KR860000715A - Semiconductor chiller - Google Patents

Semiconductor chiller Download PDF

Info

Publication number
KR860000715A
KR860000715A KR1019850003727A KR850003727A KR860000715A KR 860000715 A KR860000715 A KR 860000715A KR 1019850003727 A KR1019850003727 A KR 1019850003727A KR 850003727 A KR850003727 A KR 850003727A KR 860000715 A KR860000715 A KR 860000715A
Authority
KR
South Korea
Prior art keywords
laminate portion
cooling device
laminate
semiconductor
semiconductor cooling
Prior art date
Application number
KR1019850003727A
Other languages
Korean (ko)
Inventor
히로시 이다하나
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌 세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR860000715A publication Critical patent/KR860000715A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음No content

Description

반도체 냉각장치Semiconductor chiller

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본원 발명에 의한 반도체 냉각장치의 일실시예를 나타낸 단면도, 제2도는 본원 발명의 적용대상의 일례인인버어터 장치의 회로도.1 is a cross-sectional view showing an embodiment of a semiconductor cooling device according to the present invention, Figure 2 is a circuit diagram of an inverter device which is an example of the application of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

(3),(3'):GTO, (4),(4'),(9):다이오우드, (5),(5'):스내버회로용콘덴서, (12):밀폐용기, (13): 냉매액, (15):응축기, (16):단자,(18):단자부착면, (19):냉각편, (S1),(S2):체적층.(3), (3 '): GTO, (4), (4'), (9): Diode, (5), (5 '): Snubber capacitor (12): Airtight container, (13 ): Refrigerant liquid, (15): condenser, (16): terminal, (18): terminal attachment surface, (19): cooling piece, (S 1 ), (S 2 ): volume layer.

Claims (2)

스위칭 소자와 다이오우드를 포함하는 반도체 소자의 적층체를 밀폐용기중의 냉매액이 담그고, 냉매액의 비등과 응축작용에 의해 상기 반도체 소자의 냉각을 하는 반도체 냉각장치에 있어서, 상기 적층체를 스위칭 소자를 포함하는 제1의 적층체 부분과 다이오우드를 포함하는 제2의 적층체 부분으로 분할하고, 이 제1의 적층체 부분을, 그 측부가 상기 밀폐용기에 형성되어 있는 단자인출부 근방에 대향하도록 배치된 것을 특징으로 하는 반도체 냉각장치.A semiconductor cooling device in which a coolant liquid in an airtight container is immersed in a stack of semiconductor elements including a switching element and a diode, and the coolant is cooled by boiling and condensation of the coolant liquid. A first laminate portion comprising a portion and a second laminate portion comprising a diode, and the first laminate portion so that its side faces the vicinity of the terminal lead-out portion formed in the sealed container. A semiconductor cooling device, characterized in that disposed. 상기 제1의 적층체 부분과 제2의 적층체 부분이 그들의 측부가 대향하도록 해서 배치되며, 또한 상기 밀폐용기의 단자인출부가 형성되어 있는 벽면과 상기 제1의 적층체 부분의 측부가 평행으로 되도록 배치되어 있는것을 특징으로 하는 특허청구의 범위 1기재의 반도체 냉각장치.The first laminate portion and the second laminate portion are disposed with their sides facing each other, and the wall surface on which the terminal lead-out portion of the hermetic container is formed and the side portion of the first laminate portion are parallel to each other. A semiconductor cooling device according to claim 1, which is arranged. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019850003727A 1984-06-02 1985-05-29 Semiconductor chiller KR860000715A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59112214A JPS60257158A (en) 1984-06-02 1984-06-02 Semiconductor refrigerator
JP84-112214 1984-06-02

Publications (1)

Publication Number Publication Date
KR860000715A true KR860000715A (en) 1986-01-30

Family

ID=14581108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850003727A KR860000715A (en) 1984-06-02 1985-05-29 Semiconductor chiller

Country Status (3)

Country Link
JP (1) JPS60257158A (en)
KR (1) KR860000715A (en)
AU (1) AU555550B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200033329A (en) * 2017-08-04 2020-03-27 어답틱스 리미티드 X-ray generator

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
AU618203B2 (en) * 1989-09-29 1991-12-12 Mitsubishi Denki Kabushiki Kaisha Boiling type cooler device for power semiconductor switching elements
DE102013215913A1 (en) * 2013-08-12 2015-02-12 Siemens Aktiengesellschaft High voltage diode rectifier
DE102013215911A1 (en) * 2013-08-12 2015-02-12 Siemens Aktiengesellschaft High voltage diode rectifier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200033329A (en) * 2017-08-04 2020-03-27 어답틱스 리미티드 X-ray generator

Also Published As

Publication number Publication date
AU4318485A (en) 1985-12-05
AU555550B2 (en) 1986-10-02
JPS60257158A (en) 1985-12-18

Similar Documents

Publication Publication Date Title
US6625024B2 (en) Power converter enclosure
US4941530A (en) Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
KR880003419A (en) Semiconductor devices
KR960026988A (en) Power integrated circuit
US9646927B2 (en) Power semiconductor device
KR910005418A (en) Semiconductor Structures for Near-coupled Substrate Temperature Sensing Devices
KR970013389A (en) Semiconductor device
KR860000715A (en) Semiconductor chiller
US10490469B2 (en) Power converting device
KR920007164A (en) Multilayer leadframe
KR910007116A (en) Resin Sealed Semiconductor Device
US5617293A (en) Bridge module
KR910010722A (en) Semiconductor memory device
KR920007178A (en) Semiconductor integrated circuit
US5381330A (en) Half-bridge arrangement for switching electrical power
JPS6285449A (en) Cooling structure for semiconductor device
KR940006281A (en) Semiconductor devices
JPS516515B1 (en)
US6211567B1 (en) Top heatsink for IGBT
JPH0547992B2 (en)
JPS6425554A (en) High power circuit board and hybrid integrated circuit thereof
Boteler et al. High-voltage stacked diode package
JP2590577B2 (en) Metal printed board
JPS5855834Y2 (en) Air-cooled electrical equipment
JPH02161758A (en) Sealed terminal device

Legal Events

Date Code Title Description
A201 Request for examination
SUBM Submission of document of abandonment before or after decision of registration