JP2590577B2 - Metal printed board - Google Patents

Metal printed board

Info

Publication number
JP2590577B2
JP2590577B2 JP2049812A JP4981290A JP2590577B2 JP 2590577 B2 JP2590577 B2 JP 2590577B2 JP 2049812 A JP2049812 A JP 2049812A JP 4981290 A JP4981290 A JP 4981290A JP 2590577 B2 JP2590577 B2 JP 2590577B2
Authority
JP
Japan
Prior art keywords
metal
printed board
metal plate
conductor circuit
metal printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2049812A
Other languages
Japanese (ja)
Other versions
JPH03252190A (en
Inventor
稔雄 黒崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2049812A priority Critical patent/JP2590577B2/en
Priority to DE19914105885 priority patent/DE4105885A1/en
Publication of JPH03252190A publication Critical patent/JPH03252190A/en
Priority to US07/857,125 priority patent/US5196990A/en
Application granted granted Critical
Publication of JP2590577B2 publication Critical patent/JP2590577B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、インバータ等の電力変換装置等に使用され
る金属プリント板に関する。Description: TECHNICAL FIELD The present invention relates to a metal printed board used for a power converter such as an inverter.

〔従来の技術〕[Conventional technology]

金属プリント板は、通常のガラスエポキシ樹脂基板に
比較して、その上に実装される部品の発生熱が容易に放
散できるという利点を持つ。他方、金属プリント板にお
いては、金属板と導体回路間に生じる浮遊容量が大きい
ため、信号が漏れやすくかつノイズも浸入しやすいとい
う欠点がある。The metal printed board has an advantage that the heat generated by components mounted thereon can be easily dissipated as compared with a normal glass epoxy resin board. On the other hand, a metal printed board has a drawback that a signal is easily leaked and noise is easily penetrated because a large stray capacitance is generated between the metal board and the conductor circuit.

第３図は従来の金属プリント板の一般的な構造示す断
面図である。この図において、１は金属板であり、２は
絶縁板である。この絶縁板２は金属板１に通常は接着さ
れている。３は導体回路であり、絶縁板２上に接着形成
されている。４は電子部品でハンダ５等で導体回路３に
取り付けられている。６は絶縁板２と金属板１との間に
形成される浮遊容量を記号で表したものである。FIG. 3 is a sectional view showing a general structure of a conventional metal printed board. In this figure, 1 is a metal plate and 2 is an insulating plate. This insulating plate 2 is usually bonded to the metal plate 1. Reference numeral 3 denotes a conductor circuit, which is formed by bonding on the insulating plate 2. Reference numeral 4 denotes an electronic component which is attached to the conductor circuit 3 with solder 5 or the like. Reference numeral 6 denotes a stray capacitance formed between the insulating plate 2 and the metal plate 1 using symbols.

電子部品４に発生した熱は大部分は矢印８の方向に放
散される。このときの熱伝導の良否は絶縁板２の厚さt1
が薄いほど良くなるので、一般には導体回路３と金属板
１の間に印加される電圧に対する耐力を考慮した上で、
厚さt1はできるだけ薄く形成される。Most of the heat generated in the electronic component 4 is dissipated in the direction of the arrow 8. The quality of the heat conduction at this time is determined by the thickness t 1 of the insulating plate 2.
Is thinner, so that in general, taking into account the proof strength against the voltage applied between the conductor circuit 3 and the metal plate 1,
The thickness t 1 is as thin as possible form.

他方、浮遊容量６によって回路間の信号漏洩を生じ、
また、外部から例えば矢印９の如くに金属板１を通して
のノイズの浸入を生じる。これの対策としては、絶縁板
２の厚さt1を大きくすれば良いが、これにともなって熱
の伝導が悪くなるので熱放散に問題が出てくる。On the other hand, the stray capacitance 6 causes signal leakage between circuits,
In addition, noise may enter from outside through the metal plate 1 as indicated by an arrow 9, for example. The this countermeasure, it may be increasing the thickness t 1 of the insulating plate 2, it comes out a problem with the heat dissipation the heat conduction is deteriorated accordingly.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

そこで、本発明が解決しようとする課題は、上記の如
き金属プリント板において、熱放散の問題を回避しなが
らも、導体回路と金属板との間の浮遊容量を減少させる
ことにある。Therefore, an object of the present invention is to reduce the stray capacitance between a conductor circuit and a metal plate while avoiding the problem of heat dissipation in the above-described metal printed board.

〔課題を解決するための手段〕[Means for solving the problem]

上記課題は、本発明によれば、金属板上に載置された
絶縁板の表面に導体回路を施した金属プリント板におい
て、導体回路に対面する金属板部分に溝を形成すること
によって解決される。According to the present invention, the above problems are solved by forming a groove in a metal plate portion facing a conductor circuit in a metal printed board in which a conductor circuit is provided on a surface of an insulating plate placed on the metal plate. You.

〔作用〕[Action]

上記の解決手段によれば、電子部品に発生した熱の大
部分はハンダ部を通して直下の絶縁板を貫流して金属板
へ流れるので、溝があっても熱伝導はあまり阻害されな
い。他方、導体回路と金属板との間の浮遊容量は、金属
板における溝の形成により、大幅に減少するので信号の
漏洩やノイズの浸入が有効に抑制される。According to the above solution, most of the heat generated in the electronic component flows through the insulating plate immediately below through the solder portion and flows to the metal plate. Therefore, even if there is a groove, heat conduction is not hindered much. On the other hand, the stray capacitance between the conductor circuit and the metal plate is significantly reduced due to the formation of the groove in the metal plate, so that signal leakage and noise intrusion are effectively suppressed.

〔実施例〕〔Example〕

第１図および第２図は本発明の実施例を示し、第１図
は断面図、第２図は上面部分図である。これらの図にお
いて、１は金属板、２は絶縁板で金属板１に通常は接着
されている。３は導体回路で絶縁板２上に接着で形成さ
れている。４は電子部品でハンダ５等で導体回路３に取
り付けられている。６は絶縁板２と金属板１との間に形
成される浮遊容量を記号で表したものである。1 and 2 show an embodiment of the present invention. FIG. 1 is a sectional view and FIG. 2 is a partial top view. In these figures, 1 is a metal plate and 2 is an insulating plate, which is usually bonded to the metal plate 1. Reference numeral 3 denotes a conductor circuit formed on the insulating plate 2 by bonding. Reference numeral 4 denotes an electronic component which is attached to the conductor circuit 3 with solder 5 or the like. Reference numeral 6 denotes a stray capacitance formed between the insulating plate 2 and the metal plate 1 using symbols.

第３図の従来例と相違する点は、金属板１の導体回路
２と対向する面に、回路とほぼ同じ形状の溝７を深さt2
幅w2で形成した点である。この場合に、w2は導体回路幅
w1より大きく設定することにより溝縁部の角と導体回路
部の間に生じる電界集中を避け、t2の増大を防止でき
る。The difference from the conventional example of FIG. 3 is that a groove 7 having substantially the same shape as the circuit is formed on the surface of the metal plate 1 facing the conductor circuit 2 at a depth t 2.
Is a point that was formed with a width w 2. In this case, w 2 is the conductor circuit width
avoiding field concentration generated between the corner and the conductor circuit portion of the groove edge portion by setting larger than w 1, it can prevent an increase in t 2.

かかる構造によって、熱伝導を阻害することなく浮遊
容量の少ない金属プリント板を実現することができる。
すなわち、電子部品４に発生した熱の大部分は、ハンダ
５部を通して直下の絶縁板２を貫流し金属板へ流れるの
で溝７があっても熱伝導はあまり阻害されない。他方、
浮遊容量は溝７の形成により、大幅に減少するので信号
の漏洩やノイズの浸入を有効に抑制することができる。
また、溝の形成によって絶縁板との接着強度が向上する
結果ヒートサイクルに強い金属プリント板が得られるよ
うになる。With such a structure, it is possible to realize a metal printed board having a small stray capacitance without hindering heat conduction.
That is, most of the heat generated in the electronic component 4 flows through the insulating plate 2 directly below through the solder 5 and flows to the metal plate, so that even if the groove 7 is provided, the heat conduction is not hindered much. On the other hand,
Since the stray capacitance is greatly reduced by the formation of the groove 7, signal leakage and noise intrusion can be effectively suppressed.
Also, the formation of the groove improves the adhesive strength with the insulating plate, so that a metal printed board that is resistant to heat cycles can be obtained.

本発明は金属板１と絶縁板２とが接着されない場合も
有効であることは勿論である。The present invention is, of course, effective even when the metal plate 1 and the insulating plate 2 are not bonded.

〔発明の効果〕〔The invention's effect〕

以上のように、本発明によれば、導体回路に対面する
金属板部分に溝を形成することによって、熱伝導を阻害
することなく浮遊容量を大幅に減少させることができ、
信号の漏洩やノイズの浸入を有効に抑制することができ
る。As described above, according to the present invention, by forming a groove in the metal plate portion facing the conductor circuit, the stray capacitance can be significantly reduced without hindering heat conduction,
Signal leakage and noise intrusion can be effectively suppressed.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明による金属プリント板の実施例を示す断
面概略図、第２図は第１図の金属プリント板の実施例の
上面部分図、第３図は従来の金属プリント板の実施例を
示す断面概略図である。 １……金属板、２……絶縁板、３……導体回路、４……
電子部品、５……ハンダ、６……浮遊容量、７……溝。FIG. 1 is a schematic sectional view showing an embodiment of a metal printed board according to the present invention, FIG. 2 is a partial top view of the embodiment of the metal printed board of FIG. 1, and FIG. 3 is an embodiment of a conventional metal printed board. FIG. 1 ... metal plate, 2 ... insulating plate, 3 ... conductor circuit, 4 ...
Electronic components, 5: solder, 6: floating capacitance, 7: groove.

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】金属板上に載置された絶縁板の表面に導体
回路を施した金属プリント板において、導体回路に対面
する金属板部分に溝を形成したことを特徴とする金属プ
リント板。1. A metal printed board in which a conductive circuit is provided on a surface of an insulating plate mounted on the metal plate, wherein a groove is formed in a metal plate portion facing the conductive circuit. 【請求項２】前記溝はそれぞれが対面する導体回路部分
とほぼ同一の平面形状を有することを特徴とする請求項
１記載の金属プリント板。2. The metal printed circuit board according to claim 1, wherein said grooves have substantially the same planar shape as the conductor circuit portions facing each other. 【請求項３】前記溝の幅はそれぞれが対面する導体回路
部分の幅よりも大きいことを特徴とする請求項２記載の
金属プリント板。3. The metal printed board according to claim 2, wherein the width of each of the grooves is larger than the width of each of the conductor circuit portions facing each other.
JP2049812A 1990-03-01 1990-03-01 Metal printed board Expired - Lifetime JP2590577B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2049812A JP2590577B2 (en) 1990-03-01 1990-03-01 Metal printed board
DE19914105885 DE4105885A1 (en) 1990-03-01 1991-02-25 Metal circuit board with circuit on insulating plate - has depressions formed in part of metal plate opposite to circuit
US07/857,125 US5196990A (en) 1990-03-01 1992-03-25 Metal printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2049812A JP2590577B2 (en) 1990-03-01 1990-03-01 Metal printed board

Publications (2)

Publication Number Publication Date
JPH03252190A JPH03252190A (en) 1991-11-11
JP2590577B2 true JP2590577B2 (en) 1997-03-12

Family

ID=12841537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2049812A Expired - Lifetime JP2590577B2 (en) 1990-03-01 1990-03-01 Metal printed board

Country Status (2)

Country Link
JP (1) JP2590577B2 (en)
DE (1) DE4105885A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010027149A1 (en) * 2010-07-14 2012-01-19 Fela Hilzinger Gmbh Bendable metal core board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2579060B1 (en) * 1985-03-18 1987-04-17 Socapex PRINTED CIRCUIT BOARD WITH HEAT EXCHANGER AND METHOD FOR MANUFACTURING SUCH A BOARD
DE3633625A1 (en) * 1985-12-04 1987-06-11 Vdo Schindling CARRIER PLATE
DE3829117A1 (en) * 1988-08-27 1990-03-08 Standard Elektrik Lorenz Ag Metal core printed circuit board
DE3913161A1 (en) * 1989-04-21 1990-10-31 Schulz Harder Juergen MULTI-LAYERED SUBSTRATE OF COPPER AND CERAMIC LAYERS FOR ELECTRICAL CIRCUIT BOARDS
US5316831A (en) * 1991-05-08 1994-05-31 Fuji Electric Co., Ltd. Metallic printed board

Also Published As

Publication number Publication date
DE4105885A1 (en) 1991-09-05
JPH03252190A (en) 1991-11-11

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