구성됨을 특징으로 하는 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910009439A 1990-06-06 1991-06-05 제로 전력 아이씨 모듈 KR100206534B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7/534.150 1990-06-06
US07/534,150 US5008776A (en) 1990-06-06 1990-06-06 Zero power IC module
US07/534.150 1990-06-06

Publications (2)

Publication Number Publication Date
KR920001691A true KR920001691A (ko) 1992-01-30
KR100206534B1 KR100206534B1 (ko) 1999-07-01

Family

ID=24128882

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910009439A KR100206534B1 (ko) 1990-06-06 1991-06-05 제로 전력 아이씨 모듈

Country Status (5)

Country Link
US (1) US5008776A (ko)
EP (1) EP0460802B1 (ko)
JP (1) JPH04273159A (ko)
KR (1) KR100206534B1 (ko)
DE (1) DE69124641T2 (ko)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592130A (en) * 1987-02-27 1997-01-07 Seiko Epson Corporation Piezoelectric oscillator including a piezoelectric resonator with outer lead
US5392006A (en) * 1987-02-27 1995-02-21 Seiko Epson Corporation Pressure seal type piezoelectric resonator
US5124782A (en) * 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5196374A (en) * 1990-01-26 1993-03-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
US5089877A (en) * 1990-06-06 1992-02-18 Sgs-Thomson Microelectronics, Inc. Zero power ic module
US5008776A (en) * 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
JPH04287357A (ja) * 1990-11-21 1992-10-12 Sgs Thomson Microelectron Inc モールドしたセルを有する集積回路パッケージ
US5153710A (en) * 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US6045652A (en) * 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5779839A (en) * 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5403782A (en) * 1992-12-21 1995-04-04 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with integrated battery mount
AU2231795A (en) * 1994-04-14 1995-11-10 Olin Corporation Electronic package having improved wire bonding capability
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6075742A (en) * 1997-12-31 2000-06-13 Stmicroelectronics, Inc. Integrated circuit for switching from power supply to battery, integrated latch lock, and associated method for same
US6109530A (en) * 1998-07-08 2000-08-29 Motorola, Inc. Integrated circuit carrier package with battery coin cell
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6307769B1 (en) 1999-09-02 2001-10-23 Micron Technology, Inc. Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices
ATE479206T1 (de) * 1999-11-08 2010-09-15 Nanogram Corp Elektroden, die partikel mit spezifischer grösse enthalten
US6593840B2 (en) * 2000-01-31 2003-07-15 Pulse Engineering, Inc. Electronic packaging device with insertable leads and method of manufacturing
WO2001073868A2 (en) * 2000-03-24 2001-10-04 Cymbet Corporation Device enclosures and devices with integrated battery
DE10112355C1 (de) * 2001-03-13 2002-06-13 Daimler Chrysler Ag Verfahren und Schutzvorrichtung zur Montage eines temperaturempfindlichen elektronischen Bauteils
US20040081860A1 (en) * 2002-10-29 2004-04-29 Stmicroelectronics, Inc. Thin-film battery equipment
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US7230321B2 (en) * 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
US8766435B2 (en) 2004-06-30 2014-07-01 Stmicroelectronics, Inc. Integrated circuit package including embedded thin-film battery
WO2007018473A1 (en) * 2005-08-05 2007-02-15 Infineon Technologies Ag Leadframe and semiconductor package
US8666505B2 (en) * 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US20200194390A1 (en) * 2018-12-17 2020-06-18 Texas Instruments Incorporated Package with dual layer routing including ground return path
CN115472577A (zh) * 2021-06-11 2022-12-13 恩智浦美国有限公司 集成电路封装和制造集成电路封装的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109183A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Non-volatile memory
JPS5987842A (ja) * 1982-11-10 1984-05-21 Toshiba Corp Ic/lsiソケツト
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法
US5008776A (en) * 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
US5089877A (en) * 1990-06-06 1992-02-18 Sgs-Thomson Microelectronics, Inc. Zero power ic module

Also Published As

Publication number Publication date
EP0460802A3 (en) 1993-03-17
EP0460802A2 (en) 1991-12-11
KR100206534B1 (ko) 1999-07-01
US5008776A (en) 1991-04-16
DE69124641T2 (de) 1997-05-28
JPH04273159A (ja) 1992-09-29
EP0460802B1 (en) 1997-02-12
DE69124641D1 (de) 1997-03-27

Similar Documents

Publication Publication Date Title
KR920001691A (ko) 제로 전력 ic 모듈
US5153710A (en) Integrated circuit package with laminated backup cell
US6343019B1 (en) Apparatus and method of stacking die on a substrate
US6610923B1 (en) Multi-chip module utilizing leadframe
KR920001692A (ko) 제로 전력 ic 모듈
KR970067801A (ko) 반도체 장치 및 그 제조방법
KR920001696A (ko) 반도체 다이를 절연시키기 위한 히트 싱크 및 다중 장착 패드 리드 프레임 패키지 및 그 방법
JPH10242210A (ja) 集積回路装置の実装構造およびその製造方法
KR890013751A (ko) 반도체 장치
JPH0383368A (ja) 半導体装置
KR920001689A (ko) 반도체장치 및 그 제조방법
US5504370A (en) Electronic system circuit package directly supporting components on isolated subsegments
KR100647090B1 (ko) 다수의 반도체 칩을 포함하는 반도체 소자
US4949220A (en) Hybrid IC with heat sink
KR960706193A (ko) 전도성 트레이스와 리드 프레임 리드를 결합하는 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces)
KR970703617A (ko) 전도선을 가진 리드프레임 리드를 포함한 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces)
EP0609528A1 (en) Low inductance semiconductor package
US6168975B1 (en) Method of forming extended lead package
KR920010845A (ko) 모울드 셀을 갖는 집적회로 패키지
KR100212392B1 (ko) 반도체 패키지
JPH03256351A (ja) 半導体装置
JPH0358465A (ja) 樹脂封止型半導体装置
JPH05190712A (ja) 半導体装置
JPH07282218A (ja) 半導体集積回路装置
KR920001699A (ko) 반도체장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040323

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee