KR910015030A - Film-mounted semiconductor device - Google Patents

Film-mounted semiconductor device Download PDF

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Publication number
KR910015030A
KR910015030A KR1019910000310A KR910000310A KR910015030A KR 910015030 A KR910015030 A KR 910015030A KR 1019910000310 A KR1019910000310 A KR 1019910000310A KR 910000310 A KR910000310 A KR 910000310A KR 910015030 A KR910015030 A KR 910015030A
Authority
KR
South Korea
Prior art keywords
film
semiconductor device
lead
wirings
parallel
Prior art date
Application number
KR1019910000310A
Other languages
Korean (ko)
Inventor
히로히꼬 나까무라
Original Assignee
야마무라 가쯔미
세이꼬 엡슨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마무라 가쯔미, 세이꼬 엡슨 가부시끼가이샤 filed Critical 야마무라 가쯔미
Publication of KR910015030A publication Critical patent/KR910015030A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음No content

Description

필름 실장형 반도체 장치Film-mounted semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의한 필름 실장형 반도체 장치의 제1실시예를 도시하는 평면도.1 is a plan view showing a first embodiment of a film-mounted semiconductor device according to the present invention.

Claims (3)

필름위에 반도체 칩을 탑재하여, 상기 반도체 칩에 접속된 복수의 배선으로 형성되는 리드 패턴이 형성이 되어 있으며, 상기 리드 패턴의 병렬된 각 배선을 노출한 리드 접속부가 설치된 필름 실장형 반도체 장치에 있어서, 상기 리드 접속부에는, 서로 인접하는 배선이 그 연장 방향으로 다른 간격을 갖는 것을 특징으로 하는 필름 실장형 반도체 장치.In a film-mounted semiconductor device in which a semiconductor chip is mounted on a film, and a lead pattern formed of a plurality of wirings connected to the semiconductor chip is formed, and a lead connection portion exposing the parallel wirings of the lead pattern is provided. And the lead connecting portion has different spacing between the wirings adjacent to each other in the extending direction thereof. 제1항에 있어서, 상기 리드 접속부에는, 2이상의 다른 간격을 갖는 평행 배선부가 설치되어, 상기 평행 배선부에서는, 직선형상의 각 배선이 서로 평행하게 설치되는 것을 특징으로 하는 필름 실장형 반도체 장치.The film-mounted semiconductor device according to claim 1, wherein a parallel wiring portion having two or more different intervals is provided in the lead connecting portion, and each of the linear wirings is provided in parallel with each other in the parallel wiring portion. 제1항에 있어서, 상기 리드 접속부에서는, 상기 리드 패턴은, 배선의 연장방향으로 배선 간격을 연속적으로 변화시키는 것을 특징으로 하는 필름 실장형 반도체 장치.The film-mounted semiconductor device according to claim 1, wherein in the lead connecting portion, the lead pattern continuously changes wiring intervals in an extension direction of the wiring. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910000310A 1990-01-16 1991-01-11 Film-mounted semiconductor device KR910015030A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP250290 1990-01-16
JP2502 1990-01-16
JP1990106008U JPH0493147U (en) 1990-01-16 1990-10-08
JP106008 1990-10-08

Publications (1)

Publication Number Publication Date
KR910015030A true KR910015030A (en) 1991-08-31

Family

ID=31889738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000310A KR910015030A (en) 1990-01-16 1991-01-11 Film-mounted semiconductor device

Country Status (2)

Country Link
JP (1) JPH0493147U (en)
KR (1) KR910015030A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3640155B2 (en) 1999-01-26 2005-04-20 セイコーエプソン株式会社 Flexible wiring board, film carrier, tape-like semiconductor device, semiconductor device, circuit board, and electronic device

Also Published As

Publication number Publication date
JPH0493147U (en) 1992-08-13

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid