KR910008801A - 반도체장치의 제조방법 - Google Patents
반도체장치의 제조방법 Download PDFInfo
- Publication number
- KR910008801A KR910008801A KR1019900016768A KR900016768A KR910008801A KR 910008801 A KR910008801 A KR 910008801A KR 1019900016768 A KR1019900016768 A KR 1019900016768A KR 900016768 A KR900016768 A KR 900016768A KR 910008801 A KR910008801 A KR 910008801A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- insulating layer
- semiconductor device
- resist
- forming
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 10
- 238000004519 manufacturing process Methods 0.000 title claims 6
- 239000000758 substrate Substances 0.000 claims 4
- 238000010894 electron beam technology Methods 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66848—Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
- H01L29/66856—Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
- H01L29/66863—Lateral single gate transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28581—Deposition of Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electron Beam Exposure (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도(a) 내지 제 1 도(e)는 본 발명의 1실시예를 나타낸 측단면도이다.
Claims (5)
- 반도체기판(1)상에 제 1절연층(2)을 형성하는 공정과, 상기 제 1절연층(2)상에 전자빔에 감응되는 레지스트를 형성하는 공정. 패턴을 전자빔으로 조사하는 공정. 현상액에 의해 불필요한 영역의 레지스트를 제거해서 레지스트의 잔류패턴(3)을 형성하는 공정, 상기 제 1 절연층(2)의 전면상에 제 2 절연층(4)을 형성하는 공정. 상기 레지스트의 잔류패턴(3)을 제거함으로써 상기 제 2 절연층(4)에 개공패턴을 형성하는 공정, 상기 제 2 절연층(4)을 마스크로 해서 제 1 절연층(2)을 에칭함으로써 상기 반도체기판(1)상에 개공패턴을 형성하는 공정으로 이루어진 것을 특징으로 하는 반도체장치의 제조방법.
- 제 1 항에 있어서, 상기 레지스트가 네가형인 것을 특징으로 하는 반도체장치의 제조방법.
- 제 1 항에 있어서, 상기 반도체기판(1)이 GaAs로 형성된 것을 특징으로 하는 반도체장치의 제조방법.
- 제 1 항에 있어서, 상기 반도체기판(1)에 형성되는 제 1, 제 2 절연층(2,4)이 적어도 SiOnN, Si3N4, SiO2중 어느 하나로 형성되는 것을 특징으로 하는 반도체장치의 제조방법.
- 제 1 항에 있어서, 상기 제 1, 제 2 절연층(2,4)은 각각 500∼1000Å의 두께로 형성되는 것을 특징으로 하는 반도체장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1274971A JPH03138938A (ja) | 1989-10-24 | 1989-10-24 | 半導体装置の製造方法 |
JP01-274971 | 1989-10-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910008801A true KR910008801A (ko) | 1991-05-31 |
KR940009996B1 KR940009996B1 (ko) | 1994-10-19 |
Family
ID=17549118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900016768A KR940009996B1 (ko) | 1989-10-24 | 1990-10-20 | 반도체장치의 제조방법 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0425957A3 (ko) |
JP (1) | JPH03138938A (ko) |
KR (1) | KR940009996B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020155389A1 (en) | 2000-10-24 | 2002-10-24 | Bharath Rangarajan | Inverse resist coating process |
JP4645018B2 (ja) * | 2003-11-06 | 2011-03-09 | セイコーエプソン株式会社 | コンタクトホールの形成方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4144101A (en) * | 1978-06-05 | 1979-03-13 | International Business Machines Corporation | Process for providing self-aligned doping regions by ion-implantation and lift-off |
JPS60194577A (ja) * | 1984-03-16 | 1985-10-03 | Nippon Telegr & Teleph Corp <Ntt> | 電界効果トランジスタの製造方法 |
JPS60214532A (ja) * | 1984-04-11 | 1985-10-26 | Nippon Telegr & Teleph Corp <Ntt> | パタ−ン形成方法 |
JPS6229175A (ja) * | 1985-07-29 | 1987-02-07 | Nippon Telegr & Teleph Corp <Ntt> | 電界効果型トランジスタの製造方法 |
JPS6455872A (en) * | 1987-08-26 | 1989-03-02 | Sumitomo Electric Industries | Manufacture of self-alignment type gate electrode |
JPH01136375A (ja) * | 1987-11-24 | 1989-05-29 | Sumitomo Electric Ind Ltd | 電界効果トランジスタの製造方法 |
-
1989
- 1989-10-24 JP JP1274971A patent/JPH03138938A/ja active Pending
-
1990
- 1990-10-20 KR KR1019900016768A patent/KR940009996B1/ko not_active IP Right Cessation
- 1990-10-22 EP EP19900120205 patent/EP0425957A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR940009996B1 (ko) | 1994-10-19 |
JPH03138938A (ja) | 1991-06-13 |
EP0425957A2 (en) | 1991-05-08 |
EP0425957A3 (en) | 1991-07-24 |
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E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |