KR890015360A - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법

Info

Publication number
KR890015360A
KR890015360A KR1019890003338A KR890003338A KR890015360A KR 890015360 A KR890015360 A KR 890015360A KR 1019890003338 A KR1019890003338 A KR 1019890003338A KR 890003338 A KR890003338 A KR 890003338A KR 890015360 A KR890015360 A KR 890015360A
Authority
KR
South Korea
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
KR1019890003338A
Other languages
English (en)
Other versions
KR930000603B1 (ko
Inventor
히로시 이와사키
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR890015360A publication Critical patent/KR890015360A/ko
Application granted granted Critical
Publication of KR930000603B1 publication Critical patent/KR930000603B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863Lateral single gate transistors
    • H01L29/66878Processes wherein the final gate is made before the formation, e.g. activation anneal, of the source and drain regions in the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8252Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025Channel region of field-effect devices
    • H01L29/1029Channel region of field-effect devices of field-effect transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
KR1019890003338A 1988-03-17 1989-03-17 반도체장치 및 그 제조방법 KR930000603B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP88-64041 1988-03-17
JP63064041A JPH01236657A (ja) 1988-03-17 1988-03-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR890015360A true KR890015360A (ko) 1989-10-30
KR930000603B1 KR930000603B1 (ko) 1993-01-25

Family

ID=13246632

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890003338A KR930000603B1 (ko) 1988-03-17 1989-03-17 반도체장치 및 그 제조방법

Country Status (4)

Country Link
EP (1) EP0338251B1 (ko)
JP (1) JPH01236657A (ko)
KR (1) KR930000603B1 (ko)
DE (1) DE68922653T2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105473B2 (ja) * 1988-06-30 1995-11-13 株式会社東芝 Mes fetの製造方法
JP2647200B2 (ja) * 1989-06-29 1997-08-27 シャープ株式会社 化合物半導体増幅装置
US5100831A (en) * 1990-02-16 1992-03-31 Sumitomo Electric Industries, Ltd. Method for fabricating semiconductor device
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887879A (ja) * 1981-11-20 1983-05-25 Nippon Telegr & Teleph Corp <Ntt> 電界効果トランジスタ
JPS5897874A (ja) * 1981-12-07 1983-06-10 Nippon Telegr & Teleph Corp <Ntt> 電界効果トランジスタの製造方法
JPS5918679A (ja) * 1982-07-22 1984-01-31 Fujitsu Ltd 半導体装置
EP0112657B1 (en) * 1982-11-29 1990-06-20 Fujitsu Limited Field effect transistor and process for fabricating it
JPS59191386A (ja) * 1983-04-14 1984-10-30 Nec Corp 半導体装置とその製造方法
CA1201538A (en) * 1983-07-25 1986-03-04 Ajit G. Rode Method of manufacturing field effect transistors
JPS62262466A (ja) * 1986-05-09 1987-11-14 Toshiba Corp Mes fetの製造方法

Also Published As

Publication number Publication date
DE68922653T2 (de) 1995-09-28
DE68922653D1 (de) 1995-06-22
EP0338251A1 (en) 1989-10-25
JPH01236657A (ja) 1989-09-21
EP0338251B1 (en) 1995-05-17
KR930000603B1 (ko) 1993-01-25

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