KR910010676A - Ccd 봉합방법 - Google Patents

Ccd 봉합방법 Download PDF

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Publication number
KR910010676A
KR910010676A KR1019890017237A KR890017237A KR910010676A KR 910010676 A KR910010676 A KR 910010676A KR 1019890017237 A KR1019890017237 A KR 1019890017237A KR 890017237 A KR890017237 A KR 890017237A KR 910010676 A KR910010676 A KR 910010676A
Authority
KR
South Korea
Prior art keywords
ccd
film
sealing method
package
sealing
Prior art date
Application number
KR1019890017237A
Other languages
English (en)
Other versions
KR920004363B1 (ko
Inventor
김구성
김영수
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019890017237A priority Critical patent/KR920004363B1/ko
Publication of KR910010676A publication Critical patent/KR910010676A/ko
Application granted granted Critical
Publication of KR920004363B1 publication Critical patent/KR920004363B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

내용 없음.

Description

CCD 봉합방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 이 발명의 한 실시예에 사용된 보호 테이프,
제 2 도는 이 발명의 방법의 CCD봉합과정의 설명도,

Claims (2)

  1. CCD패키지의 봉합방법에 있어서, 패키지의 함입부에 평면유리를 덮은 후 필름을 개재하여, 클립으로 필름과 평면유리를 패키지에 고정시켜 봉합함을 특징으로 하는 CCD봉합방법.
  2. 제 1 항에 있어서, 상기의 필름은 CCD패키지 유리면의 대향면의 일부에만 접착부를 형성한 테이프인 것을 특징으로 하는 CCD봉합방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890017237A 1989-11-27 1989-11-27 Ccd 봉합방법 KR920004363B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890017237A KR920004363B1 (ko) 1989-11-27 1989-11-27 Ccd 봉합방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890017237A KR920004363B1 (ko) 1989-11-27 1989-11-27 Ccd 봉합방법

Publications (2)

Publication Number Publication Date
KR910010676A true KR910010676A (ko) 1991-06-29
KR920004363B1 KR920004363B1 (ko) 1992-06-04

Family

ID=19292101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017237A KR920004363B1 (ko) 1989-11-27 1989-11-27 Ccd 봉합방법

Country Status (1)

Country Link
KR (1) KR920004363B1 (ko)

Also Published As

Publication number Publication date
KR920004363B1 (ko) 1992-06-04

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