KR870010218A - 포토 엣칭법에 의한 금속박판의 가공방법 - Google Patents
포토 엣칭법에 의한 금속박판의 가공방법Info
- Publication number
- KR870010218A KR870010218A KR1019870003341A KR870003341A KR870010218A KR 870010218 A KR870010218 A KR 870010218A KR 1019870003341 A KR1019870003341 A KR 1019870003341A KR 870003341 A KR870003341 A KR 870003341A KR 870010218 A KR870010218 A KR 870010218A
- Authority
- KR
- South Korea
- Prior art keywords
- thin plate
- metal thin
- photo etching
- processing metal
- etching method
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
- H01J9/142—Manufacture of electrodes or electrode systems of non-emitting electrodes of shadow-masks for colour television tubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61-89563 | 1986-04-17 | ||
JP61089563A JPS62247085A (ja) | 1986-04-17 | 1986-04-17 | フオトエッチング法による金属薄板の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870010218A true KR870010218A (ko) | 1987-11-30 |
KR910001776B1 KR910001776B1 (ko) | 1991-03-23 |
Family
ID=13974282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870003341A KR910001776B1 (ko) | 1986-04-17 | 1987-04-08 | 포토 엣칭법에 의한 금속박판의 가공방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4755257A (ko) |
JP (1) | JPS62247085A (ko) |
KR (1) | KR910001776B1 (ko) |
CN (1) | CN87102767A (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5062149A (en) * | 1987-10-23 | 1991-10-29 | General Dynamics Corporation | Millimeter wave device and method of making |
US5006432A (en) * | 1987-10-28 | 1991-04-09 | Kabushiki Kaisha Toshiba | Method for manufacturing a shadow mask |
US5186787A (en) * | 1988-05-03 | 1993-02-16 | Phillips Roger W | Pre-imaged high resolution hot stamp transfer foil, article and method |
US5336587A (en) * | 1988-05-24 | 1994-08-09 | Kabushiki Kaisha Toshiba | Method of manufacturing main plates for exposure printing |
US5127601A (en) * | 1989-01-23 | 1992-07-07 | Lightning Diversion Systems | Conformal lightning shield and method of making |
US5194698A (en) * | 1990-09-11 | 1993-03-16 | Hughes Aircraft Company | Apparatus and method using a permanent mandrel for manufacture of electrical circuitry |
US5139451A (en) * | 1990-12-31 | 1992-08-18 | Zenith Electronics Corporation | Processing and protecting a foil shadow mask for a tension mask color cathode ray tube |
US5348825A (en) * | 1991-07-02 | 1994-09-20 | Dai Nippon Printing Co., Ltd. | Method for manufacturing shadow mask and shadow mask manufactured by said method |
JP2637864B2 (ja) * | 1991-07-02 | 1997-08-06 | 大日本印刷株式会社 | シャドーマスクの製造方法 |
US5484074A (en) * | 1994-05-03 | 1996-01-16 | Bmc Industries, Inc. | Method for manufacturing a shadow mask |
US5500279A (en) * | 1994-08-26 | 1996-03-19 | Eastman Kodak Company | Laminated metal structure and metod of making same |
KR0175012B1 (ko) * | 1995-09-13 | 1999-02-18 | 김광호 | 초경강판재의 패턴 형성 방법 |
US20040200801A1 (en) * | 2001-11-19 | 2004-10-14 | Lai Laurence M.C. | Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
KR100832025B1 (ko) * | 2007-02-12 | 2008-05-27 | 최명훈 | 금속박판의 색상 구현방법 및 이에 의해 제조된 키패드 |
JP5660159B2 (ja) * | 2013-05-13 | 2015-01-28 | 大日本印刷株式会社 | 金属箔シートの製造方法 |
CN103716998B (zh) * | 2013-12-12 | 2017-01-11 | 中国电子科技集团公司第四十一研究所 | 一种金箔裁切方法 |
CN105568284A (zh) * | 2014-10-16 | 2016-05-11 | 黄浩祥 | 无连接点的金属薄板蚀刻方法及利用该方法制成的金属单元组 |
JP7072512B2 (ja) * | 2016-02-16 | 2022-05-20 | エルジー イノテック カンパニー リミテッド | 金属板、蒸着用マスクおよびその製造方法 |
KR102363276B1 (ko) * | 2017-07-20 | 2022-02-17 | 삼성디스플레이 주식회사 | 증착용 마스크 및 이의 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3506507A (en) * | 1967-11-22 | 1970-04-14 | Northern Engraving Co | Method of making a metal foil pattern by etching |
US3960561A (en) * | 1975-04-10 | 1976-06-01 | International Business Machines Corporation | Method for making electrical lead frame devices |
US4155801A (en) * | 1977-10-27 | 1979-05-22 | Rohr Industries, Inc. | Process for masking sheet metal for chemical milling |
JPS57116773A (en) * | 1981-01-12 | 1982-07-20 | Fujitsu Ltd | Production of metallic mask |
JPS57126971A (en) * | 1981-01-29 | 1982-08-06 | Susumu Hosaka | Method for precisely processing metal wafer |
US4341591A (en) * | 1981-04-08 | 1982-07-27 | Rca Corporation | Method of fabricating a color-selection structure for a CRT |
JPS5896877A (ja) * | 1981-12-07 | 1983-06-09 | Toshiba Corp | 金属板のエツチング方法 |
-
1986
- 1986-04-17 JP JP61089563A patent/JPS62247085A/ja active Granted
-
1987
- 1987-04-06 US US07/035,050 patent/US4755257A/en not_active Expired - Fee Related
- 1987-04-08 KR KR1019870003341A patent/KR910001776B1/ko not_active IP Right Cessation
- 1987-04-10 CN CN198787102767A patent/CN87102767A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US4755257A (en) | 1988-07-05 |
KR910001776B1 (ko) | 1991-03-23 |
JPS62247085A (ja) | 1987-10-28 |
JPH0424435B2 (ko) | 1992-04-27 |
CN87102767A (zh) | 1987-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR870010218A (ko) | 포토 엣칭법에 의한 금속박판의 가공방법 | |
KR860700182A (ko) | 웨이퍼 가공용필름 | |
KR880007791A (ko) | 금속박막의 선택증착방법 | |
DE3581295D1 (de) | Plasma-aetzverfahren. | |
JPS57162338A (en) | Method of etching semiconductor | |
FI874455A0 (fi) | Foerfarande och anordning foer roekgaskondensering. | |
IT1150221B (it) | Procedimento e dispositivo per il rivestimento di pezzi stampati mediante metallizzazione catodica | |
IT7831213A0 (it) | Processo di fabbricazione di sottili pellicole epitassiali. | |
DK2786D0 (da) | Metalbehandling | |
KR880700279A (ko) | 델타 범위 처리를 위한 개선된 천체 위치 결정 시스템 | |
IT8520228A0 (it) | Procedimento e dispositivo per il cambio di stampi. | |
KR870011678A (ko) | 알미늄 합금상의 포토레지스트 박리 방법 | |
ES555828A0 (es) | Procedimiento de obtencion de un bano de procesado fotografico | |
IT1208038B (it) | Procedimento di elaborazione disegnali per spettrometri nucleari. | |
DK223587A (da) | Fremgangsmaade til fremstilling af azopigmenter | |
KR860006051A (ko) | 사진평판의 스트리핑 방법 | |
FI882867A (fi) | Menetelmä metallipitoisten liuosten puhdistamiseksi | |
DK223487A (da) | Fremgangsmaade til fremstilling af azopigmenter | |
KR900013596A (ko) | 화합물 반도체의 에칭 방법 | |
IT1197805B (it) | Metodo per il tratamento di lenti a contatto | |
DK65887A (da) | Fremgangsmaade til fremstilling af l-sorbose | |
KR880008720A (ko) | 후막회로 장치의 제조방법 | |
IT8067933A0 (it) | Telescrivente elettronica per il trattamento di messaggi | |
FR2604184B1 (fr) | Procede et dispositif de fabrication de zirconium metal par reduction de tetrachlorure de zirconium | |
SU697398A1 (ru) | Способ обработки осадков |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19980317 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |