KR20210081391A - 인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크 - Google Patents

인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크 Download PDF

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Publication number
KR20210081391A
KR20210081391A KR1020217015159A KR20217015159A KR20210081391A KR 20210081391 A KR20210081391 A KR 20210081391A KR 1020217015159 A KR1020217015159 A KR 1020217015159A KR 20217015159 A KR20217015159 A KR 20217015159A KR 20210081391 A KR20210081391 A KR 20210081391A
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KR
South Korea
Prior art keywords
substituted
group
unsubstituted
radiation curable
curable inkjet
Prior art date
Application number
KR1020217015159A
Other languages
English (en)
Korean (ko)
Inventor
요한 로쿠피에
리타 토어프스
마리옹 소바조
Original Assignee
아그파-게바에르트 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아그파-게바에르트 엔.브이. filed Critical 아그파-게바에르트 엔.브이.
Publication of KR20210081391A publication Critical patent/KR20210081391A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020217015159A 2018-11-20 2019-11-15 인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크 KR20210081391A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18207145.6 2018-11-20
EP18207145 2018-11-20
PCT/EP2019/081430 WO2020104302A1 (en) 2018-11-20 2019-11-15 Radiation curable inkjet ink for manufacturing printed circuit boards

Publications (1)

Publication Number Publication Date
KR20210081391A true KR20210081391A (ko) 2021-07-01

Family

ID=64402022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217015159A KR20210081391A (ko) 2018-11-20 2019-11-15 인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크

Country Status (6)

Country Link
US (1) US20220010156A1 (zh)
EP (1) EP3884002A1 (zh)
JP (1) JP2022511422A (zh)
KR (1) KR20210081391A (zh)
CN (1) CN112996867A (zh)
WO (1) WO2020104302A1 (zh)

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EP4032958A1 (en) 2021-01-25 2022-07-27 Agfa-Gevaert Nv Radiation curable inkjet inks
EP4190866A1 (en) 2021-12-02 2023-06-07 Agfa-Gevaert Nv Radiation curable inkjet inks
CN117916222A (zh) * 2022-07-17 2024-04-19 香港科技大学 亲脂性锚定物的组合物及其应用
WO2024017881A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017925A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017926A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017864A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards

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Also Published As

Publication number Publication date
EP3884002A1 (en) 2021-09-29
JP2022511422A (ja) 2022-01-31
CN112996867A (zh) 2021-06-18
US20220010156A1 (en) 2022-01-13
WO2020104302A1 (en) 2020-05-28

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