KR20230163356A - 도전 입자의 분산액과 그 제조 방법, 도전막 형성용도포액 및 도전 피막을 구비한 기재 - Google Patents

도전 입자의 분산액과 그 제조 방법, 도전막 형성용도포액 및 도전 피막을 구비한 기재 Download PDF

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Publication number: KR20230163356A
Authority: KR; South Korea
Prior art keywords: dispersion; particle size; particles; conductive particles; mass
Prior art date: 2021-03-30

Application number

KR1020237026259A

Other languages

English (en)

Korean (ko)

Inventor

고스케 미나토

히로타다 아라카네

료 무라구치

Original Assignee

니끼 쇼꾸바이 카세이 가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-03-30

Filing date

2022-03-30

Publication date

2023-11-30

2022-03-30 Application filed by 니끼 쇼꾸바이 카세이 가부시키가이샤 filed Critical 니끼 쇼꾸바이 카세이 가부시키가이샤

2023-11-30 Publication of KR20230163356A publication Critical patent/KR20230163356A/ko

Links

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239000006185 dispersion Substances 0.000 title claims abstract description 84
239000011248 coating agent Substances 0.000 title claims description 49
238000000576 coating method Methods 0.000 title claims description 49
238000004519 manufacturing process Methods 0.000 title description 3
239000000463 material Substances 0.000 title description 2
239000011164 primary particle Substances 0.000 claims abstract description 27
238000009826 distribution Methods 0.000 claims abstract description 20
238000002296 dynamic light scattering Methods 0.000 claims abstract description 9
XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 6
229910001887 tin oxide Inorganic materials 0.000 claims abstract description 6
230000001186 cumulative effect Effects 0.000 claims abstract description 5
239000007788 liquid Substances 0.000 claims description 49
239000003795 chemical substances by application Substances 0.000 claims description 29
238000000034 method Methods 0.000 claims description 11
239000000758 substrate Substances 0.000 claims description 10
239000002904 solvent Substances 0.000 claims description 9
239000002253 acid Substances 0.000 claims description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 18
239000011230 binding agent Substances 0.000 description 13
239000007787 solid Substances 0.000 description 13
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230000000052 comparative effect Effects 0.000 description 11
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
238000003756 stirring Methods 0.000 description 5
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
239000000701 coagulant Substances 0.000 description 4
LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
229920000642 polymer Polymers 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
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KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
238000005054 agglomeration Methods 0.000 description 3
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229910000147 aluminium phosphate Inorganic materials 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
230000007423 decrease Effects 0.000 description 3
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
239000012528 membrane Substances 0.000 description 3
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238000003860 storage Methods 0.000 description 3
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NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
229920002873 Polyethylenimine Polymers 0.000 description 2
VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000009616 inductively coupled plasma Methods 0.000 description 2
239000003456 ion exchange resin Substances 0.000 description 2
229920003303 ion-exchange polymer Polymers 0.000 description 2
238000005259 measurement Methods 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
239000000126 substance Substances 0.000 description 2
LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
239000005711 Benzoic acid Substances 0.000 description 1
235000011054 acetic acid Nutrition 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
150000001298 alcohols Chemical class 0.000 description 1
125000000129 anionic group Chemical group 0.000 description 1
WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
229910000410 antimony oxide Inorganic materials 0.000 description 1
238000000149 argon plasma sintering Methods 0.000 description 1
239000002585 base Substances 0.000 description 1
235000010233 benzoic acid Nutrition 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
125000004432 carbon atom Chemical group C* 0.000 description 1
125000002091 cationic group Chemical group 0.000 description 1
235000015165 citric acid Nutrition 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
239000002270 dispersing agent Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000001914 filtration Methods 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
239000011521 glass Substances 0.000 description 1
-1 glycol ethers Chemical class 0.000 description 1
150000002334 glycols Chemical class 0.000 description 1
125000005843 halogen group Chemical group 0.000 description 1
150000002430 hydrocarbons Chemical group 0.000 description 1
125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
229940071870 hydroiodic acid Drugs 0.000 description 1
230000003301 hydrolyzing effect Effects 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000010954 inorganic particle Substances 0.000 description 1
238000005342 ion exchange Methods 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
239000012046 mixed solvent Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
235000005985 organic acids Nutrition 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
150000003961 organosilicon compounds Chemical class 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
229920000768 polyamine Polymers 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

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Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Life Sciences & Earth Sciences (AREA)
Materials Engineering (AREA)
Wood Science & Technology (AREA)
Chemical Kinetics & Catalysis (AREA)
Dispersion Chemistry (AREA)
Inorganic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Paints Or Removers (AREA)
Conductive Materials (AREA)
Non-Insulated Conductors (AREA)

KR1020237026259A 2021-03-30 2022-03-30 도전 입자의 분산액과 그 제조 방법, 도전막 형성용도포액 및 도전 피막을 구비한 기재 KR20230163356A (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2021057036A JP7216135B2 (ja)	2021-03-30	2021-03-30	導電粒子の分散液とその製造方法、導電膜形成用の塗布液及び導電被膜付基材
JPJP-P-2021-057036		2021-03-30
PCT/JP2022/015854 WO2022210848A1 (ja)	2021-03-30	2022-03-30	導電粒子の分散液とその製造方法、導電膜形成用の塗布液及び導電被膜付基材

Publications (1)

Publication Number	Publication Date
KR20230163356A true KR20230163356A (ko)	2023-11-30

Family

ID=83456426

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020237026259A KR20230163356A (ko)	2021-03-30	2022-03-30	도전 입자의 분산액과 그 제조 방법, 도전막 형성용도포액 및 도전 피막을 구비한 기재

Country Status (5)

Country	Link
JP (1)	JP7216135B2 (ja)
KR (1)	KR20230163356A (ja)
CN (1)	CN116829254A (ja)
TW (1)	TW202301382A (ja)
WO (1)	WO2022210848A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2859790B2 (ja) *	1993-02-10	1999-02-24	住友大阪セメント株式会社	帯電防止・高屈折率膜形成用塗料および帯電防止・反射防止膜付き透明材料積層体および表示装置
JP2005305392A (ja) *	2004-04-26	2005-11-04	Jsr Corp	アンチモン含有酸化スズ粒子分散液の製造方法及び透明性導電膜
JP5096666B2 (ja) *	2005-06-06	2012-12-12	日揮触媒化成株式会社	鎖状導電性酸化物微粒子の製造方法、鎖状導電性酸化物微粒子、透明導電性被膜形成用塗料および透明導電性被膜付基材
JP5168790B2 (ja) *	2006-02-10	2013-03-27	住友大阪セメント株式会社	塗料とその製造方法及びそれを用いた塗膜並びに塗膜の製造方法
JP5555082B2 (ja) *	2010-07-20	2014-07-23	日揮触媒化成株式会社	透明被膜形成用塗布液および透明被膜付基材
JP6016548B2 (ja) *	2012-09-19	2016-10-26	日揮触媒化成株式会社	透明被膜形成用塗布液および透明被膜付基材
JP2014177552A (ja) *	2013-03-14	2014-09-25	Hitachi Maxell Ltd	透明導電性コーティング組成物、透明導電性膜及びタッチパネル機能内蔵型横電界方式液晶表示パネル
JP7096656B2 (ja) *	2017-09-29	2022-07-06	マクセル株式会社	コーティング組成物、導電性膜、タッチパネル及び製造方法
JP6470860B1 (ja) *	2018-03-15	2019-02-13	マクセルホールディングス株式会社	コーティング組成物、導電性膜及び液晶表示パネル

2021
- 2021-03-30 JP JP2021057036A patent/JP7216135B2/ja active Active
2022
- 2022-03-30 CN CN202280014219.XA patent/CN116829254A/zh active Pending
- 2022-03-30 TW TW111112303A patent/TW202301382A/zh unknown
- 2022-03-30 WO PCT/JP2022/015854 patent/WO2022210848A1/ja active Application Filing
- 2022-03-30 KR KR1020237026259A patent/KR20230163356A/ko unknown

Also Published As

Publication number	Publication date
JP2022154143A (ja)	2022-10-13
JP7216135B2 (ja)	2023-01-31
CN116829254A (zh)	2023-09-29
TW202301382A (zh)	2023-01-01
WO2022210848A1 (ja)	2022-10-06

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