KR890003004B1 - Preparation of anti-flammable polyethylene film - Google Patents
Preparation of anti-flammable polyethylene film Download PDFInfo
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- KR890003004B1 KR890003004B1 KR1019850005806A KR850005806A KR890003004B1 KR 890003004 B1 KR890003004 B1 KR 890003004B1 KR 1019850005806 A KR1019850005806 A KR 1019850005806A KR 850005806 A KR850005806 A KR 850005806A KR 890003004 B1 KR890003004 B1 KR 890003004B1
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- 229920000573 polyethylene Polymers 0.000 title claims abstract description 14
- 239000004698 Polyethylene Substances 0.000 title claims abstract description 12
- -1 polyethylene Polymers 0.000 title claims abstract description 12
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 8
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 8
- 239000008188 pellet Substances 0.000 claims abstract description 6
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229940057995 liquid paraffin Drugs 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 abstract description 15
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 13
- 238000001125 extrusion Methods 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- XIVNZHXRIPJOIZ-UHFFFAOYSA-N octadecanoic acid;zinc Chemical compound [Zn].CCCCCCCCCCCCCCCCCC(O)=O XIVNZHXRIPJOIZ-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
Description
본 발명은 열가소성수지인 폴리에치렌을 주제로한 난연성 조성물로서 난연성의 폴리에치렌 필름을 제조하는 방법에 관한 것이다.The present invention relates to a method for producing a flame-retardant polyethylene film as a flame-retardant composition based on polyethylene, which is a thermoplastic resin.
종래에는 주로 열경화수지에 난연성물질을 첨가하여 주물, 적층판, 건축자재등 가연성이 심각하게 고려되는 많은 용도를 포함한 용도에 사용되어 왔다. 그 밖에도 열가소성물질로 제조되는 사출성형제품, 파이프, 쉬트등에 난연성물질을 첨가하여 소기의 목적을 달성하여 왔으나 폴리에치렌의 압출성형에 의한 필름제조에 있어서 난연제를 일반적인 방법으로 첨가 조성하여서는 필름성형이 거의 불가능하였다.Background Art Conventionally, a flame retardant material is mainly added to a thermosetting resin, and thus it has been used for applications including many applications in which flammability is seriously considered such as castings, laminates, and building materials. In addition, flame retardant materials have been added to injection molded products, pipes, sheets, etc., which are made of thermoplastics, to achieve their intended purpose. It was almost impossible.
이상의 고분자 물질에 사용되는 난연제는 할로겐함유화합물, 금속함유화합물, 인화합물, 할로겐화유인화합물 또는 안티몬, 비소, 규소, 붕소, 비스무트, 셀렌함유화합물등 널리 알려진 난연제를 사용하고 있으나 고분자화합물에 따라 선택적으로 사용해야 하며 특히 필름용의 폴리에치렌의 경우에 있어서는 난연제 선택이 극히 제한되어 있을 뿐만 아니라 일반적인 배합방법으로는 필름성형이 거의 불가능하다.Flame retardants used in the above polymer materials include halogen-containing compounds, metal-containing compounds, phosphorus compounds, halogenated phosphorus compounds or widely known flame retardants such as antimony, arsenic, silicon, boron, bismuth, and selenium-containing compounds. In particular, in the case of polyethylene for film, the choice of flame retardant is extremely limited, and film forming is almost impossible by general mixing method.
본 발명은 저밀도 폴리에치렌을 주제로한 필름을 난연제조성물의 화학적특성과 물리적특성을 근거하여 오랜기간의 실험을 통하여 본 조성에 의하여 난연성폴리에치렌 필름제조가 가능하게 된 것이다.The present invention enables the production of flame-retardant polyethylene film by the present composition through a long period of experiments based on the chemical and physical properties of the low density polyethylene-based film based on the chemical and physical properties of the flame retardant composition.
이상의 본 발명에 의한 난연성폴리에치렌 제조방법은 1단계 공정으로서 중량비로서 저밀도 폴리에치렌 10부에 대하여 삼산화안티몬 14-18부, 스테아린산아연 2-5부, 유동파라핀 2-5부를 배합하여 다이스온도 260℃-300℃범위에서 이를 펠레트로 한다. 2단계로서 1단계 공정에서 얻은 펠레트조성물 1부에 대하여 저밀도 폴리에치렌 12-16부, 데카브로모디페닐옥사이드(Decabromo-diphenyloxide) 1-2부를 배합 혼련하여 다이스온도 220℃-260℃ 범위에서 인푸레숀방법으로 압출성형함을 특징으로 하는 난연성 폴리에치렌의 제조방법에 관한 것이다.The flame-retardant polyethylene production method according to the present invention is a one-step process by combining 14-18 parts of antimony trioxide, 2-5 parts of zinc stearate and 2-5 parts of liquid paraffin as a weight ratio to 10 parts of low-density polyethylene. It is pelleted in the range of 260 ° C-300 ° C. 12-16 parts of low-density polyethene and 1-2 parts of decabromo-diphenyloxide were blended and kneaded with respect to 1 part of the pellet composition obtained in the first step as a two-stage, in a die temperature of 220 ° C-260 ° C. The present invention relates to a method for producing a flame-retardant polyethylene characterized by extrusion molding by an inpressure method.
본 방법에서 1차 조성물이나 1차 조성물을 제외한 2차 조성물의 각각으로서는 필름성형이 거의 불가능하다.In this method, film forming is almost impossible for each of the primary compositions or the secondary compositions except the primary composition.
그 이류로서 1차 조성물로서 다양한 조성비를 적용하여 필름성형을 시도한 결과 필름에 삼산화안티몬의 미입자가 그대로 내재되어 필름상에 무수한 돌기가 형성되고 압출연신과정에서 필름이 파열되어 연속작업을 할수 없었으며 1차 조성물을 첨가하지 않은 2차 조성물의 경우에 있어서는 수적이 발생되고 이로 인해 역시 압출연신과정에서 빈번한 필름파열 현상을 피할 수 없었다. 또 본 방법에서 사용되는 1차 및 2차 조성물을 동시에 배합 혼련하여 동일조건하에서 필름성형시 필름성형이 가능하나 본 방법과 같이 온도차이를 갖게하여 제 1단계 공정에서 조성물을 얻고 이를 2단계 공정의 조성물과 함께 필름을 성형하는 방법에 비하여 작업성이 좋지않고 물리적 특성이 저하된다.As a result of this, as a result of attempting film forming by applying various composition ratios as the primary composition, microparticles of antimony trioxide were embedded in the film as it is, and numerous projections were formed on the film, and the film was ruptured during the extrusion drawing process, so that continuous work was not possible. In the case of the secondary composition without the addition of the primary composition, water droplets were generated, which also prevented frequent film rupture during extrusion. In addition, by mixing and kneading the primary and secondary compositions used in the present method at the same time, it is possible to form the film when forming the film under the same conditions. Compared to the method of forming a film with the composition, workability is poor and physical properties are lowered.
본 방법에서 사용되는 조성물중 삼산화안티몬은 필름에 난연성을 부여하는 난연제로서 665℃의 융점을 가지므로서 본 방법에 의한 압출성형온도에서는 용융되지 않는다. 또 이는 일반적을 농황산, 농염산, 강알카리암포트릭(Amphoteric)등에 용해되는 것으로 알려져 있으나 본 방법에서 적용되는 압출온도와 데카브로모디페닐 옥사이드 존재하에서 용해가 가능하다. 또 스테아린산 안연은 열 및 빛에 대한 안정제로서 용융상태에서 각 조성물의 분산성을 향상시키고 데케브로모디페닐 옥사이드의 고온에서 분해를 어느 정도 억제하며 130℃의 용융점을 가지므로서 압출온도에서 충분히 용해된다. 또 유동파라핀은 폴리에치렌과의 상용성이 극히 좋고 압출온도에서 용융조성물의 필름성형에 적합한 점도조절기능을 갖는다.Antimony trioxide in the composition used in the present method has a melting point of 665 DEG C as a flame retardant for imparting flame retardancy to the film, and therefore does not melt at the extrusion molding temperature according to the present method. In addition, it is generally known to dissolve in concentrated sulfuric acid, concentrated hydrochloric acid, strong alkali (Amphoteric), etc., but can be dissolved in the presence of the extrusion temperature and decabromodiphenyl oxide applied in the present method. Stearic acid zinc is a stabilizer against heat and light, which improves the dispersibility of each composition in the molten state, inhibits decomposition of dekebromodiphenyl oxide at a high temperature to some extent, and has a melting point of 130 ° C., so that it is sufficiently dissolved at extrusion temperature. do. In addition, the liquid paraffin has a very good compatibility with polyethylene and has a viscosity control function suitable for forming a film of a melt composition at an extrusion temperature.
이상의 본 방법으로 제조된 필름은 일반적인 폴리에치렌 필름에 비하여 물리적 특성이 대등하거나 약간 떨어지는 점이 있으나 우수한 난연성을 가지므로서 보일러 배관 보온테이프 단열재의 외부포장 및 커버등 화재위험성이 요구되는 건축재등 앞으로 그 용도가 크게 기대되는 제품이라 하겠다.The film produced by the above method has the same or slightly lower physical properties than the general poly ethylene film, but it has excellent flame retardancy, so that the building materials requiring fire hazards such as outer packaging and cover of the insulation pipe insulation tape of boiler pipe are required. The product is expected to be greatly used.
지금까지 본 발명에 대한 제조방법 작용효과등을 기술했지만 실시예를 들어 구체화하므로서 본 발명의 기술사상을 더욱 분명하게 할 수 있다.Although the manufacturing method effects and the like for the present invention have been described so far, the technical spirit of the present invention can be clarified by specifying examples.
[실시예 1]Example 1
제1단계 공정 : 저밀도 폴리에치렌 30kg, 삼산화안티몬 50kg, 스테아린산아연 10kg, 유동파라핀 10kg을 배합 혼련하고 1차 실린더 200℃, 2차 실린더 230℃, 3차 실린더 260℃, 다이스온도 300℃로 유지하여 펠레트화 한다.Step 1: Mix and knead 30 kg of low density polyethylene, 50 kg of antimony trioxide, 10 kg of zinc stearate, 10 kg of liquid paraffin, and keep the mixture at the primary cylinder 200 ℃, the secondary cylinder 230 ℃, the tertiary cylinder 260 ℃ and the die temperature 300 ℃. Pelletize by
제2단계 공정 : 저밀도 폴리에치렌 86kg, 제1단계 공정에서 얻은 펠레트조성물 6kg, 데카브로모디페닐옥사이드 8kg을 배합 혼련하고 1차 실린더 160℃, 2차 실린더 180℃, 3차 실린더 220℃, 다이스온도 260℃을 유지하여 인프레숀 방법으로 압출성형하여 0.05mm의 난연성 폴리에치렌 필름을 얻었다.Second stage process: 86 kg of low density polyethylene, 6 kg of pellet composition obtained in the first step, and 8 kg of decabromodiphenyl oxide were mixed and kneaded, and the first cylinder was 160 ° C, the second cylinder 180 ° C, the third cylinder 220 ° C, The die temperature was maintained at 260 ° C., followed by extrusion molding to obtain a flame retardant polyethylene film of 0.05 mm.
이상의 본 실시예에서 얻은 난연성필름은 150℃ 이하의 온도에서는 열변형이 없고 그 이상의 온도에서 온도가 상승됨에 따라 수축, 파열등 열변형이 있으나 자체 연소가 되지 않는 특징이 있었다.The flame retardant film obtained in the present embodiment has no heat deformation at a temperature of 150 ° C. or lower, and there is a heat deformation such as shrinkage and rupture as the temperature is increased at a higher temperature, but it does not have self-combustion.
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| KR1019850005806A KR890003004B1 (en) | 1985-08-12 | 1985-08-12 | Preparation of anti-flammable polyethylene film |
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| KR890003004B1 true KR890003004B1 (en) | 1989-08-18 |
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