KR20210015672A - 시트재 첩부 방법 및 시트재 첩부 장치 - Google Patents

시트재 첩부 방법 및 시트재 첩부 장치 Download PDF

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Publication number
KR20210015672A
KR20210015672A KR1020200093599A KR20200093599A KR20210015672A KR 20210015672 A KR20210015672 A KR 20210015672A KR 1020200093599 A KR1020200093599 A KR 1020200093599A KR 20200093599 A KR20200093599 A KR 20200093599A KR 20210015672 A KR20210015672 A KR 20210015672A
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KR
South Korea
Prior art keywords
sheet material
adhesive tape
attaching
wafer
convex portion
Prior art date
Application number
KR1020200093599A
Other languages
English (en)
Korean (ko)
Inventor
스구루 이즈미다
아츠시 하시모토
유키토시 하세
Original Assignee
닛토덴코 가부시키가이샤
닛토 세이키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤, 닛토 세이키 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20210015672A publication Critical patent/KR20210015672A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR1020200093599A 2019-07-31 2020-07-28 시트재 첩부 방법 및 시트재 첩부 장치 KR20210015672A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-141076 2019-07-31
JP2019141076A JP2021027070A (ja) 2019-07-31 2019-07-31 シート材貼付け方法およびシート材貼付け装置

Publications (1)

Publication Number Publication Date
KR20210015672A true KR20210015672A (ko) 2021-02-10

Family

ID=74483175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200093599A KR20210015672A (ko) 2019-07-31 2020-07-28 시트재 첩부 방법 및 시트재 첩부 장치

Country Status (4)

Country Link
JP (1) JP2021027070A (zh)
KR (1) KR20210015672A (zh)
CN (1) CN112309949A (zh)
TW (1) TW202109703A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016122763A (ja) 2014-12-25 2016-07-07 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5973203B2 (ja) * 2012-03-29 2016-08-23 リンテック株式会社 シート貼付装置および貼付方法
JP6126938B2 (ja) * 2013-08-09 2017-05-10 リンテック株式会社 シート貼付装置及びシート貼付方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016122763A (ja) 2014-12-25 2016-07-07 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置

Also Published As

Publication number Publication date
TW202109703A (zh) 2021-03-01
CN112309949A (zh) 2021-02-02
JP2021027070A (ja) 2021-02-22

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