KR20180120248A - Phase change material - Google Patents

Phase change material Download PDF

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KR20180120248A
KR20180120248A KR1020187029072A KR20187029072A KR20180120248A KR 20180120248 A KR20180120248 A KR 20180120248A KR 1020187029072 A KR1020187029072 A KR 1020187029072A KR 20187029072 A KR20187029072 A KR 20187029072A KR 20180120248 A KR20180120248 A KR 20180120248A
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weight
thermally conductive
microns
micron
thermal interface
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KR1020187029072A
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KR102554661B1 (en
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브라이트 장
웨이 준 왕
야 췬 리우
홍 민 황
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허니웰 인터내셔널 인코포레이티드
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Abstract

열 계면 물질은, 일 예시적인 구현으로, 적어도 하나의 폴리머, 적어도 하나의 상 변화 물질, 적어도 하나의 가교제 및 적어도 하나의 열 전도성 충전제를 포함한다. 적어도 하나의 열 전도성은 약 1미크론 이하의 입자 직경을 갖는 제1 복수의 입자를 포함한다. 적어도 하나의 열 전도성 충전제는 열 계면 물질의 총 중량의 적어도 80중량%로 포함된다. 열 계면 물질을 형성하기 위한 제형 및 열 계면 물질을 포함하는 전자 부품이 또한 제공된다.The thermal interface material, in one exemplary implementation, comprises at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermal conductivity comprises a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt% of the total weight of the thermal interface material. An electronic component comprising a formulation for forming a thermal interface material and a thermal interface material is also provided.

Description

상 변화 물질Phase change material

본 발명은 일반적으로 열 계면 물질에 관한 것으로, 보다 상세하게는 상 변화 물질을 포함하는 열 계면 물질에 관한 것이다.FIELD OF THE INVENTION The present invention relates generally to thermal interface materials, and more particularly to a thermal interface material comprising a phase change material.

열 계면 물질은 중앙 처리 장치, 비디오 그래픽 어레이, 서버, 게임 콘솔, 스마트폰, LED 보드 등과 같은 전자 부품으로부터 열을 소멸시키기 위해 널리 사용된다. 열 계면 물질은 전형적으로 전자 부품에서 열 확산기로 과도한 열을 전달한 다음, 열을 열 싱크에 전달하는 데 사용된다.Thermal interface materials are widely used to dissipate heat from electronic components such as central processing units, video graphics arrays, servers, game consoles, smart phones, LED boards, and the like. Thermal interface materials are typically used to transfer excessive heat from an electronic component to a heat spreader, and then to transfer heat to the heat sink.

도 1은 실리콘 다이(12), 인쇄 회로 기판(14), 및 인쇄 회로 기판(14) 상의 복수의 플립칩 접합부(16)를 포함하는 전자 칩(10)을 개략적으로 나타낸다. 전자 칩(10)은 예시적으로 하나 이상의 제1 열 계면 물질(TIM)(22)에 의해 열 확산기(18) 및 열 싱크(20)에 연결된다. 도 1에 나타낸 바와 같이, 제1 TIM(22A)은 열 싱크(20)와 열 확산기(18)를 연결하고, 제2 TIM(22B)은 열 확산기(18)와 전자칩(10)의 실리콘 다이(12)를 연결한다. 열 계면 물질(22A, 22B) 중 하나 또는 둘 모두는 후술하는 열 계면 물질일 수 있다.1 schematically depicts an electronic chip 10 including a silicon die 12, a printed circuit board 14 and a plurality of flip chip junctions 16 on a printed circuit board 14. As shown in FIG. Electronic chip 10 is illustratively connected to heat spreader 18 and heat sink 20 by one or more first thermal interface materials (TIM) 1, the first TIM 22A connects the heat sink 20 and the heat spreader 18 and the second TIM 22B connects the heat spreader 18 and the silicon die 10 of the electronic chip 10. [ (12). One or both of the thermal interface materials 22A, 22B may be a thermal interface material described below.

TIM(22A)은 TIM(2)으로 지정되고, TIM(22A)의 제1 표면이 열 확산기(18)의 표면과 접촉하고 TIM(22A)의 제2 표면은 열 싱크(20)의 표면과 접촉하도록 열 확산기(18)와 열 싱크(20) 사이에 위치한다. The TIM 22A is designated as the TIM 2 and the first surface of the TIM 22A contacts the surface of the heat spreader 18 and the second surface of the TIM 22A contacts the surface of the heat sink 20 And between the heat spreader 18 and the heat sink.

TIM(22B)은 TIM(1)으로 지정되고, TIM(22B)의 제1 표면이 실리콘 다이(12)의 표면과 같은 전자 칩(34)의 표면과 접촉하고 TIM(22B)의 제2 표면은 열 확산기(18)의 표면과 접촉하도록 전자 칩(10)과 열 확산기(18) 사이에 위치한다.The TIM 22B is designated as the TIM 1 and the first surface of the TIM 22B contacts the surface of the electronic chip 34 such as the surface of the silicon die 12 and the second surface of the TIM 22B Is positioned between the electronic chip (10) and the heat spreader (18) to contact the surface of the heat spreader (18).

일부 구현으로(도시되지 않음), TIM(22)은 TIM(1.5)으로 지정되고, TIM(22)의 제1 표면이 실리콘 다이(12)의 표면과 같은 전자 칩(10)의 표면과 접촉하고 TIM(2)의 제2 표면은 열 싱크(22)의 표면과 접촉하도록 전자 칩(10)과 열 싱크(20) 사이에 위치한다.In some implementations (not shown), the TIM 22 is designated as TIM 1.5 and the first surface of the TIM 22 contacts the surface of the electronic chip 10, such as the surface of the silicon die 12 The second surface of the TIM 2 is positioned between the electronic chip 10 and the heat sink 20 to contact the surface of the heat sink 22.

열 계면 물질은 열 그리스(thermal grease), 그리스-유사(grease-like) 물질, 엘라스토머 테이프 및 상 변화 물질을 포함한다. 전통적인 열 계면 물질에는 갭 패드 및 열 패드와 같은 부품이 포함된다. 예시적인 열 계면 물질은 CN 103254647, CN 103254647, JP 0543116, U.S. 6,238,596, U.S. 6,451,422, U.S. 6,500,891, U.S. 6,605,238, U.S. 6,673,434, U.S. 6,706,219, U.S. 6,797,382, U.S. 6,811,725, U.S. 6,874,573, U.S. 7,172,711, U.S. 7,147,367, U.S. 7,244,491, U.S. 7,867,609, U.S. 8,324,313, U.S. 8,586,650, U.S. 2005/0072334, U.S. 2007/0051773, U.S. 2007/0179232, U.S. 2008/0044670, U.S. 2009/0111925, U.S. 2010/0048438, U.S. 2010/0129648, U.S. 2011/0308782, US 2013/0248163, WO 2008/121491, 및 PCT/CN2014/093138에 개시되어 있다.Thermal interface materials include thermal grease, grease-like materials, elastomeric tapes and phase change materials. Conventional thermal interface materials include components such as gap pads and thermal pads. Exemplary thermal interface materials include CN 103254647, CN 103254647, JP 0543116, U.S. Pat. 6,238,596, U.S. Pat. 6,451,422, U.S. Pat. 6,500,891, U.S. Pat. 6,605,238, U.S. Pat. 6,673,434, U.S. Pat. No. 6,706,219, U.S. Pat. 6,797,382, U.S. Pat. 6,811,725, U.S. Pat. 6,874,573, U.S. Pat. No. 7,172,711, U.S. Pat. 7,147,367, U.S. Pat. No. 7,244,491, U.S. Pat. 7,867,609, U.S. Pat. 8,324,313, U.S. Pat. 8,586,650, U.S. Pat. 2005/0072334, U.S. Pat. 2007/0051773, U.S.A. 2007/0179232, U.S.A. 2008/0044670, U.S.A. 2009/0111925, U.S.A. 2010/0048438, U.S.A. 2010/0129648, U.S.A. 2011/0308782, US 2013/0248163, WO 2008/121491, and PCT / CN2014 / 093138.

열 그리스 및 상 변화 물질은, 매우 얇은 층에서 확산되고 인접한 표면들 사이에 밀착 접촉을 제공하는 능력 때문에 다른 유형의 열 계면 물질보다 낮은 열 저항을 갖는다. 그러나, 일부 상황에서, 전자 칩(10) 및 열 싱크(20) 및/또는 열 확산기(18)는 도 2에 도시된 바와 같이 수직 배향으로 배치된다. 이러한 수직 배향에서, 에어 갭(24)은 TIM이 보다 낮은 하단에 지지되지 않도록 TIM(22A) 및/또는 TIM(22B) 바로 아래에 위치한다. 보다 높은 온도에서, TIM(22A, 22B)과 같은 열 계면 물질은 에어 갭(24)을 통해 그리고 전자 부품의 다른 부분 상으로 계면으로부터 떨어질 수 있다.Thermal grease and phase change materials have a lower thermal resistance than other types of thermal interface materials because of their ability to diffuse in very thin layers and to provide close contact between adjacent surfaces. However, in some situations, the electronic chip 10 and the heat sink 20 and / or the heat spreader 18 are arranged in a vertical orientation as shown in Fig. In this vertical orientation, the air gap 24 is positioned directly below the TIM 22A and / or the TIM 22B such that the TIM is not supported at the lower lower end. At higher temperatures, thermal interface materials, such as TIMs 22A and 22B, may fall from the interface through the air gap 24 and onto other portions of the electronic component.

상술한 바와 같은 개선이 요구된다.An improvement as described above is required.

본 발명은 예를 들어, 컴퓨터 칩과 같은 열을 발생시키는 전자 장치로부터 열 확산기 및 열 싱크와 같은 열 방산 구조물(heat dissipating structures)로 열을 전달하는 데 유용한 열 계면 물질을 제공한다. 열 계면 물질은 예시적으로 적어도 하나의 상 변화 물질, 적어도 하나의 폴리머 매트릭스 물질, 하나 이상의 열 전도성 충전제 및 적어도 하나의 가교제를 포함하며, 열 전도성 충전제는 열 계면 물질의 총 중량의 적어도 80중량%로 포함되며, 그리고 열 전도성 충전제는 1 미크론 미만의 입자 직경을 갖는 제1 복수의 입자를 포함한다. 보다 구체적인 구현으로, 열 전도성 충전제는 열 계면 물질의 총 중량의 적어도 90중량%, 91중량%, 92중량%, 93중량 % 또는 95중량%로 포함된다.The present invention provides a thermal interface material useful for transferring heat from an electronic device generating heat, such as, for example, a computer chip, to heat dissipating structures such as heat spreaders and heat sinks. The thermal interface material will illustratively include at least one phase change material, at least one polymer matrix material, at least one thermally conductive filler, and at least one crosslinker, wherein the thermally conductive filler comprises at least 80 wt% And the thermally conductive filler comprises a first plurality of particles having a particle diameter of less than 1 micron. In a more specific embodiment, the thermally conductive filler comprises at least 90 wt%, 91 wt%, 92 wt%, 93 wt%, or 95 wt% of the total weight of the thermal interface material.

상기 구현 중 어느 하나 이상의 특정 구현에서, 열 계면 물질은 1 중량% 내지 16중량%의 적어도 하나의 폴리머 매트릭스 물질; 0.5중량% 내지 8중량%의 적어도 하나의 상 변화 물질; 및 0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제를 포함한다. 보다 특정한 구현에서, 열 계면 물질은 1중량% 내지 8중량%의 적어도 하나의 폴리머 매트릭스 물질; 0.5중량% 내지 5중량%의 적어도 하나의 상 변화 물질; 및 0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제를 포함한다.In certain embodiments of any of the above implementations, the thermal interface material comprises 1 wt% to 16 wt% of at least one polymer matrix material; From 0.5% to 8% by weight of at least one phase change material; And 0.1% to 1% by weight of at least one amine or amine based cross-linking agent. In a more particular embodiment, the thermal interface material comprises 1 wt% to 8 wt% of at least one polymer matrix material; From 0.5% to 5% by weight of at least one phase change material; And 0.1% to 1% by weight of at least one amine or amine based cross-linking agent.

상기 구현 중 어느 하나 이상의 특정 구현에서, 제1 복수의 입자는 산화 아연의 입자를 포함한다. 보다 특정한 구현에서, 산화 아연의 입자는 0.1미크론 내지 약 1미크론의 직경을 갖는다. 또 다른 더욱 특정한 구현에서, 산화 아연의 입자는 0.9미크론 이하의 직경을 갖는다.In certain embodiments of any of the above implementations, the first plurality of particles comprises particles of zinc oxide. In a more particular embodiment, the particles of zinc oxide have a diameter of from 0.1 micron to about 1 micron. In yet another more particular embodiment, the particles of zinc oxide have a diameter of 0.9 microns or less.

상기 구현 중 어느 하나 이상의 특정 구현에서, 열 전도성 충전제는 1미크론보다 큰 입자 직경을 갖는 제2 복수의 입자를 추가로 포함한다. 보다 더 특정한 구현에서, 제2 복수의 입자는 알루미늄의 입자를 포함한다. 보다 더 특정한 구현에서, 제2 복수의 입자는 약 3미크론 내지 약 15미크론의 직경을 갖는 알루미늄의 입자를 포함한다. 보다 더 특정한 구현에서, 제2 복수의 입자는 약 3미크론의 직경을 갖는 알루미늄 입자의 제1 부분 및 약 10미크론의 직경을 갖는 알루미늄 입자의 제2 부분을 포함한다.In certain embodiments of any of the above implementations, the thermally conductive filler further comprises a second plurality of particles having a particle diameter greater than 1 micron. In a more specific embodiment, the second plurality of particles comprises particles of aluminum. In a more particular embodiment, the second plurality of particles comprises particles of aluminum having a diameter of from about 3 microns to about 15 microns. In a more particular embodiment, the second plurality of particles comprises a first portion of aluminum particles having a diameter of about 3 microns and a second portion of aluminum particles having a diameter of about 10 microns.

상기 구현 중 어느 하나 이상의 특정 구현에서, 가교제는 아민 또는 아민계 가교제이다.In certain embodiments of any of the above implementations, the crosslinking agent is an amine or an amine based crosslinking agent.

상기 구현 중 어느 하나 이상의 특정 구현에서, 열 전도성 충전제는 열 계면 물질의 총 중량의 91중량% 내지 95중량%로 포함된다. 보다 더 특정한 구현에서, 열 전도성 충전제는 열 계면 물질의 총 중량의 92중량% 내지 94중량%로 포함된다.In certain embodiments of any of the above implementations, the thermally conductive filler comprises from 91% to 95% by weight of the total weight of the thermal interface material. In a more particular embodiment, the thermally conductive filler comprises from 92% to 94% by weight of the total weight of the thermal interface material.

상기 구현 중 어느 하나 이상의 특정 구현에서, 열 계면 물질은 티타네이트 커플링제와 같은 적어도 하나의 커플링제를 추가로 포함한다. 상기 구현 중 또 다른 어느 특정 구현에서, 열 계면 물질은 적어도 하나의 산화 방지제를 추가로 포함한다. 상기 구현 중 또 다른 어느 특정 구현에서, 열 계면 물질은 적어도 하나의 이온 스캐빈저(scavenger)를 추가로 포함한다. 상기 구현 중 또 다른 어느 특정 구현에서, 열 계면 물질은 적어도 하나의 틱소트로픽제(thixotropic agent)를 더 포함한다.In certain embodiments of any of the above implementations, the thermal interface material further comprises at least one coupling agent, such as a titanate coupling agent. In yet another particular embodiment of the above implementation, the thermal interface material further comprises at least one antioxidant. In yet another particular implementation of the above implementation, the thermal interface material further comprises at least one ion scavenger. In yet another particular implementation of the above implementation, the thermal interface material further comprises at least one thixotropic agent.

또 다른 구현에서, 열 계면 물질을 형성하기 위한 제형(formulation)이 제공된다. 상기 제형은 용매, 적어도 하나의 상 변화 물질, 적어도 하나의 폴리머 매트릭스 물질, 하나 이상의 열 전도성 충전제 및 적어도 하나의 가교제를 포함하며, 열 전도성 충전제는 열 계면 물질의 건조 중량(용매가 없는 중량)의 적어도 80중량%로 포함되며, 열 전도성 충전제는 1미크론 미만의 입자 직경을 갖는 제1 복수의 입자를 포함한다.In another embodiment, a formulation for forming a thermal interface material is provided. The formulation includes a solvent, at least one phase change material, at least one polymer matrix material, at least one thermally conductive filler, and at least one cross-linker, wherein the thermally conductive filler has a dry weight of the thermal interface material At least 80% by weight, and the thermally conductive filler comprises a first plurality of particles having a particle diameter of less than 1 micron.

또 다른 구현으로, 전자 부품이 제공된다. 전자 부품은 열 싱크, 전자 칩, 및 열 싱크와 전자 칩 사이에 배치된 열 계면 물질을 포함하고, 열 계면 물질은 적어도 하나의 상 변화 물질, 적어도 하나의 폴리머 매트릭스 물질, 하나 이상의 열 전도성 충전제 및 하나 이상의 가교제를 포함하며, 여기서 열 전도성 충전제는 열 계면 물질의 총 중량의 적어도 91중량%로 포함되며, 열 전도성 충전제는 1미크론 미만의 입자 직경을 갖는 제1 복수의 입자를 포함한다. 전자 칩 및 열 싱크는 수직 배향으로 위치되고, 열 계면 물질은 수직 배향된 전자 칩과 열 싱크 사이의 수직 배향으로 위치한다.In yet another embodiment, an electronic component is provided. The electronic component includes a heat sink, an electronic chip, and a thermal interface material disposed between the heat sink and the electronic chip, wherein the thermal interface material comprises at least one phase change material, at least one polymer matrix material, Wherein the thermally conductive filler comprises at least 91 weight percent of the total weight of the thermal interface material and the thermally conductive filler comprises a first plurality of particles having a particle diameter less than 1 micron. The electronic chip and the heat sink are positioned in a vertical orientation, and the thermal interface material is positioned in a vertical orientation between the vertically oriented electronic chip and the heat sink.

보다 특정한 구현으로, 열 계면 물질의 제1 표면은 전자 칩의 표면과 접촉하고, 열 계면 물질의 제2 표면은 열 싱크와 접촉한다. 또 다른 보다 특정한 구현으로, 전자 부품은 열 싱크와 전자 칩 사이에 배치된 열 확산기를 포함하며, 여기서 열 계면 물질의 제1 표면은 전자 칩의 표면과 접촉하고, 열 계면 물질의 제2 표면은 열 확산기와 접촉한다. 또 다른 보다 특정한 구현에서, 전자 부품은 열 싱크와 전자 칩 사이에 배치된 열 확산기를 포함하며, 여기서 열 계면 물질의 제1 표면은 열 확산기의 표면과 접촉하고, 열 계면 물질의 제2 표면은 열 싱크와 접촉한다.In a more particular embodiment, the first surface of the thermal interface material contacts the surface of the electronic chip, and the second surface of the thermal interface material contacts the heat sink. In another more specific implementation, the electronic component includes a heat spreader disposed between the heat sink and the electronic chip, wherein the first surface of the thermal interface material contacts the surface of the electronic chip, and the second surface of the thermal interface material And contacts the heat spreader. In another more specific implementation, the electronic component includes a heat spreader disposed between the heat sink and the electronic chip, wherein the first surface of the thermal interface material contacts the surface of the heat spreader and the second surface of the thermal interface material Contact the heat sink.

본 발명의 상기 언급된 특징 및 다른 특징 및 이점, 및 이를 달성하는 방법은 첨부된 도면을 함께 취하여 하기의 본 발명의 구현의 설명을 참조하면 보다 명백해질 것이며 더 잘 이해될 것이다.
도 1은 전자 칩, 열 확산기, 열 싱크 및 제1 및 제2 열 계면 물질을 개략적으로 나타낸 것이다.
도 2는 수직 배향으로 도 1의 전자 칩, 열 확산기, 열 싱크 및 제1 및 제2 열 계면 물질을 개략적으로 나타낸 것이다.
대응하는 레퍼런스 부호는 여러 도면에 걸쳐 대응하는 부분을 나타낸다. 여기에 설명된 예시들은 본 발명의 예시적인 구현들을 나타내고, 그러한 예시들은 어느 방식으로 본 발명의 범위를 제한하는 것으로 해석되어서는 안된다.BRIEF DESCRIPTION OF THE DRAWINGS The above-mentioned and other features and advantages of the present invention and the manner of achieving it will become more apparent and may be better understood by referring to the following description of an embodiment of the invention taken in conjunction with the accompanying drawings.
1 schematically illustrates an electronic chip, a heat spreader, a heat sink, and first and second thermal interface materials.
Figure 2 schematically illustrates the electronic chip, heat spreader, heat sink, and first and second thermal interface materials of Figure 1 in a vertical orientation.
Corresponding reference characters denote corresponding parts throughout the several views. The examples set forth herein illustrate exemplary implementations of the invention, and such examples are not to be construed as limiting the scope of the invention in any way.

본 발명은 전자 부품으로부터 열을 전달하는 데 유용한 열 계면 물질에 관한 것이다.The present invention relates to thermal interface materials useful for transferring heat from electronic components.

A. 열 계면 물질A. Thermal interface materials

예시적인 일 구현으로, TIM(22)은 열 계면 물질이다. 일부 예시적인 구현으로, TIM(22)은 하나 이상의 상 변화 물질, 하나 이상의 폴리머 매트릭스 물질, 하나 이상의 열 전도성 충전제, 하나 이상의 가교제, 및 선택적으로 하나 이상의 첨가제를 포함한다.In one exemplary implementation, TIM 22 is a thermal interface material. In some exemplary implementations, TIM 22 includes one or more phase change materials, one or more polymer matrix materials, one or more thermally conductive fillers, one or more cross-linking agents, and optionally one or more additives.

a. 열 전도성 충전제a. Thermally conductive filler

일부 예시적인 구현으로, TIM(22)은 적어도 하나의 열 전도성 충전제를 포함한다.In some exemplary implementations, the TIM 22 includes at least one thermally conductive filler.

예시적인 열 전도성 충전제는 금속, 합금, 비금속, 금속 산화물, 금속 질화물 및 세라믹 및 이들의 조합을 포함한다. 예시적인 금속은 이에 한정되는 것은 아니나, 알루미늄, 구리, 은, 아연, 니켈, 주석, 인듐, 납, 은 코팅된 구리 또는 은 코팅된 알루미늄과 같은 은 코팅된 금속, 금속 코팅된 탄소 섬유 및 니켈 코팅된 섬유를 포함한다. 예시적인 비금속은 이에 한정되는 것은 아니나, 탄소, 카본 블랙, 흑연, 탄소 나노 튜브, 탄소 섬유, 그래핀, 분말 다이아몬드, 유리, 실리카, 질화규소 및 붕소 코팅된 입자를 포함한다. 예시적인 금속 산화물, 금속 질화물 및 세라믹은 이에 한정되는 것은 아니나, 알루미나, 질화 알루미늄, 질화 붕소, 산화 아연 및 산화 주석을 포함한다.Exemplary thermally conductive fillers include metals, alloys, non-metals, metal oxides, metal nitrides and ceramics, and combinations thereof. Exemplary metals include, but are not limited to, silver coated metals such as aluminum, copper, silver, zinc, nickel, tin, indium, lead, silver coated copper or silver coated aluminum, metal coated carbon fibers, ≪ / RTI > Exemplary base metals include, but are not limited to, carbon, carbon black, graphite, carbon nanotubes, carbon fibers, graphene, powdered diamonds, glass, silica, silicon nitride and boron coated particles. Exemplary metal oxides, metal nitrides and ceramics include, but are not limited to, alumina, aluminum nitride, boron nitride, zinc oxide, and tin oxide.

TIM(22)은 TIM(22)의 총 중량을 기준으로, 80중량%, 85중량%, 90중량%, 91중량%, 91.5중량%, 92중량%, 92.5중량%, 93중량% 정도로 작게, 93.5중량%, 94중량%, 95중량%, 96중량%, 97중량%, 98중량%, 99중량% 정도로 크게, 또는 80중량% 내지 99중량%, 91중량% 내지 99중량%, 91중량% 내지 95중량%, 또는 92중량% 내지 94중량%와 같이, 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 총량으로 하나 이상의 열 전도성 충전제를 포함할 수 있다.The TIM 22 may be as small as 80 wt%, 85 wt%, 90 wt%, 91 wt%, 91.5 wt%, 92 wt%, 92.5 wt%, 93 wt%, based on the total weight of the TIM 22, Or greater than or equal to about 93.5, 94, 95, 96, 97, 98, 99, or even 80, To 95% by weight, or from 92% by weight to 94% by weight, based on the total amount of the thermally conductive filler.

열 전도성 충전제는 입자로서 제공될 수 있다. 평균 입자 직경(D50)은 일반적으로 입자 크기를 측정하는 데 사용된다. 예시적인 입자는 10㎚, 20㎚, 50㎚, 0.1미크론, 0.2미크론, 0.5미크론, 1미크론, 2미크론, 3미크론 정도로 작은, 5미크론, 8미크론, 10미크론, 12미크론, 15미크론, 20 크론, 25미크론, 50미크론, 100미크론 정도로 큰, 또는 10nm 내지 100미크론, 0.1미크론 내지 20미크론, 또는 0.5미크론 내지 12미크론과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 평균 입자 직경을 갖는다.The thermally conductive filler may be provided as a particle. The average particle diameter (D50) is generally used to measure the particle size. Exemplary particles include, but are not limited to, 10 nm, 20 nm, 50 nm, 0.1 micron, 0.2 micron, 0.5 micron, 1 micron, 2 micron, 3 micron, 5 micron, 8 micron, 10 micron, 12 micron, 15 micron, , 25 microns, 50 microns, 100 microns, or an average particle diameter within any range defined between any two of these values, such as 10 nm to 100 microns, 0.1 microns to 20 microns, or 0.5 microns to 12 microns.

일 구현으로, 제1 열 전도성 충전제는 1미크론, 0.9미크론, 0.8미크론, 0.6미크론, 0.5미크론, 0.2미크론, 0.1미크론 또는 그 이하 정도로 작은, 또는 1미크론 내지 0.1미크론, 1미크론 내지 0.2미크론, 또는 1미크론 내지 0.8미크론과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 입자 직경을 갖는다. 보다 특정한 구현으로, 제1 열 전도성 충전제는 1미크론 이하의 직경을 갖는 복수의 산화 아연 입자를 포함한다.In one embodiment, the first thermally conductive filler is one micron, 0.9 micron, 0.8 micron, 0.6 micron, 0.5 micron, 0.2 micron, 0.1 micron or smaller, or 1 micron to 0.1 micron, 1 micron to 0.2 micron, or And has a particle diameter within a range defined between any two of these values, such as from 1 micron to 0.8 microns. In a more particular embodiment, the first thermally conductive filler comprises a plurality of zinc oxide particles having a diameter of 1 micron or less.

일 구현으로, 제1 열 전도성 충전제와 함께 제공되는 제2 열 전도성 충전제는 1미크론, 2미크론, 3미크론, 4미크론 정도로 작은, 6미크론, 8미크론, 10미크론, 또는 12미크론 정도로 큰, 또는 1미크론 내지 12미크론, 3미크론 내지 10미크론, 2미크론 내지 4미크론, 또는 8미크론 내지 12미크론과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 입자 직경을 갖는다. 보다 특정한 구현으로, 제2 열 전도성 충전제는 2미크론, 3미크론, 4미크론 정도로 작은, 6미크론, 8미크론, 10미크론 또는 12미크론 정도로 큰 직경을 갖는 입자, 또는 이의 혼합물을 포함하는, 1미크론 보다 큰 입자 크기의 혼합물을 갖는 입자들을 포함하여 구성된다. 보다 특정한 구현으로, 제1 열 전도성 충전제는 1미크론보다 큰 직경을 갖는 복수의 알루미늄 입자를 포함한다.In one embodiment, the second thermally conductive filler provided with the first thermally conductive filler is one micron, two microns, three microns, as small as four microns, six microns, eight microns, ten microns, or as large as 12 microns, Has a particle diameter within any range defined between any two of the above values, such as from 1 micron to 12 microns, from 3 microns to 10 microns, from 2 microns to 4 microns, or from 8 microns to 12 microns. In a more particular embodiment, the second thermally conductive filler may be less than 1 micron, including less than 2 microns, 3 microns, 4 microns, particles having a diameter as large as 6 microns, 8 microns, 10 microns, or 12 microns, And comprises particles having a mixture of large particle sizes. In a more particular embodiment, the first thermally conductive filler comprises a plurality of aluminum particles having a diameter greater than 1 micron.

보다 특정한 구현으로, 제2 열 전도성 충전제는 1미크론 보다 큰 직경을 갖는 복수의 입자를 포함하고, 제1 열 전도성 충전제는 1미크론 이하의 직경을 갖는 복수의 입자를 포함하고, 그리고 제1 열 전도성 충전제에 대한 제2 열 전도성 충전제의 중량비는 0.5:1, 1:1, 1.25:1, 1.5:1, 2:1, 2.5:1 정도로 작거나, 2.75:1, 3:1, 5:1, 10:1, 20:1 정도로 크거나, 또는 0.5:1 내지 20:1, 1:1 내지 10:1, 1.25:1 내지 5:1, 또는 2.5:1 내지 3:1과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내이다.In a more specific embodiment, the second thermally conductive filler comprises a plurality of particles having a diameter greater than 1 micron, the first thermally conductive filler comprises a plurality of particles having a diameter of 1 micron or less, and the first thermal conductivity The weight ratio of the second thermally conductive filler to the filler is as low as about 0.5: 1, 1: 1, 1.25: 1, 1.5: 1, 2: 1, 2.5: 10: 1, 20: 1, or any of the above values such as 0.5: 1 to 20: 1, 1: 1 to 10: 1, 1.25: 1 to 5: It is within a range defined between the two.

보다 특정한 구현으로, 열 전도성 충전제는 1미크론, 2미크론, 3미크론 정도로 작은, 5미크론, 8미크론, 10미크론, 12미크론, 15미크론 정도로 큰, 또는 1미크론 내지 15미크론 또는 2미크론 내지 12미크론, 또는 3미크론 내지 10미크론과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 입자 직경을 갖는 복수의 알루미늄 입자를 포함한다.In a more particular embodiment, the thermally conductive filler may be one micron, 2 microns, 3 microns tiny, 5 microns, 8 microns, 10 microns, 12 microns, 15 microns, or 1 micron to 15 microns, or 2 microns to 12 microns, Or a plurality of aluminum particles having a particle diameter within any range defined between any two of these values, such as from 3 microns to 10 microns.

b. 폴리머 매트릭스 물질b. Polymer matrix material

일부 예시적인 구현으로, TIM(22)은 폴리머 매트릭스 물질을 포함한다. 일부 예시적인 구현으로, 폴리머 매트릭스 물질은 열 전도성 충전제를 편입시키기 위한 매트릭스를 제공하고, 열 및 압력 하에서 가압될 경우에 유동성을 제공한다.In some exemplary implementations, TIM 22 includes a polymer matrix material. In some exemplary embodiments, the polymer matrix material provides a matrix for incorporating a thermally conductive filler and provides fluidity when pressed under heat and pressure.

일 예시적인 구현으로, 폴리머 매트릭스 물질은 탄화수소 고무 화합물 또는 고무 화합물의 블렌드를 포함한다. 예시적인 물질은 포화 및 불포화 고무 화합물을 포함한다. 일부 구현으로, 포화 고무는 불포화 고무 화합물보다 열 산화 분해에 덜 민감할 수 있다. 예시적인 포화 고무 화합물은 에틸렌-프로필렌 고무(EPR, EPDM), 폴리에틸렌/부틸렌, 폴리에틸렌-부틸렌-스티렌, 폴리에틸렌-프로필렌-스티렌, 하이드로게네이티드 폴리알킬디엔 "모노-올(mono-ols)"(하이드로게네이티드 폴리부타디엔 모노-올, 하이드로게네이티드 폴리프로파디엔(polypropadiene) 모노-올, 하이드로게네이티드 폴리펜타디엔 모노-올과 같은), 하이드로게네이티드 폴리알킬디엔 "디올(diols)"(하이드로게네이티드 폴리부타디엔 디올, 하이드로게네이티드 폴리프로파디엔 디올, 하이드로게네이티드 폴리펜타디엔 디올과 같은) 및 하이드로게네이티드 폴리이소프렌, 폴리올레핀 엘라스토머 또는 임의의 다른 적합한 포화 고무, 또는 이들의 블렌드를 포함한다. 일 구현으로, 폴리머 매트릭스 물질은 히드록실-말단 에틸렌 부틸렌 코폴리머, 특수 모노-올로도 지칭될 수 하이드로게네이티드 폴리부타디엔 모노-올이다.In one exemplary implementation, the polymer matrix material comprises a blend of a hydrocarbon rubber compound or a rubber compound. Exemplary materials include saturated and unsaturated rubber compounds. In some implementations, the saturated rubber may be less sensitive to thermal oxidative degradation than the unsaturated rubber compound. Exemplary saturated rubber compounds include ethylene-propylene rubber (EPR, EPDM), polyethylene / butylene, polyethylene-butylene-styrene, polyethylene- (Such as hydrogenated polybutadiene mono-ols, hydro- genated polypropadiene mono-ols, hydrogenated polypentadien mono-ols), hydrogenated polyalkyldiene "diols" Hydrogenated polybutadiene diols, hydrogenated polypropadiene diols, hydrogenated polypentadiene diols), and hydrogenated polyisoprene, polyolefin elastomers or any other suitable saturated rubber, or blends thereof . In one embodiment, the polymer matrix material is a hydroxyl-terminated ethylene butylene copolymer, a hydrogenated polybutadiene monool which may also be referred to as a special mono-ol.

일 예시적인 구현으로, 폴리머 매트릭스 물질은 실리콘 고무, 실록산 고무, 실록산 코폴리머 또는 어느 다른 적합한 실리콘-함유 고무를 포함한다.In one exemplary implementation, the polymer matrix material comprises a silicone rubber, a siloxane rubber, a siloxane copolymer, or any other suitable silicone-containing rubber.

일부 예시적인 구현으로, TIM(22)은 TIM(22)의 총량을 기준으로, 0.5중량%, 1중량%, 2중량%, 3중량%, 4중량% 정도로 적게, 5중량%, 6중량%, 7중량%, 8중량%, 10중량%, 12중량%, 16중량% 정도로 크게, 또는 1중량% 내지 16중량%, 1중량% 내지 8중량% 또는 4중량% 내지 6중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 폴리머 매트릭스 물질을 포함할 수 있다.In some exemplary implementations, the TIM 22 may comprise less than 0.5 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt% , 7% by weight, 8% by weight, 10% by weight, 12% by weight, 16% by weight or 1% by weight to 16% by weight, 1% by weight to 8% by weight or 4% by weight to 6% Lt; RTI ID = 0.0 > a < / RTI > amount within any range defined between any two of the values.

c. 상 변화 물질c. Phase change material

일부 예시적인 구현으로, TIM(22)은 하나 이상의 상 변화 물질을 포함한다. 상 변화 물질은 TIM(22)이 사용될 전자 장치의 일부의 작동 온도에서 또는 그 이하의 온도에서, 융점 또는 융점 범위를 갖는 물질이다. 예시적인 상 변화 물질은 파라핀 왁스와 같은 왁스이다. 파라핀 왁스는 일반식 CnH2n+2를 가지며 약 20℃ 내지 100℃ 범위의 융점을 갖는 고체 탄화수소의 혼합물이다. 폴리머 왁스는 폴리에틸렌 왁스 및 폴리프로필렌 왁스를 포함하며, 전형적으로 약 40℃ 내지 160℃의 융점 범위를 갖는다. 다른 예시적인 상 변화 물질은 우드 메탈(Wood's metal), 필드 메탈(Field's metal), 또는 융점이 약 20℃ 내지 90℃ 사이인 금속 또는 합금과 같은 저 융점 합금을 포함한다.In some exemplary implementations, TIM 22 includes one or more phase change materials. The phase change material is a material having a melting or melting range at or below the operating temperature of the portion of the electronic device in which the TIM 22 is to be used. Exemplary phase change materials are waxes such as paraffin wax. Paraffin wax is a mixture of solid hydrocarbons having the general formula C n H 2n + 2 and having a melting point in the range of about 20 캜 to 100 캜. Polymer waxes include polyethylene waxes and polypropylene waxes, and typically have a melting point range of about 40 占 폚 to 160 占 폚. Other exemplary phase change materials include Wood's metal, Field's metal, or a low melting point alloy such as a metal or alloy having a melting point between about 20 < 0 > C and 90 < 0 > C.

일부 구현으로, 상 변화 물질의 양은 TIM(22)의 경도를 조절하는 데 사용될 수 있다. 예를 들어, 상 변화 물질의 로딩이 낮은 일부 구현에서, 조성물은 연질 겔의 형태일 수 있으며, 그리고 상 변화 물질의 로딩이 높은 일부 구현에서, 조성물은 경질 고체일 수 있다. TIM(22)은 TIM(22)의 총 중량을 기준으로, 0.1중량%, 0.2중량%, 0.5중량%, 1중량%, 2중량% 정도로 적은 양으로, 3중량%, 3.5중량%, 4중량%, 5중량%, 7중량%, 8중량%, 10중량%, 12중량% 정도로 많은 양으로, 또는 0.1 중량% 내지 10중량%, 0.5중량% 내지 8중량% 또는 0.5중량% 내지 5중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 상 변화 물질을 포함할 수 있다.In some implementations, the amount of phase change material may be used to control the hardness of TIM 22. For example, in some implementations where the loading of the phase change material is low, the composition may be in the form of a soft gel, and in some implementations where the loading of the phase change material is high, the composition may be a hard solid. The TIM 22 may be present in an amount of less than 0.1 wt%, 0.2 wt%, 0.5 wt%, 1 wt%, 2 wt%, based on the total weight of the TIM 22, 3 wt%, 3.5 wt%, 4 wt% %, 5 wt%, 7 wt%, 8 wt%, 10 wt%, 12 wt% or 0.1 wt% to 10 wt%, 0.5 wt% to 8 wt% or 0.5 wt% to 5 wt% And may include one or more phase change materials in an amount within any range defined between any two of the above values.

d. 커플링제d. Coupling agent

일부 예시적인 구현으로, TIM(22)은 하나 이상의 커플링제를 포함한다. 일부 예시적인 구현에서, 커플링제의 포함은 폴리머 매트릭스와 열 전도성 충전제 사이에 계면을 제공함으로써 비교적 고온에서의 특성과 같은 열적 특성을 개선시킬 수 있다. 예시적인 커플링제는 미국 특허출원공개 제2011/0308782호에 개시된 것과 같은 티타네이트 커플링제를 포함하며, 이의 개시 내용은 그 전체가 본 명세서에 참고문헌으로 편입된다. 예시적인 커플링제는 다음을 포함한다:In some exemplary implementations, TIM 22 includes one or more coupling agents. In some exemplary embodiments, the inclusion of a coupling agent may improve thermal properties, such as properties at relatively high temperatures, by providing an interface between the polymer matrix and the thermally conductive filler. Exemplary coupling agents include titanate coupling agents such as those disclosed in U.S. Patent Application Publication No. 2011/0308782, the disclosure of which is incorporated herein by reference in its entirety. Exemplary coupling agents include:

티타늄 IV 2,2(비스 2-프로페놀라토메틸)부탄올라토, 트리스(디옥틸)피로포스파토-O(titanium IV 2,2 (bis 2-propenolatomethyl)butanolato, tris(dioctyl)pyrophosphato-O);Titanium IV 2,2 (bis 2-propenolatomethyl) butanolate, titanium IV 2,2 (bis 2-propenolatomethyl) butanolato, tris (dioctyl) pyrophosphato-O);

Figure pct00001
Figure pct00001

지르코늄 IV 2,2(비스 2-프로페놀라토메틸)부탄올라토, 트리스(디이소옥틸)피로포스파토-O(zirconium IV 2,2 (bis 2-propenolatomethyl)butanolato, tris(diisooctyl)pyrophosphato-O):Zirconium IV 2,2 (bis 2-propenolatomethyl) butanolato, tris (diisooctyl) pyrophosphato-O (zirconium IV 2,2 bis 2- propenolatomethyl butanolato, :

Figure pct00002
Figure pct00002

1몰의 디이소옥틸 포스파이트와의 티타늄 IV 2-프로파놀라토, 트리스(디옥틸)-피로포스파토-O) 부가물(titanium IV 2-propanolato, tris(dioctyl)-pyrophosphato-O) adduct with 1 mole of diisooctyl phosphite):Titanium IV 2-propanolate, tris (dioctyl) -pyrophosphato-O) adduct with 1 mol of diisooctylphosphite adduct (titanium IV 2-propanolato, tris with 1 mole of diisooctyl phosphite):

Figure pct00003
Figure pct00003

티타늄 IV 비스(디옥틸)피로포스파토-O, 옥소에틸렌디올라토, (부가물), 비스(디옥틸)(하이드로겐)포스파이트-O(titanium IV bis(dioctyl)pyrophosphato-O, oxoethylenediolato, (Adduct), bis(dioctyl) (hydrogen)phosphite-O):Titanium IV bis (dioctyl) pyrophosphato-O, oxoethylenediolato, (adduct), bis (dioctyl) pyrophosphato-O, Adduct), bis (dioctyl) (hydrogen) phosphite-O):

Figure pct00004
Figure pct00004

티타늄 IV 비스(디옥틸)피로포스파토-O, 에틸렌디올라토(부가물), 비스(디옥틸)하이드로겐 포스파이트(titanium IV bis(dioctyl)pyrophosphato-O, ethylenediolato (adduct), bis(dioctyl)hydrogen phosphite);Titanium IV bis (dioctyl) pyrophosphato-O, ethylenediolato (adduct), titanium IV bis (dioctyl) pyrophosphato-O, ethylenediolato (adduct), bis (dioctyl) hydrogen phosphite);

Figure pct00005
Figure pct00005

및 지르코늄 IV 2,2-비스(2-프로페놀라토메틸) 부타놀라토, 시클로 디[2,2-(비스 2-프로페놀라토메틸) 부타놀라토], 피로포스파토-O,O(zirconium IV 2,2-bis(2-propenolatomethyl) butanolato, cyclo di[2,2-(bis 2-propenolatomethyl) butanolato], pyrophosphato-O,O):And zirconium IV. In the case of zirconium IV, 2,2-bis (2-propenolatomethyl) butanolate, cyclodi [2,2- (bis 2-prophenolatomethyl) butanolate], zirconium IV 2,2-bis (2-propenolatomethyl) butanolato, cyclo [2,2- (bis 2-propenolatomethyl) butanolato], pyrophosphato-O,

Figure pct00006
Figure pct00006

일 예시적인 구현으로, 커플링제는 티타늄 IV 2,2(비스 2-프로페놀라토메틸) 부타놀라토, 트리스(디옥틸)피로포스파토-O(titanium IV 2, 2 (bis 2-propenolatomethyl) butanolato, tris(dioctyl)pyrophosphato-O)이다.In one exemplary embodiment, the coupling agent is selected from the group consisting of titanium IV 2,2 (bis 2-propenolatomethyl) butanolate, tris (dioctyl) pyrophosphato-O (titanium 2, , tris (dioctyl) pyrophosphato-O).

일부 예시적인 구현으로, TIM(22)은 TIM(22)의 총 중량을 기준으로, 0.1중량%, 0.2 중량%, 0.3중량%, 0.5중량% 정도로 적은 양으로, 1중량%, 2중량%, 3중량%, 5중량% 정도로 많은 양으로, 또는 0.1중량% 내지 5중량%, 0.2중량% 내지 2중량%, 또는 0.2중량% 내지 1중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 커플링제를 포함할 수 있다.In some exemplary implementations, the TIM 22 may comprise less than 0.1%, 0.2%, 0.3%, or 0.5% by weight, based on the total weight of the TIM 22, 3% by weight, 5% by weight in a large amount, or any range defined between any two of these values such as from 0.1% by weight to 5% by weight, from 0.2% by weight to 2% by weight, or from 0.2% Lt; RTI ID = 0.0 > of the < / RTI >

e. 가교제e. Cross-linking agent

일부 예시적인 구현으로, TIM(22)은 아민 또는 아민계 수지와 같은 하나 이상의 가교제를 포함한다. 가교제는 가교제 및 적어도 하나의 폴리머 매트릭스 물질 상의 1차 또는 말단 히드록실기 사이의 가교 반응을 촉진시키기 위해 열 계면 물질 조성물에 첨가되거나 편입된다. 예시적인 가교제는 미국 특허 제7,244,491호에 개시되어 있으며, 그 개시 내용은 그 전체가 본 명세서에 참고문헌으로 편입된다.In some exemplary implementations, TIM 22 includes one or more cross-linking agents, such as amine or amine based resins. The crosslinking agent is added to or incorporated into the thermal interface material composition to promote the crosslinking reaction between the crosslinking agent and the primary or terminal hydroxyl groups on the at least one polymer matrix material. Exemplary crosslinking agents are disclosed in U.S. Patent No. 7,244,491, the disclosure of which is incorporated herein by reference in its entirety.

일 예시적인 구현으로, 가교제는 수지 백본의 어느 부분에 적어도 하나의 아민 치환기를 포함하는 아민 또는 아민계 수지이다. 예시적인 아민 및 아민계 수지는 알킬화 멜라민 수지 및 우레아, 티오우레아, 멜라민 또는 알데히드, 특히 포름알데히드와 얼라이드 화합물(allied compounds)의 반응으로부터 유도된 합성 수지를 포함한다. 보다 특정한 구현에서, 가교제는 1차 아민 수지, 2차 아민 수지, 3차 아민 수지, 글리시딜 아민 에폭시 수지, 알콕시벤질 아민 수지, 에폭시 아민 수지, 멜라민 수지, 알킬화 멜라민 수지 및 멜라민-아크릴릭 수지로 구성되는 그룹으로부터 선택된 수지이다.In one exemplary embodiment, the cross-linking agent is an amine or amine-based resin comprising at least one amine substituent in any part of the resin backbone. Exemplary amine and amine based resins include alkylated melamine resins and synthetic resins derived from the reaction of urea, thiourea, melamine or aldehydes, especially formaldehyde, with allied compounds. In a more specific embodiment, the crosslinking agent is selected from the group consisting of a primary amine resin, a secondary amine resin, a tertiary amine resin, a glycidylamine epoxy resin, an alkoxybenzylamine resin, an epoxyamine resin, a melamine resin, an alkylated melamine resin and a melamine- Is a resin selected from the group consisting of.

일 예시적인 구현으로, 가교제는 멜라민 수지, 예컨대 알킬화 멜라민 수지 또는 보다 구체적으로 부틸화 멜라민 수지이다. 멜라민 수지는 고리계 화합물로 고리에는 3개의 탄소 원자와 3개의 질소 원자가 함유되어 있다. 멜라민 수지는 전형적으로 응축 반응을 통해 다른 화합물 및 분자와 쉽게 결합한다. 멜라민 수지는 전형적으로 다른 분자 및 화합물과 반응하여 사슬 성장 및 가교 결합을 촉진하고, 우레아 수지보다 내수성 및 내열성이 우수하고, 수용성 시럽 또는 물에 분산 가능한 불용성 분말로서 사용될 수 있고, 높은 융점(325℃ 초과)을 가지며, 비교적 비-가연성이다. 부틸화 멜라민 수지와 같은 알킬화 멜라민 수지는 수지 형성 동안 알킬 알코올을 편입함으로써 형성된다. 이들은 페인트 및 에나멜 용매 및 표면 코팅에 용해가능하다.In one exemplary embodiment, the cross-linking agent is a melamine resin, such as an alkylated melamine resin or more specifically a butylated melamine resin. The melamine resin is a cyclic compound containing three carbon atoms and three nitrogen atoms in the ring. Melamine resins typically bind easily to other compounds and molecules through condensation reactions. The melamine resin typically reacts with other molecules and compounds to promote chain growth and crosslinking, is superior to urea resin in water resistance and heat resistance, can be used as an insoluble powder that can be dispersed in water-soluble syrups or water, and has a high melting point And is relatively non-flammable. Alkylated melamine resins such as butylated melamine resins are formed by incorporating alkyl alcohols during resin formation. They are soluble in paint and enamel solvents and surface coatings.

일부 예시적인 구현으로, TIM(22)은 TIM(22)의 총 중량을 기준으로, 0.1중량%, 0.2중량%, 0.3중량%, 0.5중량% 정도로 적은 양으로, 1중량%, 2중량%, 3중량%, 5중량% 정도로 많은 양으로, 또는 0.1중량% 내지 5중량%, 0.2중량% 내지 2중량%, 또는 0.2중량% 내지 1중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 가교제를 포함할 수 있다.In some exemplary implementations, the TIM 22 may comprise less than 0.1%, 0.2%, 0.3%, or 0.5% by weight, based on the total weight of the TIM 22, 3% by weight, 5% by weight in a large amount, or any range defined between any two of these values such as from 0.1% by weight to 5% by weight, from 0.2% by weight to 2% by weight, or from 0.2% Lt; RTI ID = 0.0 > crosslinker < / RTI >

f. 첨가제f. additive

일부 예시적인 구현으로, TIM(22)은 하나 이상의 첨가제를 포함한다. 예시적인 첨가제는 산화 방지제, 이온 스캐빈저 및 틱소트로픽제(thixotropic agent)를 포함한다.In some exemplary implementations, the TIM 22 includes one or more additives. Exemplary additives include antioxidants, ion scavengers, and thixotropic agents.

일 예시적인 구현으로, 산화 방지제는 자유 라디칼의 전자를 산화제로 이동시킴으로써 폴리머 매트릭스의 열 분해를 억제한다. 예시적인 산화 방지제는 페놀계 산화 방지제, 아민계 산화 방지제, 또는 입체 장애 페놀 또는 아민 타입 산화 방지제와 같은 임의의 다른 적절한 타입의 산화 방지제 또는 이들의 조합을 포함한다. 예시적인 산화 방지제는 Irganox® 1076 또는 옥타데실 3-(3,5-디-(tert)-부틸-4-히드록시페닐)프로피오네이트와 같은 페놀 타입 산화 방지제; Irganox® 565 또는 2,6-디-tert-부틸-4-(4,6-비스(옥틸티오)-1,3,5-트리아진-2-일아미노) 페놀과 같은 아민 타입 산화 방지제, 및 입체 장애 황 함유 페놀릭 산화 방지제와 같은 황 함유 페놀릭 산화 방지제를 포함한다. 다른 예시적인 산화 방지제는 다음을 포함한다:In one exemplary embodiment, the antioxidant inhibits the thermal decomposition of the polymer matrix by transferring electrons of free radicals to the oxidant. Exemplary antioxidants include phenol-based antioxidants, amine-based antioxidants, or any other suitable type of antioxidants such as sterically hindered phenol or amine-type antioxidants, or combinations thereof. Exemplary antioxidants include phenolic-type antioxidants such as Irganox® 1076 or octadecyl 3- (3,5-di- (tert) -butyl-4-hydroxyphenyl) propionate; Amine type antioxidants such as Irganox 565 or 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5-triazin- Sulfur-containing phenolic antioxidants such as sterically hindered phenolic antioxidants. Other exemplary antioxidants include:

Irganox® 1010:Irganox® 1010:

Figure pct00007
Figure pct00007

Irgafos 168®:Irgafos 168®:

Figure pct00008
Figure pct00008

및 Irganox® 802:And Irganox 占 802:

Figure pct00009
Figure pct00009

일부 예시적인 구현으로, TIM(22)은 TIM(22)의 총 중량을 기준으로, 0.05중량%, 0.1중량%, 0.2중량%, 0.5중량% 정도로 적은 양으로, 1중량%, 1.5중량%, 2중량%, 5중량% 정도로 많은 양으로, 또는 0.05중량% 내지 5중량%, 0.1중량% 내지 2중량%, 또는 0.1중량% 내지 1중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 산화 방지제를 포함할 수 있다.In some exemplary implementations, the TIM 22 may comprise less than 0.05 wt%, 0.1 wt%, 0.2 wt%, or 0.5 wt%, based on the total weight of the TIM 22, 1 wt%, 1.5 wt% Or any range defined between any two of these values, such as from 0.05% by weight to 5% by weight, from 0.1% by weight to 2% by weight, or from 0.1% by weight to 1% Lt; RTI ID = 0.0 > antioxidant < / RTI >

일부 예시적인 구현으로, 이온 스캐빈저는 이들이 폴리머 내에서 자유 라디컬의 형성을 개시할 수 없도록 금속 이온을 포획하고 바인딩함으로써 폴리머 매트릭스의 열 분해를 억제한다. 예시적인 이온 스캐빈저는 PCT 출원번호 PCT/CN2014/081724에 개시되어 있으며, 이는 그 전체가 본 명세서에 참고문헌으로 편입된다. 예시적인 이온 스캐빈저는 다음을 포함한다:In some exemplary embodiments, the ion scavenger inhibits the thermal decomposition of the polymer matrix by capturing and binding metal ions such that they can not initiate the formation of free radicals in the polymer. Exemplary ion scavengers are disclosed in PCT Application No. PCT / CN2014 / 081724, which is incorporated herein by reference in its entirety. Exemplary ion scavengers include:

N-살리실리덴-N'살리실로일 히드라지드(N-salicylidene-N'salicyloyl hydrazide):N-salicylidene-N ' salicyloyl hydrazide:

Figure pct00010
Figure pct00010

옥살릴 비스(벤질리덴히드라지드)(oxalyl bis(benzylidenehydrazide)):Oxalyl bis (benzylidenehydrazide): < RTI ID = 0.0 >

Figure pct00011
Figure pct00011

N,N'-비스(살리실로일)히드라진(N,N'-bis(salicyloyl)hydrazine):N, N'-bis (salicyloyl) hydrazine:

Figure pct00012
Figure pct00012

3-(N-살리실로일)아미노-1,2,4-트리아졸(3-(N-salicyloyl)amino-1,2,4-triazole):3- (N-salicyloyl) amino-1,2,4-triazole):

Figure pct00013
Figure pct00013

2,2'-옥스아미도 비스[에틸 3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트](2,2'-oxamido bis[ethyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]):2,2'-oxamido bis [ethyl 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] di-tert-butyl-4-hydroxyphenyl) propionate]):

Figure pct00014
Figure pct00014

N,N'-비스(살리실리덴)에틸렌디아민(N,N'-bis(salicylidene) ethylenediamine):N, N'-bis (salicylidene) ethylenediamine:

Figure pct00015
Figure pct00015

2',3-비스[[3-[3,5-디-tert-부틸-4-히드록시페닐]프로피오닉]]프로피오닐 히드라지드(2', 3-bis [[3-[3, 5-di-tert-butyl-4-hydroxyphenyl] propionic]]propionyl hydrazide):Bis [[3- [3,5-di-tert-butyl-4-hydroxyphenyl] propionic acid]] propionyl hydrazide (2 ', 3-bis [ -di-tert-butyl-4-hydroxyphenyl] propionic]] propionyl hydrazide):

Figure pct00016
Figure pct00016

옥사닐리드(Oxanilide):Oxanilide:

Figure pct00017
Figure pct00017

메틸말로닉산 디아닐리드(Methylmalonic acid dianilide):Methylmalonic acid dianilide:

Figure pct00018
Figure pct00018

N-포르밀-N'-살리실로일 히드라진(N-formyl-N'-salicyloyl hydrazine):N-formyl-N'-salicyloyl hydrazine: N-formyl-

Figure pct00019
Figure pct00019

데카메틸렌디카르복실릭산 디살리실로일히드라지드(Decamethylenedicarboxylic acid disalicyloylhydrazide):Decamethylenedicarboxylic acid disalicyloylhydrazide: decamethylenedicarboxylic acid disalicyloylhydrazide:

Figure pct00020
Figure pct00020

및 비스(2,6-디-ter-부틸-4-메틸페닐)펜타에리트리톨-디포스파이트(Bis(2,6-di-ter-butyl-4-methylphenyl)pentaerythritol-diphosphite):And bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol-diphosphite:

Figure pct00021
Figure pct00021

일부 예시적인 구현으로, TIM(22)은 TIM의 총 중량을 기준으로, 0.05중량%, 0.1중량%, 0.2중량%, 0.5중량% 정도로 적은 양으로, 0.6중량%, 1중량%, 1.5중량%, 2중량%, 5중량% 정도로 많은 양으로, 또는 0.05중량% 내지 5중량%, 0.1중량% 내지 1중량%, 또는 0.1중량% 내지 0.6중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 이온 스캐빈저를 포함할 수 있다.In some exemplary implementations, the TIM 22 may comprise less than 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.5 wt%, 0.6 wt%, 1 wt%, 1.5 wt% , 2% by weight, 5% by weight, or 0.05% by weight to 5% by weight, 0.1% by weight to 1% by weight, or 0.1% by weight to 0.6% by weight And may include one or more ion scavengers in an amount within the range.

예시적인 틱소트로픽제는 퓸드 실리카 및 셀룰로오스를 포함한다. 일부 예시적인 구현으로, TIM(22)은 TIM의 총 중량을 기준으로, 0.1중량%, 0.2중량%, 0.3중량%, 0.5중량% 정도로 적은 양으로, 1중량%, 2중량%, 3중량%, 5중량% 정도로 많은 양으로, 또는 0.1중량% 내지 5중량%, 0.2중량% 내지 2중량%, 또는 0.2중량% 내지 1중량%와 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 틱소트로픽제를 포함할 수 있다.Exemplary thixotropic agents include fumed silica and cellulose. In some exemplary implementations, the TIM 22 may comprise 1 wt%, 2 wt%, 3 wt%, or less, in an amount as low as 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.5 wt% , In an amount in the order of 5% by weight, or in an amount within any range defined between any of the above values, such as from 0.1% to 5%, 0.2% to 2%, or 0.2% One or more thixotropic agents.

B. 열 계면 물질 형성 방법B. Method of forming thermal interface material

일부 구현으로, TIM(22)은 하나 이상의 폴리머 매트릭스 물질, 하나 이상의 상 변화 물질, 둘 이상의 열 전도성 충전제, 하나 이상의 용매, 및 선택적으로 하나 이상의 첨가제를 포함하는 디스펜서블 제형(dispensable formulation)으로부터 형성된다. In some implementations, the TIM 22 is formed from a dispensable formulation comprising one or more polymer matrix materials, one or more phase change materials, two or more thermally conductive fillers, one or more solvents, and optionally one or more additives .

예시적인 용매는 미국 특허출원공개 제2007/0517733호에 개시되어 있으며, 그 개시 내용은 본 명세서에 참고문헌으로 편입된다. 적합한 용매는 임계 온도와 같은 원하는 온도에서 휘발되거나, 상술한 설계 목표 또는 필요성 중 어느 것을 용이하게 할 수 있고, 그리고 이들이 앞서 언급된 목표를 달성하기 위해 상 변화 물질과 상호작용하는 점에서 상 변화 물질과 양립할 수 있는 순수 용매 또는 유기 또는 무기 용매의 혼합물을 포함한다. 일부 구현에서, 용매, 용매 혼합물 또는 이들의 조합은 프린팅 기술에 의해 적용될 수 있도록 상 변화 물질을 용매화시킬 것이다. 일부 예시적인 구현에서, 용매 또는 둘 이상의 용매의 혼합물은 탄화수소 계열의 용매로부터 선택된다. 탄화수소 용매는 탄소와 수소를 포함한다. 탄화수소 용매의 대부분은 비극성이나; 극성으로 여겨지는 약간의 탄화수소 용매가 있다.Exemplary solvents are disclosed in U.S. Patent Application Publication No. 2007/0517733, the disclosure of which is incorporated herein by reference. Suitable solvents may be volatilized at a desired temperature, such as a critical temperature, or may facilitate any of the above-mentioned design goals or needs, and that they may interact with the phase change material to achieve the aforementioned goals, Or a mixture of organic or inorganic solvents. In some implementations, the solvent, solvent mixture or combination thereof will solvate the phase change material so that it can be applied by a printing technique. In some exemplary embodiments, the solvent or mixture of two or more solvents is selected from hydrocarbon series solvents. Hydrocarbon solvents include carbon and hydrogen. Most of the hydrocarbon solvents are non-polar; There are some hydrocarbon solvents that are considered polar.

탄화수소 용매는 일반적으로 3개의 부류, 즉 지방족, 고리형 및 방향족으로 분류된다. 지방족 탄화수소 용매는 직쇄 화합물 및 분지화되고 가능하게는 가교 결합된 화합물을 모두 포함하지만, 지방족 탄화수소 용매는 전형적으로 고리형으로 간주되지 않는다. 고리형 탄화수소 용매는 지방족 탄화수소 용매와 유사한 특성을 갖는 고리 구조로 배향된 적어도 3개의 탄소 원자를 포함하는 용매이다. 방향족 탄화수소 용매는 일반 결합(common bond) 및/또는 함께 융합된 다중 고리에 의해 부착된 단일 고리 또는 다중 고리를 갖는 일반적으로 3개 또는 그 이상의 불포화 결합을 포함하는 용매이다. 일부 예시적인 구현으로, 용매 또는 둘 이상의 용매의 혼합물은 케톤, 알코올, 에스테르, 에테르 및 아민과 같은 탄화수소 용매 계열의 화합물의 일부로 간주되지 않는 용매로부터 선택된다. 또 다른 고려되는 구현으로, 용매 또는 용매 혼합물은 본 명세서에 언급된 어느 용매들의 조합을 포함할 수 있다.Hydrocarbon solvents are generally classified into three classes: aliphatic, cyclic and aromatic. Aliphatic hydrocarbon solvents include both straight chain compounds and branched and possibly crosslinked compounds, but aliphatic hydrocarbon solvents are not typically considered cyclic. The cyclic hydrocarbon solvent is a solvent comprising at least three carbon atoms oriented in a ring structure having properties similar to an aliphatic hydrocarbon solvent. Aromatic hydrocarbon solvents are solvents that generally contain three or more unsaturated bonds with a single bond or multiple rings attached by common bonds and / or multiple rings fused together. In some exemplary embodiments, the solvent or mixture of two or more solvents is selected from a solvent that is not considered part of a hydrocarbon solvent-based compound such as ketones, alcohols, esters, ethers, and amines. In another contemplated implementation, the solvent or solvent mixture may comprise any combination of solvents mentioned herein.

예시적인 탄화수소 용매는 톨루엔, 자일렌, p-자일렌, m-자일렌, 메시틸렌, 용매 나프타 H, 용매 나프타 A, 이소파르 H 및 기타 파라핀 오일 및 이소파라핀 유체, 알칸, 예컨대 펜탄, 헥산, 이소헥산, 헵탄 , 노난, 옥탄, 도데칸, 2-메틸부탄, 헥사데칸, 트리데칸, 펜타데칸, 시클로펜탄, 2,2,4-트리메틸펜탄, 석유 에테르, 할로겐화 탄화수소, 예컨대 염소화 탄화수소, 질화 탄화수소, 벤젠, 1,2-디메틸 벤젠, 1,2,4-트리메틸벤젠, 미네랄 스피릿, 등유, 이소부틸벤젠, 메틸나프탈렌, 에틸톨루엔, 리그로인(ligroine)을 포함한다. 예시적인 케톤 용매는 아세톤, 디에틸 케톤, 메틸 에틸 케톤 등을 포함한다.Exemplary hydrocarbon solvents include but are not limited to toluene, xylene, p-xylene, m-xylene, mesitylene, solvent naphtha H, solvent naphtha A, isoparaffin and other paraffin oils and isoparaffin fluids, alkanes such as pentane, Hexane, heptane, heptane, nonane, octane, dodecane, 2-methylbutane, hexadecane, tridecane, pentadecane, cyclopentane, 2,2,4-trimethylpentane, petroleum ether, halogenated hydrocarbons such as chlorinated hydrocarbons, , Benzene, 1,2-dimethylbenzene, 1,2,4-trimethylbenzene, mineral spirit, kerosene, isobutylbenzene, methylnaphthalene, ethyltoluene, and ligroine. Exemplary ketone solvents include acetone, diethyl ketone, methyl ethyl ketone, and the like.

일 예시적인 구현으로, 용매는 펜탄, 헥산, 헵탄, 시클로헥산, 파라핀 오일, 이소파라피닉 유체, 벤젠, 톨루엔, 자일렌 및 이의 혼합물 또는 조합으로부터 선택된 하나 이상의 용매를 포함한다.In one exemplary embodiment, the solvent comprises at least one solvent selected from pentane, hexane, heptane, cyclohexane, paraffin oil, isoparaffinic fluid, benzene, toluene, xylene and mixtures or combinations thereof.

일부 예시적인 구현으로, 제형은 제형의 총 중량을 기준으로, 0.1중량%, 0.5중량%, 1중량% 정도로 적은 양으로, 5중량%, 10중량%, 20중량% 정도로 많은 양으로, 또는 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 양으로 하나 이상의 용매를 포함할 수 있다.In some exemplary embodiments, the formulation is present in an amount as low as 0.1 wt%, 0.5 wt%, 1 wt%, 5 wt%, 10 wt%, 20 wt% And may include one or more solvents in an amount within any range defined between any two of the values.

일부 예시적인 구현으로, TIM(22)을 형성하는 방법이 제공된다. 일부 예시적인 구현으로, TIM(22)의 형성은 TIM(22)의 베이킹 및 건조와 같은 프로세스를 포함한다.In some exemplary implementations, a method of forming a TIM 22 is provided. In some exemplary implementations, the formation of the TIM 22 includes a process such as baking and drying of the TIM 22.

일부 예시적인 구현으로, TIM(22)을 베이킹하는 것은 25℃, 50℃, 75℃, 80℃ 정도로 낮은 온도에서, 100℃, 125℃, 150℃, 170℃ 정도로 높은 온도에서, 또는 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 온도에서 베이킹하는 것을 포함한다. 일부 예시적인 구현으로, TIM(22)은 0.5분, 1분, 30분, 1시간, 2시간 정도로 조금, 8시간, 12시간, 24시간, 36시간, 48시간 정도로 길게, 또는 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내로 베이킹된다.In some exemplary implementations, baking the TIM 22 can be performed at temperatures as low as 25 DEG C, 50 DEG C, 75 DEG C, 80 DEG C, at temperatures as high as 100 DEG C, 125 DEG C, 150 DEG C, 170 DEG C, And baking at a temperature within a range defined between any two. In some exemplary implementations, the TIM 22 may be configured to be as short as 0.5 minutes, 1 minute, 30 minutes, 1 hour, 2 hours, 8 hours, 12 hours, 24 hours, 36 hours, 48 hours, And baked within a range defined between the two.

C. 열 계면 물질 특성C. Thermal Interface Material Properties

일부 예시적인 구현으로, TIM(22)은 0.05℃·㎠/W, 0.06℃·㎠/W, 0.07℃·㎠/W 정도로 낮은 열 임피던스, 0.08℃·㎠/W, 0.09℃·㎠/W, 0.1℃·㎠/W, 0.12℃·㎠/W 정도로 높은 열 임피던스, 또는 0.05℃·㎠/W 내지 0.12℃·㎠/W, 0.06℃·㎠/W 내지 0.1℃·㎠/W 또는 0.06℃·㎠/W 내지 0.08℃·㎠/W와 같이, 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 열 임피던스를 갖는다.In some exemplary implementations, the TIM 22 has a thermal impedance as low as 0.05 占 폚 占 / / W, 0.06 占 폚 占 / / W and 0.07 占 · 占 / / W, 0.08 占 폚 占 / / W, 0.09 占 폚 占 / / A high thermal impedance of 0.1 占 폚 占 / / W and 0.12 占 폚 占 / / W or 0.05 占 폚 占 / 2 / W to 0.12 占 폚 占 / / W, 0.06 占 폚 占 ㎠ / W to 0.1 占 폚 占 ㎠ / W or 0.06 占 폚 Cm < 2 > / W to 0.08 DEG C / cm < 2 > / W.

일부 예시적인 구현으로, TIM(22)은 130℃의 온도 및 85%의 상대습도에서 96시간 동안 컨디셔닝한 후에 20% 이하, 10% 이하, 5% 이하, 또는 상기 컨디셔닝 이전에 TIM(22)의 열 임피던스 이하의 열 임피던스를 갖는다.In some exemplary implementations, the TIM 22 is conditioned to a temperature of less than 20%, less than 10%, less than 5%, or even less than 5% of the temperature of the TIM 22 And has a thermal impedance lower than the thermal impedance.

일부 예시적인 구현으로, TIM(22)은 150℃의 온도에서 1000시간 동안 컨디셔닝한 후에 20% 이하, 10% 이하, 5% 이하, 또는 상기 컨디셔닝 이전에 TIM(22)의 열 임피던스 이하의 열 임피던스를 갖는다.In some exemplary implementations, the TIM 22 has a thermal impedance of less than 20%, less than 10%, less than 5%, or less than the thermal impedance of the TIM 22 prior to conditioning, after conditioning for 1000 hours at a temperature of 150 ° C .

열 발생 및 열 방산 부품들 사이에 적용된 후, 적용된 TIM의 최종 두께는 본드 라인 두께(BLT)로 지칭된다. BLT의 값은 열 발생 부품에 의해 가열될 때의 TIM의 유동성에 의해 부분적으로 결정된다. 상 변화 물질(PCM)은 열 발생 부품에 의해 가열될 때 TIM의 유동성을 증가시키는 왁스 또는 다른 물질을 포함하며, 이는 결과적으로 BLT를 감소시킨다. BLT는 열 임피던스(TI) 및 열 전도도(TC)와 식 TI = BLT/TC의 관계로 인해 BLT가 낮으면 동일한 열 전도도에서 보다 낮은 열 임피던스를 형성한다. 어느 특정 이론에 구속되는 것을 아니나, 열 전도성 충전제의 다중 크기를 포함하는 것이 더 작은 입자 크기가 보다 큰 입자 크기들 사이에 존재하는 갭을 채우고, TIM의 유동성을 증가시키고, BLT를 감소시키는 것을 가능하게 한다고 믿어진다. 낮은 BLT를 갖는 TIM 제형은 낮은 열 임피던스를 갖는 경향이 있다.After being applied between the heat generating and heat dissipating parts, the final thickness of the applied TIM is referred to as the bond line thickness (BLT). The value of BLT is determined in part by the flowability of the TIM when heated by the heat generating component. The phase change material (PCM) comprises wax or other material that increases the flowability of the TIM when heated by the heat generating component, which in turn reduces the BLT. BLTs form lower thermal impedances at the same thermal conductivity when the BLT is low due to the relationship between the thermal impedance (TI) and thermal conductivity (TC) and the equation TI = BLT / TC. Without being bound to any particular theory, it is possible to include multiple sizes of thermally conductive fillers to fill gaps where smaller particle sizes exist between larger particle sizes, to increase the flowability of TIMs, and to reduce BLT . TIM formulations with low BLT tend to have low thermal impedances.

일부 구현으로, 40psi의 압력을 받고 80℃로 가열될 경우, TIM(22)은 80미크론, 70미크론, 60미크론, 50미크론, 40미크론 정도로 큰 두께의 본드 라인 두께, 30미크론, 25미크론, 20미크론, 15미크론, 10미크론, 5미크론 이하 정도로 작은 두께의 본드 라인 두께, 또는 80미크론 내지 5미크론, 60미크론 내지 10미크론, 또는 30미크론 내지 20미크론과 같이 상기 값들 중 어느 둘 사이에 정의된 어느 범위 내의 본드 라인 두께를 갖는다.In some implementations, when subjected to a pressure of 40 psi and heated to 80 DEG C, the TIM 22 has a bond line thickness of 80 microns, 70 microns, 60 microns, 50 microns, 40 microns thick, 30 microns, 25 microns, 20 microns A thickness of the bond line as small as 15 microns, 15 microns, 10 microns, 5 microns or less, or any of the values defined between any two of these values such as 80 microns to 5 microns, 60 microns to 10 microns, or 30 microns to 20 microns And has a bond line thickness in the range.

일부 구현으로, TIM(22)은 상승된 온도에서 드리핑에 저항한다. 일 예시적인 드리핑 시험에서, TIM(22) 조성물은 2개의 금속 막대들 사이에 약 0.6mm의 두께로 적용되고 약 30psi의 압력을 받는다. 금속 사이의 TIM(22) 계면은 수직으로 위치하며 2일 동안 120℃의 온도를 받는다. 2일 동안 계면으로부터 드리핑되는 어느 TIM(22) 물질은 베이킹 시험에 실패했음을 나타낸다. 그 다음, 샘플은 -55℃ 내지 125℃ 사이에서 90번 순환된다. 순환 중에 계면으로부터 드리핑되는 어느 TIM(22)은 순환 시험에 실패했음을 나타낸다.In some implementations, the TIM 22 is resistant to dripping at elevated temperatures. In one exemplary droplet test, the TIM 22 composition is applied between two metal rods to a thickness of about 0.6 mm and is subjected to a pressure of about 30 psi. The TIM (22) interface between the metals is positioned vertically and is subjected to a temperature of 120 DEG C for two days. Any TIM (22) material that has been drained from the interface for 2 days indicates that the baking test failed. The sample is then cycled 90 times between -55 ° C and 125 ° C. Any TIM 22 that is draining from the interface during circulation indicates that the circulation test failed.

실시예Example

실시예는 표 1에 나타낸 조성에 따라 제조되었다. 표 1에 나타낸 바와 같이, 실시예 1은 멜라민 수지 가교제 및 1미크론보다 큰 직경을 갖는 알루미늄 입자 및 1미크론 미만의 직경을 갖는 산화 아연 입자를 포함하여 구성된 약 91.9중량% 총 열 전도성 충전제를 포함하였다. 비교예 1은 멜라민 수지 가교제가 결여되었고, 약 90.8중량% 총 열 전도성 충전제만을 포함하였으며, 1미크론 미만의 직경을 갖는 어느 입자를 포함하지 않았다. 비교예 2는 멜라민 수지 가교제를 포함하였으나, 단지 약 89.8중량% 총 열 전도성 충전제를 가졌으며, 1미크론 미만의 직경을 갖는 어느 입자를 포함하지 않았다. 비교예 3은 멜라민 수지 가교제가 결여되었지만, 1미크론보다 큰 직경을 갖는 알루미늄 입자 및 1미크론 미만의 직경을 갖는 산화 아연 입자를 포함하여 구성된 약 90.3중량% 총 열 전도성 충전제를 포함하였다.Examples were prepared according to the compositions shown in Table 1. As shown in Table 1, Example 1 included about 91.9 wt% total thermally conductive filler consisting of a melamine resin cross-linker and aluminum particles having a diameter greater than 1 micron and zinc oxide particles having a diameter less than 1 micron . Comparative Example 1 lacked a melamine resin crosslinker and contained only about 90.8 wt% total thermally conductive filler and did not contain any particles with diameters less than 1 micron. Comparative Example 2 contained a melamine resin crosslinker, but only had about 89.8 wt% total thermal conductive filler and did not contain any particles having a diameter less than 1 micron. Comparative Example 3 included about 90.3 wt% total thermally conductive filler consisting of aluminum particles having a diameter greater than 1 micron and zinc oxide particles having a diameter less than 1 micron, although the melamine resin crosslinker was absent.

[표 1][Table 1]

Figure pct00022
Figure pct00022

각각의 TIM은 수직 방향으로 계면이 배향된 2개의 금속 플레이트들 사이에 샌드위치되고 30psi가 가해진다. 각 샘플에 대한 원래의 두께는 표 2에 나타낸 바와 같이 약 0.6mm였다.Each TIM is sandwiched between two metal plates whose interfaces are oriented vertically and applied at 30 psi. The original thickness for each sample was about 0.6 mm as shown in Table 2.

각 샘플에 120℃의 온도에서 2일 동안 베이킹 테스트를 실시하였다. 2일 동안 계면으로부터 드리핑되는 어느 TIM 물질은 베이킹 테스트 실패를 나타낸다. 그 다음, 각 샘플은 -55℃ 내지 125℃까지 90 온도 사이클의 열 순환 테스트를 2일 반 동안 받았다. 순환 중에 계면으로부터 드리핑되는 어느 TIM 물질은 열 순환 테스트 실패를 나타낸다.Each sample was baked for 2 days at a temperature of 120 ° C. Any TIM material that is drained from the interface for 2 days represents a failure of the baking test. Each sample was then subjected to a thermal cycling test of 90 temperature cycles from -55 ° C to 125 ° C for two and a half days. Any TIM material that is drained from the interface during cycling indicates a failure in the thermocycling test.

[표 2][Table 2]

Figure pct00023
Figure pct00023

표 2에 나타낸 바와 같이, 서브미크론 열 전도성 충전제 및 가교제를 포함하는 실시예 1만이 베이킹 테스트 및 열 순환 온도 순환 테스트를 통과하였다. 가교제를 포함하지만 서브미크론 충전제가 없는 비교예 1 및 2는 베이킹 결과 테스트 및 열 순환 온도 순환 테스트 모두에 실패했다. 서브미크론 충전제를 포함하지만 가교제가 없는 비교예 3은 베이킹 테스트를 통과했지만 열 순환 온도 순환 테스트에 실패했다. 실시예 1은 비교예들 중 어느 것보다 우수한 안티-트립 특성을 가졌다.As shown in Table 2, only Example 1, which includes a submicron thermally conductive filler and a crosslinking agent, passed the baking test and the thermocycling temperature cycling test. Comparative Examples 1 and 2, which included a cross-linker but no submicron filler, failed both in the baking result test and in the thermocycling temperature cycling test. Comparative Example 3, which contained a submicron filler but no crosslinker, passed the baking test but failed in the thermocycling temperature cycling test. Example 1 had better anti-trip properties than either of the comparative examples.

각 TIM에 열 신뢰도 시험을 실시하였다. 각 샘플을 90℃에서 1시간 동안 금형에 끼우고 본래의 열 임피던스와 두께(본드 라인 두께)를 측정하였다. 비교예 1, 비교예 2 및 실시예 1의 경우, 각 물질의 처음 2개 샘플은 35psi로 가압되고, 3번째 샘플은 압력없이 베이킹되었다. 비교예 3의 경우, 3개의 샘플 중 어느 것에도 압력을 가하지 않았다.Thermal reliability tests were performed on each TIM. Each sample was placed in a mold at 90 ° C for 1 hour and the intrinsic thermal impedance and thickness (bond line thickness) were measured. For Comparative Example 1, Comparative Example 2 and Example 1, the first two samples of each material were pressurized to 35 psi and the third sample was baked without pressure. In the case of Comparative Example 3, no pressure was applied to any of the three samples.

각 샘플을 260℃에서 10분 동안 베이킹한 후, 샘플을 세척하고 열 임피던스를 재시험하였다. 실시예 1의 경우, 샘플을 또한 20분 동안 베이킹한 후, 이들을 세척하고 열 임피던스를 재시험하였다. 베이킹 후 열 임피던스의 변화가 작은 것이 바람직하다.After each sample was baked at 260 ° C for 10 minutes, the sample was washed and the thermal impedance was re-examined. For Example 1, the samples were also baked for 20 minutes, then they were washed and the thermal impedance was re-examined. It is preferable that the change in thermal impedance after baking is small.

[표 2][Table 2]

Figure pct00024
Figure pct00024

표 3에 나타낸 바와 같이, 서브미크론 열 전도성 충전제 및 가교제를 포함하는 실시예 1만이 가압된(35psi) 결과 및 가압되지 않은(0psi) 결과 모두에서 양호한 결과를 제공하였다. 실시예 1의 열 임피던스는 26℃에서 20분 후에도 비교적 일정한 것으로 나타났다. 가교제를 포함하지만 서브미크론 충전제가 없는 비교예 1 및 2는 가압된(35psi) 경우 열 임피던스의 증가를 나타내고, 가압되지 않은(0psi) 경우 열 임피던스의 실질적인 증가를 나타냈다. 서브미크론 충전제를 포함하지만 가교제가 없는 비교예 3은 가압되지 않은(0 psi) 경우 열 임피던스의 실질적인 증가를 나타냈다. 따라서, 실시예 1은 어느 비교예보다 더 우수한 신뢰도를 나타내었다.As shown in Table 3, only Example 1 comprising submicron thermally conductive filler and crosslinker provided good results in both pressurized (35 psi) and unpressurized (0 psi) results. The thermal impedance of Example 1 was relatively constant even after 20 minutes at 26 占 폚. Comparative Examples 1 and 2, which included a crosslinker but no submicron filler, showed an increase in thermal impedance at pressurized (35 psi) and a substantial increase in thermal impedance at unpressurized (0 psi). Comparative Example 3, which includes a submicron filler but no crosslinker, showed a substantial increase in thermal impedance when unpressurized (0 psi). Thus, Example 1 exhibited better reliability than either comparative example.

본 발명은 예시적인 디자인을 갖는 것으로 설명되었지만, 본 발명은 본 개시의 사상 및 범위 내에서 추가로 변형될 수 있다. 따라서, 본 출원은 이의 일반 원리를 사용하여 본 발명의 임의의 변형, 사용 또는 적용을 포괄하고자 한다. 또한, 본 출원은 본 발명이 속하는 기술분야에 알려지거나 통상적인 수행으로 나오는 본 발명으로부터의 이탈을 포괄하는 것으로 의도되며, 이는 첨부된 청구범위의 범위 내에 포함된다.While the present invention has been described as having an exemplary design, the present invention may be further modified within the spirit and scope of the present disclosure. Accordingly, this application is intended to cover any variations, uses, or adaptations of the invention using its general principles. This application is also intended to cover such departures from the present invention as come within known or customary practice in the art to which this invention pertains and which fall within the scope of the appended claims.

Claims (10)

1중량% 내지 16중량%의 적어도 하나의 폴리머 매트릭스 물질;
0.5중량% 내지 8중량%의 적어도 하나의 상 변화 물질;
0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제; 및
약 1미크론 이하의 입자 직경을 갖는 제1 복수의 입자를 포함하는 적어도 하나의 열 전도성 충전제를 포함하며; 여기서 적어도 하나의 열 전도성 충전제는 열 계면 물질의 총 중량의 80중량%로 포함되는, 열 계면 물질.
1% to 16% by weight of at least one polymer matrix material;
From 0.5% to 8% by weight of at least one phase change material;
0.1% to 1% by weight of at least one amine or amine based cross-linking agent; And
At least one thermally conductive filler comprising a first plurality of particles having a particle diameter of about 1 micron or less; Wherein the at least one thermally conductive filler comprises 80 wt% of the total weight of the thermal interface material.
제1항에 있어서,
제1 복수의 입자는 약 0.1미크론 내지 약 1미크론의 직경을 갖는 산화 아연의 입자를 포함하는, 열 계면 물질.
The method according to claim 1,
Wherein the first plurality of particles comprises particles of zinc oxide having a diameter of from about 0.1 micron to about 1 micron.
제1항에 있어서,
적어도 하나의 열 전도성 충전제는 약 1미크론 이상의 입자 직경을 갖는 제2 복수의 입자를 포함하는, 열 계면 물질.
The method according to claim 1,
Wherein the at least one thermally conductive filler comprises a second plurality of particles having a particle diameter of at least about 1 micron.
제3항에 있어서,
제2 복수의 입자는 약 2미크론 내지 약 12미크론의 입자 직경을 갖는 알루미늄의 입자를 포함하는, 열 계면 물질.
The method of claim 3,
Wherein the second plurality of particles comprises particles of aluminum having a particle diameter of from about 2 microns to about 12 microns.
제1항에 있어서,
아민 또는 아민계 가교제는 알킬화 멜라민 수지인, 열 계면 물질.
The method according to claim 1,
Wherein the amine or amine based crosslinking agent is an alkylated melamine resin.
제1항에 있어서,
열 계면 물질은 열 계면 물질의 총 중량을 기준으로, 1중량% 내지 8중량%의 적어도 하나의 폴리머 매트릭스 물질; 0.5중량% 내지 5중량%의 적어도 하나의 상 변화 물질; 0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제; 및 91중량% 내지 95중량%의 적어도 하나의 열 전도성 충전제를 포함하는, 열 계면 물질.
The method according to claim 1,
The thermal interface material may comprise from 1 wt% to 8 wt% of at least one polymer matrix material, based on the total weight of the thermal interface material; From 0.5% to 5% by weight of at least one phase change material; 0.1% to 1% by weight of at least one amine or amine based cross-linking agent; And 91% to 95% by weight of at least one thermally conductive filler.
제1항에 있어서,
적어도 하나의 커플링제, 산화 방지제, 이온 스캐빈저, 또는 틱소트로픽제(thixotropic agent)를 추가로 포함하는, 열 계면 물질.
The method according to claim 1,
A thermal interface material further comprising at least one coupling agent, an antioxidant, an ion scavenger, or a thixotropic agent.
열 싱크;
전자 칩;
상기 열 싱크와 전자 칩 사이에 수직 배향으로 위치한 열 계면 물질로서,
1중량% 내지 16중량%의 적어도 하나의 폴리머 매트릭스 물질;
0.5중량% 내지 8중량%의 적어도 하나의 상 변화 물질;
0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제; 및
약 0.1미크론 내지 약 1미크론 입자의 직경을 갖는 복수의 산화 아연 입자 및 약 2미크론 내지 약 12의 입자 직경을 갖는 복수의 알루미늄 입자를 포함하는 적어도 하나의 열 전도성 충전제를 포함하며; 여기서 상기 적어도 하나의 열 전도성 충전제는 열 계면 물질의 총 중량의 적어도 80중량%로 포함되는, 열 계면 물질
을 포함하는, 전자 부품.
Heat sink;
Electronic chip;
A thermal interface material positioned in a vertical orientation between the heat sink and the electronic chip,
1% to 16% by weight of at least one polymer matrix material;
From 0.5% to 8% by weight of at least one phase change material;
0.1% to 1% by weight of at least one amine or amine based cross-linking agent; And
At least one thermally conductive filler comprising a plurality of zinc oxide particles having a diameter of from about 0.1 micron to about 1 micron particle and a plurality of aluminum particles having a particle diameter of from about 2 microns to about 12; Wherein the at least one thermally conductive filler comprises at least 80 weight percent of the total weight of the thermal interface material,
And an electronic component.
제8항에 있어서,
아민 또는 아민계 가교제는 알킬화 멜라민 수지인, 전자 부품.
9. The method of claim 8,
Wherein the amine or amine-based crosslinking agent is an alkylated melamine resin.
제8항에 있어서,
적어도 하나의 열 전도성 충전제는 열 계면 물질의 총 중량을 기준으로, 1중량% 내지 8중량%의 적어도 하나의 폴리머 매트릭스 물질; 0.5중량% 내지 5중량%의 적어도 하나의 상 변화 물질; 0.1중량% 내지 1중량%의 적어도 하나의 아민 또는 아민계 가교제; 및 91중량% 내지 95중량%의 적어도 하나의 열 전도성 충전제를 포함하는, 전자 부품.
9. The method of claim 8,
Wherein the at least one thermally conductive filler comprises from 1% to 8% by weight, based on the total weight of the thermal interface material, of at least one polymer matrix material; From 0.5% to 5% by weight of at least one phase change material; 0.1% to 1% by weight of at least one amine or amine based cross-linking agent; And 91% to 95% by weight of at least one thermally conductive filler.
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