KR890005042Y1 - Set up pad for radiation board - Google Patents
Set up pad for radiation board Download PDFInfo
- Publication number
- KR890005042Y1 KR890005042Y1 KR2019860013260U KR860013260U KR890005042Y1 KR 890005042 Y1 KR890005042 Y1 KR 890005042Y1 KR 2019860013260 U KR2019860013260 U KR 2019860013260U KR 860013260 U KR860013260 U KR 860013260U KR 890005042 Y1 KR890005042 Y1 KR 890005042Y1
- Authority
- KR
- South Korea
- Prior art keywords
- pad
- heat sink
- heat
- present
- vent hole
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안이 적용 예를 보인 사시도.1 is a perspective view showing an application example of the present invention.
제2도는 본 고안의 평면도.2 is a plan view of the present invention.
제3도는 본 고안이 적용된 정면도.3 is a front view to which the present invention is applied.
제4도는 본 고안이 적용된 방열판의 평단면도.4 is a plan sectional view of a heat sink to which the present invention is applied.
* 도면의 부분에 대한 부호의 설명* Explanation of symbols for parts of the drawing
1,1' : 고무패드 2 : 통기홈1,1 ': Rubber pad 2: Vent groove
3 : 나사홈 4,4' : 걸림돌기3: screw groove 4,4 ': locking projection
5,5'5" : 통기공 6 : 방열핀5,5'5 ": Vent 6: Heat radiation fin
7 : 방열판 8 : 소자7: heat sink 8: element
9 : 기판 10 : 나사9: substrate 10: screw
11,11' : 나사공11,11 ': Screwdriver
본 고안은 전자제품의 회로 기판상에 설치되는 각종 부품중 발열성 소자의 보호를 위한 방열판을 효과적으로 설치하도록 구성된 패드에 관한 것이다.The present invention relates to a pad configured to effectively install a heat sink for protection of a heat generating element among various components installed on a circuit board of an electronic product.
좀더 구체적으로는, 회로기판에 발열판을 설치함에 있어서, 이들사이에 고무패드를 개재시키므로서, 방열판에 의한 열전도를 차단시키게 하고 자체의 진동을 흡수케하며, 또한 조립시의 접촉면에 대한 보호를 구현할수 있도록 적절한 형상의 패드를 제공하려는 것이다.More specifically, in installing the heating plate on the circuit board, by interposing a rubber pad between them, it is possible to block the heat conduction by the heat sink, to absorb the vibration of itself, and also to protect the contact surface during assembly We want to provide a pad of the right shape to make it possible.
주지하다시피, 회로기판상에 구성되는 각종소자 중에서 전원의 인가시에 자연적인 발열성을 갖는 소자가 있는 바 이러한 열전도는 소자의 기능에 악영향을 초래하게 되므로 열전도가 우수하고 방열 표면적을 넓힌 방열판(Radiator)이 부착된다.As is well known, among the various elements configured on the circuit board, there is a device having a natural heat generating property when the power is applied. Since the heat conduction adversely affects the function of the device, the heat sink having excellent heat conductivity and widening the heat dissipation surface area ( Radiator is attached.
이 방열판을 소자의 열량을 신속히 흡수하여 대기중으로 방출시키게 되므로 전자제품 내부의 원활한 통기성도 고려되어야 할 것이다.Since the heat sink quickly absorbs the heat of the device and is released into the atmosphere, the air permeability inside the electronic product should be considered.
그러나 종래에는 방열판을 단순히 회로기판상에 나사로 고착시켜왔기 때문에 조립시 나사조임 압력에 의하여 면접촉 부위의 손상이 일어나고, 사용시에는 소자의 진동이 방열판을 통하여 회로기판상에 그대로 전달되므로서 장시간 경과후에는 나사가 해리되던가 또는 소음을 유발시켜 왔던 것이다.However, in the past, since the heat sink was simply fixed to the circuit board with screws, damage to the surface contact area occurs due to the screw tightening pressure during assembly, and during use, the vibration of the device is transmitted as it is on the circuit board through the heat sink. The screw has been dissociating or causing noise.
따라서 본 고안에서는 위와 같은 사항을 개선시켜 보기 위하여 안출된 것이며, 첫째 목적은 방열판에서 회로기판으로 열전달되는 것을 차단시킴과 동시에 기판 외부에 대기와 원활한 통기가 달성되도록 하는 것이며, 둘째 목적은 소자의 진동을 흡수하는 것이고, 셋째 목적은 조립시 금속인 방열판에 의한 기판의 면접촉 부위를 보호하기 위한 수단을 제공하려는데 그 목적이 있다.Therefore, the present invention was devised to improve the above-mentioned matters, and the first purpose is to block heat transfer from the heat sink to the circuit board, and at the same time to achieve the air and smooth ventilation to the outside of the substrate, and the second purpose is to vibrate the device The third object is to provide a means for protecting the surface contact portion of the substrate by the heat sink is a metal during assembly.
이러한 목적을 더욱 효과적으로 달성시킬수 있는 본 고안의 특징은 방열판과 기판사이에 연질의 패드를 개재시키고 이에 대응하는 통기공을 기판에 천공하는 바 본 고안이 의도하는 결과를 실현할수 있다.A feature of the present invention that can achieve this purpose more effectively is to insert a soft pad between the heat sink and the substrate and to puncture a corresponding vent hole on the substrate to realize the intended result of the present invention.
이하 본 고안의 바람직한 구성과 작용 및 효과등은 첨부된 도면과 관련하여 상세히 기술하면 다음과 같다.Hereinafter, preferred configurations, functions, and effects of the present invention will be described in detail with reference to the accompanying drawings.
일정두께의 사각형 패드(1)의 일면에 있어서, 대향하는 모서리 부위에는 육면체의 걸림돌기(4) (4')가 각각 세워져 고착되어 있는 바 돌기(4) (4')의 일정높이에는 사면으로 경사지게 형성하며, 또 다른 대향하는 모서리 부위에는 구멍을 천공한 통기공(5)과 반달형상의 통기홈(2)이 형성되고, 중앙의 일측에는 나사홈(3)이 형성된 것이다.On one surface of a rectangular pad 1 of constant thickness, a hexahedral locking protrusion 4, 4 'is formed at each of the opposite corner portions and fixed to a slope at a predetermined height of the bar protrusions 4, 4'. It is formed to be inclined, and the other opposite corner portion is formed with a vent hole (5) and a half-moon-shaped vent hole (2), the screw groove (3) is formed on one side of the center.
상기 구성의 사용효과를 설명하면 다음과 같다.The use effect of the above configuration is as follows.
방열핀(6)사이의 공간으로 삽입이 용이하도록 경사진 걸림돌기(4) (4)를 형성한 패드(1)에 있어서, 나사홈(3)과 나사공(11)이 일직선이 되도록 방열핀(6)사이로 고무성질의 걸돌기를 (4) (4')를 끼우면 패드(1)는 방열판(7)에 안정되게 고정되고 이때 기판(9)의 나사공(11')과 방열판(7)의 나사공(11)이 일치되면 패드(1)의 통기공(5)과 통기홈(2)도 기판의 통기공(5') (5")과 각각 일치되므로 나사(10)로 기판(9)과 방열판(7)을 체결시킨다.In the pad (1) formed with the inclined locking projections (4) (4) to facilitate insertion into the space between the heat dissipation fins (6), the heat dissipation fins (6) so that the screw grooves (3) and the screw holes (11) are in a straight line. (4) (4 ') between the rubber bumps, the pad (1) is stably fixed to the heat sink (7), and at this time the screw hole (11') of the substrate (9) and the thread of the heat sink (7) When the holes 11 coincide with each other, the vent hole 5 and the vent groove 2 of the pad 1 also coincide with the vent holes 5 'and 5 " of the substrate, respectively. Fasten the heat sink (7).
이상과 같은 본 고안은 발열성 소자의 방열을 원활히 대기로 통기시키므로서 소자의 보호는 물론 기판의 열변형을 방지할수 있어 제품의 신뢰성을 향상시키는 효과가 있다.The present invention as described above can effectively protect the device by preventing heat dissipation of the heat generating device to the air to the atmosphere, thereby improving the reliability of the product.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019860013260U KR890005042Y1 (en) | 1986-08-30 | 1986-08-30 | Set up pad for radiation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019860013260U KR890005042Y1 (en) | 1986-08-30 | 1986-08-30 | Set up pad for radiation board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR880005622U KR880005622U (en) | 1988-05-12 |
| KR890005042Y1 true KR890005042Y1 (en) | 1989-07-29 |
Family
ID=19255326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019860013260U KR890005042Y1 (en) | 1986-08-30 | 1986-08-30 | Set up pad for radiation board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR890005042Y1 (en) |
-
1986
- 1986-08-30 KR KR2019860013260U patent/KR890005042Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR880005622U (en) | 1988-05-12 |
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