KR900017446A - 편측 인쇄기판상의 전기 및 전자부품 설치 방법 - Google Patents
편측 인쇄기판상의 전기 및 전자부품 설치 방법 Download PDFInfo
- Publication number
- KR900017446A KR900017446A KR1019900005302A KR900005302A KR900017446A KR 900017446 A KR900017446 A KR 900017446A KR 1019900005302 A KR1019900005302 A KR 1019900005302A KR 900005302 A KR900005302 A KR 900005302A KR 900017446 A KR900017446 A KR 900017446A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- component
- connecting element
- printed board
- smd
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 공지된 방법에 의해 납땜된 부품을 포함하는 편측 인쇄기판의 일부 단면도,
제2도는 본 발명에 따른 방법으로 납땜된 부품을 포함하는 인쇄기판의 일부 단면도,
제3도, 제4도, 제5도는 본 발명에 따른 방법에 사용된 접속 부품의 다수 실시도.
Claims (5)
- 접속 와이어가 인쇄기판내의 부품구멍을 통과하는 와이어 부품과 인쇄기판의 트랙측에 설치된 SMD부품이 납땜에 의해 인쇄기판에 고착되는 편측 인쇄기판상의 전기 및 전자부품 설치 방법에 있어서, 와이어 부품을 인쇄기판의 트랙측에도 배치되고, 상기 와이어 부품을 접속요소에 의해 인쇄기판에 설치하고, SMD부품과 접속요소를 재유동 납땜에 의해 인쇄기판상에 설치하고, 와이어 부품의 접속와이어를 유동 납땜에 의해 접속요소에 접속 하는 것을 특징으로 하는 편측 인쇄기판상에 ㅇ전기 및 전자 부품 설치 방법.
- 제1항에 있어서, 땜납이 SMD부품용 납땜 표면과 부품구멍 둘레의 납땜 표면에 적용되며,SMD부품이 인쇄기판에 놓이며 접속요소가 트랙측으로부터 부품 구멍을 통과하며, SMD부품과 접속요소가 재유동 납땜에 의해 인쇄기판에 고착된 후에 와이어 부품의 접속 와이어가 트랙측으로부터 접속요소에 삽입되며, 접속 와이어가 유동납땜에 의해 접속요소에 접속되는 것을 특징으로 하는 편측 인쇄기판상의 전기 및 전자부품 설치 방법.
- 제1항에 있어서, 땜납을SMD부품용 납땜 표면과 부품구멍 둘레의 납땜 표면에 적용하고,SMD인쇄기판에 부품을 놓고 적속요소를 트랙측으로부터 부품구멍에 삽입하고, 와이어 부품의 접속 와이어를 트랙측으로부터 접속요소 삽입한 후에SMD부품을 유동 납땜욕에 의해 인쇄기판에 고착하고 접속요소를 재유동 납땜을 거쳐 인쇄기판에 설치하고 동시에 와이어 부품의 접속와이어를 접속요소에 고착하는 것을 특징으로 하는 편측 인쇄기 핀상의 자기 및 전자부품 설치방법.
- 제1항, 제2항 또는 제3항의 방법에 의해 인쇄 기판에 설치된 전기 및 전자 SMD및 와이어 부품이 제공된 편측 인쇄 기판에 있어서, SMD부품과 와이어 부품이 인쇄기판의 트랙측에 적용되고 와이어 부품이 접속요소의 삽입을 거쳐 인쇄 기판에 고착되는 것을 특징으로 하는 편측 인쇄기판.
- 제1항, 제2항 또는 제3항의 방법에 사용하도록 설계된 접속요소에 있어서, 접속요소는 한 단부 가까이에 방사상으로 둘러싸인 플렌지를 가지는 슬리브를 포함하는 것을 특징으호 하는 접속요소.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8900986 | 1989-04-20 | ||
NL8900986 | 1989-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900017446A true KR900017446A (ko) | 1990-11-16 |
Family
ID=19854509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900005302A KR900017446A (ko) | 1989-04-20 | 1990-04-17 | 편측 인쇄기판상의 전기 및 전자부품 설치 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4982376A (ko) |
EP (1) | EP0393761A1 (ko) |
JP (1) | JPH02299290A (ko) |
KR (1) | KR900017446A (ko) |
Families Citing this family (38)
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JP2844778B2 (ja) * | 1989-12-28 | 1999-01-06 | ソニー株式会社 | 片面プリント基板に2種類の部品を半田付けする方法 |
EP0437312B1 (en) * | 1990-01-08 | 1994-10-26 | Nec Corporation | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
US5270903A (en) * | 1990-09-10 | 1993-12-14 | Codex Corporation | Printed circuit board manufacturing method accommodates wave soldering and press fitting of components |
US5109319A (en) * | 1990-11-01 | 1992-04-28 | Jerome Potash | Terminal arrangement for axial lead electrically asymmetric electronic components |
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
US5239448A (en) * | 1991-10-28 | 1993-08-24 | International Business Machines Corporation | Formulation of multichip modules |
JPH0644178U (ja) * | 1992-11-13 | 1994-06-10 | 株式会社小糸製作所 | 回路基板 |
US5805411A (en) * | 1993-08-11 | 1998-09-08 | Sundstrand Corporation | Support for capacitor |
IT1291779B1 (it) | 1997-02-17 | 1999-01-21 | Magnetek Spa | Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti |
US6299055B1 (en) * | 1997-05-09 | 2001-10-09 | Lear Automotive Dearborn, Inc. | Manufacturing processes of service boxes and their parts |
US6013876A (en) * | 1998-01-23 | 2000-01-11 | General Instrument Corporation | Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board |
DE19809138A1 (de) * | 1998-03-04 | 1999-09-30 | Philips Patentverwaltung | Leiterplatte mit SMD-Bauelementen |
US6071756A (en) * | 1998-08-20 | 2000-06-06 | Lockheed Martin Corporation | Method for holding components in place during soldering |
US6084764A (en) * | 1998-12-21 | 2000-07-04 | Hamilton Sundstrand Corporation | Capacitor disconnecting assembly |
US6223430B1 (en) * | 1999-04-30 | 2001-05-01 | Premark Wb Holdings, Inc. | Breadmaker circuit board mounting method |
US6437989B1 (en) * | 1999-07-10 | 2002-08-20 | Endress + Hauser Gmbh + Co. | Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
US6370767B1 (en) * | 1999-10-04 | 2002-04-16 | Artesyn Technologies, Inc. | Method for fabricating an electrical apparatus |
US6407928B1 (en) | 2000-06-30 | 2002-06-18 | Cisco Technology, Inc. | LED surface mount |
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JP2002076589A (ja) * | 2000-08-31 | 2002-03-15 | Hitachi Ltd | 電子装置及びその製造方法 |
DE10211647B4 (de) * | 2002-03-15 | 2014-02-13 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Bestücken und Löten einer Leiterplatte |
US7918383B2 (en) * | 2004-09-01 | 2011-04-05 | Micron Technology, Inc. | Methods for placing substrates in contact with molten solder |
DE102006035528A1 (de) * | 2006-07-27 | 2008-01-31 | Endress + Hauser Gmbh + Co. Kg | Verfahren und Wellenlötanlage zum Löten von Bauteilen auf Ober- und Unterseite einer Leiterplatte |
US7972036B1 (en) | 2008-04-30 | 2011-07-05 | Genlyte Thomas Group Llc | Modular bollard luminaire louver |
US20100012369A1 (en) * | 2008-07-16 | 2010-01-21 | John Pope | Spring retained shield for printed wiring boards |
DE102009028499A1 (de) * | 2009-08-13 | 2011-02-17 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Bestückung und zum Löten von gemischt bestückbaren Leiterplatten |
CN102131352A (zh) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业(深圳)有限公司 | 一种制造印刷电路板的方法 |
USD657087S1 (en) | 2011-05-13 | 2012-04-03 | Lsi Industries, Inc. | Lighting |
ITMI20112084A1 (it) * | 2011-11-17 | 2013-05-18 | St Microelectronics Srl | Saldatura ad onda su scheda a circuito stampato di dispositivi elettronici a montaggio superficiale |
US9214276B2 (en) * | 2012-01-16 | 2015-12-15 | Hamilton Sundstrand Corporation | Capacitor |
EP2635097B1 (en) * | 2012-02-28 | 2021-07-07 | Electrolux Home Products Corporation N.V. | An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector |
DE102014217924B4 (de) * | 2014-09-08 | 2016-07-28 | Continental Automotive Gmbh | Verfahren zum Montieren von SMD-Bauteilen an Kontaktfedern bei Elektromotoren |
JP2016082074A (ja) * | 2014-10-17 | 2016-05-16 | ダイキン工業株式会社 | 電装装置およびその製造方法 |
JP6990830B2 (ja) * | 2018-03-30 | 2022-01-12 | パナソニックIpマネジメント株式会社 | プリント基板及びプリント基板の製造方法 |
DE102018110752A1 (de) * | 2018-05-04 | 2019-11-07 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Verfahren zum Herstellen eines Anschlusskontaktes |
DE102020202598A1 (de) | 2020-02-28 | 2021-09-02 | Siemens Mobility GmbH | Verfahren zum Herstellen einer elektrischen Anordnung |
CN112004180B (zh) * | 2020-10-29 | 2021-01-12 | 瑞声光电科技(常州)有限公司 | 集成封装模组的制造方法、集成封装模组及电子设备 |
DE102021208217A1 (de) * | 2021-07-29 | 2023-02-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kontaktelement zur mittelbaren Verbindung eines Einpresspins mit einer Leiterplatte sowie Leiterplatte mit solch einem Kontaktelement |
Family Cites Families (18)
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DE1065898B (ko) * | 1959-09-24 | |||
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FR2418606A1 (fr) * | 1978-02-28 | 1979-09-21 | Kollmorgen Tech Corp | Plaquette de circuits imprimes avec composants implantes et procede de fabrication de ladite plaquette |
DE2852753C3 (de) * | 1978-12-06 | 1985-06-20 | Württembergische Metallwarenfabrik, 7340 Geislingen | Verfahren zum Befestigen von Bauelementen mit flächigen Anschlußkontakten auf einer Leiterplatte und Schablone zur Durchführung des Verfahrens |
US4242719A (en) * | 1979-06-01 | 1980-12-30 | Interconnection Technology, Inc. | Solder-weld P.C. board apparatus |
EP0058766B1 (en) * | 1981-02-23 | 1985-08-07 | Matsushita Electric Industrial Co., Ltd. | Soldering apparatus |
JPS58221667A (ja) * | 1982-06-15 | 1983-12-23 | Matsushita Electric Ind Co Ltd | チツプ部品の半田付方法 |
US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
DE3624412A1 (de) * | 1986-07-18 | 1988-01-28 | Vdo Schindling | Verfahren zum verloeten eines bauteils sowie leiterplatte mit einem solchen |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
-
1990
- 1990-04-10 US US07/507,942 patent/US4982376A/en not_active Expired - Fee Related
- 1990-04-12 EP EP90200899A patent/EP0393761A1/en not_active Withdrawn
- 1990-04-17 JP JP2099500A patent/JPH02299290A/ja active Pending
- 1990-04-17 KR KR1019900005302A patent/KR900017446A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH02299290A (ja) | 1990-12-11 |
US4982376A (en) | 1991-01-01 |
EP0393761A1 (en) | 1990-10-24 |
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