KR850000906A - 유전체 유리 및 후막회로 - Google Patents

유전체 유리 및 후막회로 Download PDF

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Publication number
KR850000906A
KR850000906A KR1019840002387A KR840002387A KR850000906A KR 850000906 A KR850000906 A KR 850000906A KR 1019840002387 A KR1019840002387 A KR 1019840002387A KR 840002387 A KR840002387 A KR 840002387A KR 850000906 A KR850000906 A KR 850000906A
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KR
South Korea
Prior art keywords
dielectric
glass
thick film
weight
dielectric glass
Prior art date
Application number
KR1019840002387A
Other languages
English (en)
Inventor
야코부스 마리아 요르만(외 1) 헨드릭
Original Assignee
아이. 엠. 레르너
엔. 브이. 필립스 글로아이람펜 파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아이. 엠. 레르너, 엔. 브이. 필립스 글로아이람펜 파브리켄 filed Critical 아이. 엠. 레르너
Publication of KR850000906A publication Critical patent/KR850000906A/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/105Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing aluminium
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00Compositions for glass with special properties
    • C03C4/16Compositions for glass with special properties for dielectric glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322Composite web or sheet
    • Y10T428/24331Composite web or sheet including nonapertured component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음.

Description

유전체 유리 및 후막회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 다층회로에서 교차도체를 분리하는 유전체 유리에 있어서, ZNO 10-25 PbO 7.5-25 SiO250-60 Al2O37.5-12.5인 한계값 내에서 분지비의 합성물을 갖는것을 특징으로 하는 유전체 유리.
  2. 제1항에 따른 유전체 유리에 있어서, ZND 15-20 PbO 10-15 SiO250-60 Al2O37.5-12.5인 한계값 내에서 분자비의 합성물을 갖는것을 특징으로 하는 유전체 유리.
  3. 제1항이나 제2항에 따른 유전체에 있어서, 기껏해야 5% 중량으로 하나이상의 색산화물을 구비하는 것을 특징으로 하는 유전체.
  4. 제1항 내지 제3항중 어느 한 항에 따른 유전체에 있어서, 미세하게 세분된 형태와 20내지 40%의 중량으로 낮은 가용성 산화물질을 구비하는 것을 특징으로 하는 유전체.
  5. 제1항 내지 제3항에 따른 유전체에 있어서, 제1예에서 유리에서 용해되어 최종생성물에서 결정상의 양을 증가시키는 산화물질을 구비하는 것을 특징으로 하는 유전체.
  6. 제1항 내지 제5항중 어느 한 항에 따른 유리합성물에서 생성된 유리세라믹 유전체에 있어서, 유리세라믹 유전체는 10-20%의 중량으로 결정상을 함유하는 것을 특징으로 하는 유리세라믹 유전체.
  7. 제6항에 따라서, 다층후막회로는 교차도체 분리용 유전체 유리세라믹과 임의로 표면층을 구비하는 것을 특징으로 하는 다층후막회로.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019840002387A 1983-05-06 1984-05-03 유전체 유리 및 후막회로 KR850000906A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8301604 1983-05-06
NL8301604A NL8301604A (nl) 1983-05-06 1983-05-06 Dielektrisch glas in meerlagenschakelingen en hiermee uitgeruste dikke filmschakelingen.

Publications (1)

Publication Number Publication Date
KR850000906A true KR850000906A (ko) 1985-03-09

Family

ID=19841815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840002387A KR850000906A (ko) 1983-05-06 1984-05-03 유전체 유리 및 후막회로

Country Status (7)

Country Link
US (1) US4609582A (ko)
EP (1) EP0124943B1 (ko)
JP (1) JPS59207851A (ko)
KR (1) KR850000906A (ko)
CA (1) CA1223118A (ko)
DE (1) DE3461069D1 (ko)
NL (1) NL8301604A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法
US4759965A (en) * 1985-08-06 1988-07-26 Canon Kabushiki Kaisha Ceramic, preparation thereof and electronic circuit substrate by use thereof
JPS6340397A (ja) * 1986-08-05 1988-02-20 富士通株式会社 ガラスセラミツク多層回路基板
JPH0772092B2 (ja) * 1988-02-10 1995-08-02 日本特殊陶業株式会社 低温焼成基板
US5066620A (en) * 1989-01-31 1991-11-19 Asahi Glass Company Ltd. Conductive paste compositions and ceramic substrates
US4985376A (en) * 1989-01-31 1991-01-15 Asahi Glass Company, Ltd. Conductive paste compositions and ceramic substrates
US5397830A (en) * 1994-01-24 1995-03-14 Ferro Corporation Dielectric materials
US5714246A (en) * 1994-05-13 1998-02-03 Ferro Corporation Conductive silver low temperature cofired metallic green tape
US6007900A (en) * 1995-04-28 1999-12-28 Murata Manufacturing Co., Ltd. Dielectric paste and thick-film capacitor using same
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
CN109626815B (zh) * 2019-01-23 2021-10-01 成都光明光电股份有限公司 光学玻璃、玻璃预制件、光学元件及光学仪器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124928C (ko) * 1960-03-28
US3586522A (en) * 1967-06-01 1971-06-22 Du Pont Glass-ceramics containing baal2si208 crystalline phase
US3493405A (en) * 1967-08-07 1970-02-03 Gen Electric Semiconductor encapsulation glass
US3849097A (en) * 1970-10-07 1974-11-19 Corning Glass Works Method for continuously hot forming strong laminated bodies
US4029897A (en) * 1975-08-07 1977-06-14 Quality Hermetics Limited Glass seal
US4111708A (en) * 1978-01-06 1978-09-05 Corning Glass Works Machinable glasses
JPS5827643B2 (ja) * 1979-07-13 1983-06-10 株式会社日立製作所 非直線抵抗体およびその製法
JPS5832038A (ja) * 1981-08-14 1983-02-24 Hoya Corp フオトエツチングマスク用無アルカリガラス

Also Published As

Publication number Publication date
DE3461069D1 (en) 1986-12-04
JPS6316345B2 (ko) 1988-04-08
CA1223118A (en) 1987-06-23
NL8301604A (nl) 1984-12-03
JPS59207851A (ja) 1984-11-26
US4609582A (en) 1986-09-02
EP0124943A1 (de) 1984-11-14
EP0124943B1 (de) 1986-10-29

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