KR20170077312A - Rubber compound for clearing of semiconductor mold - Google Patents
Rubber compound for clearing of semiconductor mold Download PDFInfo
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- KR20170077312A KR20170077312A KR1020150187057A KR20150187057A KR20170077312A KR 20170077312 A KR20170077312 A KR 20170077312A KR 1020150187057 A KR1020150187057 A KR 1020150187057A KR 20150187057 A KR20150187057 A KR 20150187057A KR 20170077312 A KR20170077312 A KR 20170077312A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a rubber composition for cleaning semiconductor molds. The present invention relates to a rubber composition comprising 20 to 70 wt% of a mixture of ethylene-propylene diene monomer rubber (EPDM) and styrene butadiene rubber (SBR), 0.5 to 20 wt% of a cleaning compound, 20 to 70 wt% of an inorganic filler, And 0.2 to 5% by weight of a crosslinking agent, wherein the cleaning agent comprises 1.5% by weight of an imidazoline-based cleaning compound and 8% by weight of an anionic surfactant cleaning compound, the inorganic filler comprises 70% by weight of silica , And the crosslinking agent is composed of 0.5 wt% of 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane.
As a result, the EMC reaction gas and the grime residue of the release agent are easily cleaned without damaging the inner surface of the mold by repeating the process after the molding of the EMC mold, which is a post-process of semiconductor assembly production, It provides an effect that can be removed.
Description
The present invention relates to a rubber composition for cleaning a mold, and more particularly, to a rubber composition for cleaning a mold, more specifically, by repeating the process after the molding of an EMC mold, The present invention relates to a rubber composition for cleaning a semiconductor mold, which is easily cleaned without causing scratches on the mold, thereby removing contaminants remaining in the mold.
The present invention also relates to a rubber composition prepared by mixing ethylene-propylene diene monomer rubber (EDPM) and styrene butadiene rubber (SBR) as main components and a cleaning agent containing an aqueous cleaning compound and an inorganic filler and a crosslinking agent and other additives. The present invention relates to a rubber composition for cleaning a semiconductor mold, which improves the cleaning property of contaminants in the mold and the deformation after completion of cleaning by curing the composition in a mold.
Generally, when a product is molded using a thermosetting resin, in particular, an EMC molding process for semiconductor manufacturing requires high-quality product reliability. A mold used for molding a product by compressing and heating a thermosetting resin or the like as a raw material has a problem that a part of the molded product is carbonized during a repeated working process and remains as a contaminant, But also causes the quality of the product to deteriorate during the continuous molding process.
Contaminants, including carbonaceous residues of moldings, are particularly prominent when the mold structure is complex or the size of the moldings is small. In the EMC molding process, which is covered with a thermosetting resin such as epoxy resin, It appears to be a major problem.
Therefore, the mold that has undergone the work for a certain period of time must undergo a cleaning process to remove remaining contaminants. Generally, such a cleaning process is performed by introducing a cleaning compound containing melamine resin and rubber as main materials into a mold, A method of heating and pressurizing in the same manner is used. Particularly, among these methods, the cleaning method using the cleaning rubber composition is relatively more economical than the method using the melamine resin, and is easy to carry out the cleaning work and is widely used in cleaning processes such as EMC molding molds. BR) and ethylene-propylene diene monomer rubber (EPDM) as a main material, the composition of the rubber composition for general cleaning uses a fine semiconductor mold. When the composition is used for a micro semiconductor mold, And causes secondary pollution. In order to solve this problem, there is a cleaning rubber composition in which detergent is improved by including an internal release agent (WAX type) in a cleaning compound as a conventional method, but detergency is deteriorated due to a release agent component. In addition, due to the miniaturization and diversification of the semiconductor structure due to the development of the semiconductor manufacturing technology, the EMC molding mold has also become more complicated and finer structure. Therefore, the rubber composition for cleaning used in the cleaning process is also required to develop to such a trend. Are not satisfying these requirements.
Accordingly, the present invention proposes a cleaning rubber composition which is easily cleaned without damaging the inner surface of the mold after EMC mold molding, which is a post-process of semiconductor assembly production, to remove contaminants remaining in the mold.
[Related Technical Literature]
1. RUBBER COMPOUND FOR CLEARING OF SEMICONDUCTOR MOLD (Patent Application No. 10-2009-0067310)
2. Rubber composition for cleaning mold (Patent Registration No. 10-0454389)
3. Low Specific Gravity Foamed Rubber Sheet Composition and Method for Manufacturing the Same (Patent Application No. 10-2002-0009265)
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to provide a method of manufacturing a semiconductor device, And removing the contaminants remaining in the mold by washing the rubber mold.
The present invention also relates to a rubber composition prepared by mixing ethylene-propylene diene monomer rubber (EDPM) and styrene butadiene rubber (SBR) as main components and a cleaning agent containing an aqueous cleaning compound and an inorganic filler and a crosslinking agent and other additives. The present invention is to provide a rubber composition for cleaning a semiconductor mold which improves the cleaning property of contaminants in the mold and the deformation after completion of cleaning by curing the composition in a mold.
However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.
In order to attain the above object, the rubber composition for cleaning a semiconductor mold comprises 20 to 70% by weight of a mixture of ethylene-propylene diene monomer rubber (EPDM) and styrene butadiene rubber (SBR), 0.5 to 20% 20 to 70 wt%, 1 to 10 wt% of other additives, and 0.2 to 5 wt% of a crosslinking agent.
In the rubber composition for cleaning a semiconductor mold according to another embodiment of the present invention, the cleaning agent is composed of 1.5% by weight of an imidazoline-based cleaning compound and 8% by weight of an anionic surfactant cleaning compound, and the inorganic filler is 70% 0.5% by weight of 1,1-di-t-vutylperoxy-3,3,5-trimethylcyclohexane, . ≪ / RTI >
The rubber composition for cleaning a semiconductor mold according to an embodiment of the present invention is formed by repeatedly performing an after-molding process of an EMC mold, which is a post-process of manufacturing a semiconductor assembly, to remove scum residue from the EMC reaction gas and a release agent in the mold. So that the contamination remaining in the mold can be removed.
The rubber composition for mold cleaning according to the embodiment of the present invention comprises ethylene-propylene diene monomer rubber (EDPM) and styrene butadiene rubber (SBR) as main components, a cleaning agent containing a cleaning compound, The present invention provides an effect of improving the cleaning property of the contaminants in the mold and improving the deformation after completion of the cleaning by curing the rubber composition prepared by mixing the additives into a semiconductor mold.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
The present invention relates to a rubber composition prepared by mixing an ethylene-propylene diene monomer rubber (EDPM) as a main component and a detergent containing an aqueous cleaning compound and an inorganic filler and a crosslinking agent and other additives. The rubber composition is cured in a semiconductor mold, The present invention is to provide a rubber composition for cleaning semiconductor molds which can improve cleanability of contaminants and improve deformation after completion of cleaning to shorten the assembling process after semiconductor assembly production.
First, a technical object of the present invention is to provide a rubber composition for semiconductor mold cleaning comprising a novel composition. The present invention uses a mixture of an ethylene-propylene diene monomer rubber (EPDM) and styrene butadiene rubber (SBR) as a main component for improving the releasability, and a cleaning compound composed of an aqueous cleaning compound and an Imidazole- And an inorganic filler, other additives, and a cross-linking agent are incorporated into the rubber composition for cleaning.
Specifically, the cleaning rubber composition comprises 20 to 70% by weight of a mixture of ethylene-propylene diene monomer rubber (EPDM) and styrene butadiene rubber (SBR), 0.5 to 20% by weight of a cleaning compound, To 70% by weight, from 1 to 10% by weight of other additives, and from 0.2 to 5% by weight of a crosslinking agent. Hereinafter, each composition will be described in more detail.
1. Rubber component
The ethylene-propylene diene monomer rubber (EPDM) and the styrene-butadiene rubber mixture flow in the mold due to heat and pressure during the cleaning process and penetrate into the fine structure, thereby removing residual contaminants on the mold structure surface and facilitating de- The content of the ethylene-propylene diene monomer rubber (EPDM) and the styrene butadiene rubber used in the present invention is 20 to 70%. When the styrene butadiene rubber content in the rubber composition is 10% by weight or less, When the content of the styrene-butadiene rubber is 30% by weight or more, the releasability with the mold is increased and the cleaning property is deteriorated.
2. Cleaning compound
The cleansing compound is a substance that acts to remove contaminants from the mold, and is mixed with rubber together with an inorganic filler. Typical examples of such a cleansing compound include an aqueous cleansing compound, an imidazoline cleansing compound, an amine cleansing compound, and an amino alcohol cleansing compound, among which a combination of an aqueous cleansing compound and an imidazoline cleansing compound is particularly preferable.
The detergent used in the present invention is a substance that serves to separate contaminants from the mold, and is mixed with rubber together with the inorganic filler silica of the present invention. Representative examples of such a cleaning compound include an anionic surfactant cleaning compound, an imidazoline cleaning compound, and an amine cleaning compound. Specifically, the anionic surfactant is a substance that is ionically dissociated in an aqueous solution, and the anion moiety exhibits an interfacial activity. In many products, there are three types of carboxylic acid, sulfuric acid ester, and sulfonic acid, which are usually used as soluble salts. Among these, sulfonic acid salts are the most excellent in stability such as internal water resistance, hydrolysis resistance and salt resistance, and the lowest is carboxylate.
Examples of the type having a carboxylates structure include ethoxy carboxylates, ester carboxyates, amide carboxylates and derivatives thereof.
As the types having a phosphates structure, there are ethoxylates, alcohols, amides and derivatives thereof.
Examples of the sulphate and sulphonate structures include alcohol, alcoholether (ethane), alkanolamides, ethoxyl groups, alkylphenyl ethers, fatty acids and esters fatty acid and esters, olefine sulphonates and derivatives thereof.
As a class having a phosphates ester structure, there are alkyl phosphate, alkyl ether phosphate, and dialkyl pyrophosphate.
3. inorganic filler
As the inorganic filler, a substance having a large adsorption force or a large specific surface area may be used as a builder, a substance which causes odor and haze, and the like. The inorganic filler toner silica of the present invention is used.
The content of silica as the inorganic filler of the present invention is 20 to 60% by weight, preferably 30 to 50% by weight, based on the total weight of the composition. It may be contained in an amount exceeding the above amount as long as it does not affect the cleaning effect.
4. Cross-linking agent
In the composition of the present invention, a cross-linking agent serving as a catalyst for forming a rubber cured product by causing a cross-linking reaction between rubber molecule chains in the case of receiving heat is added, and 1,1- (1,1-di-t-vutylperoxy-3,3,5-trimethylcyclohexane), 1,3 1,4-bis (t-butylperoxyisopropyl) benzene , The content of the crosslinking agent is 0.2 to 5 wt%, more preferably 0.5 to 3 wt%.
5. Other additives
According to other applications, softener, activator and titanium oxide were added to improve physical properties. As the activator, zinc oxide and stearic acid were added. Titanium oxide was added for whiteness improvement. In order to improve the workability, softeners and other additives were used . When these other additives are added to the rubber composition, the content is preferably 1 to 20% by weight based on the total weight of the composition.
By the composition of the above-mentioned components, a cleaning rubber composition having excellent cleaning properties and work efficiency can be produced.
Hereinafter, the present invention will be described in more detail based on the following examples, but the present invention is not limited to the examples.
1. Preparation of rubber composition for mold cleaning
(Example 1)
, 1.5% by weight of an imidazoline-based cleaning compound, 8% by weight of an anionic surfactant-cleansing compound, 5% by weight of an inorganic compound, 100% by weight of an intervening material composed of 85% by weight of an ethylene-propylene diene monomer rubber (EPDM) and 15% by weight of a styrene butadiene rubber (SBR) 70% by weight of filler silica, 0.5% by weight of a crosslinking agent 1,1-di-t-vutylperoxy-3,3,5-trimethylcyclohexane, , And 20 wt% of other additives were mixed and dispersed to prepare a rubber composition for mold cleaning.
(Example 2)
, 1.5% by weight of an imidazoline-based cleaning compound, 8% by weight of an anionic surfactant cleaning compound, 10% by weight of an inorganic compound, 100% by weight of an intervening material consisting of 80% by weight of an ethylene-propylene diene monomer rubber (EPDM) and 20% by weight of a styrene butadiene rubber (SBR) 70% by weight of filler silica, 0.5% by weight of a crosslinking agent 1,1-di-t-vutylperoxy-3,3,5-trimethylcyclohexane, , And 20 wt% of other additives were mixed and dispersed to prepare a rubber composition for mold cleaning.
(Example 3)
, 1.5% by weight of an imidazoline-based cleaning compound, 8% by weight of an anionic surfactant-cleansing compound, 5% by weight of an inorganic compound, 100% by weight of an intervening material consisting of 75% by weight of an ethylene-propylene diene monomer rubber (EPDM) and 25% by weight of styrene butadiene rubber 70% by weight of filler silica, 0.5% by weight of a crosslinking agent 1,1-di-t-vutylperoxy-3,3,5-trimethylcyclohexane, , And 20 wt% of other additives were mixed and dispersed to prepare a rubber composition for mold cleaning.
(Comparative Example 1)
, 1.5 weight percent of the imidazoline-based cleaning compound, 8 weight percent of the anionic surfactant cleaning compound, 70 weight percent of the inorganic filler silica, based on 100 weight percent of the intervening material consisting of 85 weight percent of butadiene rubber (BR) and 15 weight percent of styrene butadiene rubber (SBR) , 0.5% by weight of a crosslinking agent 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane (1,1-di-t-vutylperoxy- By weight of the rubber component was mixed and dispersed to prepare a rubber composition for mold cleaning.
(Comparative Example 2)
, 1.5 weight percent of an imidazoline-based cleaning compound, 8 weight percent of an anionic surfactant cleaning compound, 70 weight percent of an inorganic filler silica, based on 100 weight percent of an intervening material consisting of 80 weight percent of butadiene rubber (BR) and 20 weight percent of styrene butadiene rubber (SBR) , 0.5% by weight of a crosslinking agent 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane (1,1-di-t-vutylperoxy- By weight of the rubber component was mixed and dispersed to prepare a rubber composition for mold cleaning.
(Comparative Example 3)
, 1.5 weight% of an imidazoline-based cleaning compound, 8 weight% of an anionic surfactant cleaning compound, 70 weight% of an inorganic filler silica, based on 100 weight% of an intervening material composed of 75 weight% of butadiene rubber (BR) and 25 weight% of styrene butadiene rubber (SBR) , 0.5% by weight of a crosslinking agent 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane (1,1-di-t-vutylperoxy- By weight of the rubber component was mixed and dispersed to prepare a rubber composition for mold cleaning.
2. Evaluation of Rubber Composition for Mold Cleaning
The rubber compositions prepared according to Examples 1 to 3 and Comparative Examples 1 to 3 were evaluated for cleaning property, deformation, workability, vulcanization time, surface condition and the like.
- cleanliness evaluation
The cleaning rubber compound was divided into the molds of Examples 1 to 3 and Comparative Examples 1 to 3 in a mold having a lot of contaminants accumulated on the surface of the mold through repetitive molding, After the mold was cleaned, the mold was cleaned and the amount of contaminants that were integrated with the mold was visually observed.
- Deformation evaluation
The deformation is a measure of the extent to which the mold is free of as much residue as possible and the mold is well removed when the cleaning compound is put into the mold after the cleaning compound is removed. To measure this, a relatively complex and fine mold After the cleaning compound was put in, the remaining amount of the residue was measured. Also, when the tensile stress and the tensile strength are numerically high, it is judged that the above-mentioned deformation is good, and it is measured.
- Evaluation of machining workability
The dispersibility and durability of the compound were determined during mixing with a Banbury mixer or a roll mill, and the dispersion of the compound was measured through a physical property test.
- vulcanization time
The 90% vulcanization time (t90) at 170 ° C was measured by means of a rheometer (flow meter, flow meter of vulcanization of vulcanized rubber and apparatus for measuring vulcanization rate).
Next, the physical properties of the crosslinked rubber were measured by the methods of KS M 6784, KS M 6518, and KS M6783 of Korean Industrial Standards. The measurement methods, definitions and units of the respective properties are as follows .
The rubber composition for mold cleaning prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was cured at a temperature of 170 to 180 ° C and a pressure of 15 to 100 kgf / cm 2 for 2 to 10 minutes in an EMC mold, The detergency of the contaminants and the post-cleaning demineralization, fillability, and fogging, which are measures of work efficiency, were visually confirmed and the respective vulcanization times were measured. The results are shown in Table 1 below.
As shown in Table 1, the rubber compositions for mold cleaning according to Examples 1 to 3 had improved mold cleaning properties for EMC as compared with the rubber composition for mold cleaning according to Comparative Examples 1 to 3, It was shown that it was excellent.
In addition, it can be seen that the occurrence of haze is not large in the rubber composition for cleaning a mold according to Examples 1 to 3 as compared with the rubber composition for cleaning a mold according to Comparative Example 2. [
In addition, the use of environmentally friendly detergents overcomes the disadvantages of improving the working environment and especially the long term use type discoloration due to no emission of harmful substances.
The rubber composition for mold cleaning prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was cured at a temperature of 150 ° C and a pressure of 15 to 100 kgf / cm 2 for 2 to 10 minutes in an LED package mold, The results are shown in Table 2 below. [Table 2] < tb >< TABLE > Id = Table 2 Columns = 2 < tb >
As shown in Table 2, the rubber compositions for mold cleaning according to Examples 1 to 3 had improved mold cleaning properties even in LED package molds as compared with the rubber composition for mold cleaning according to Comparative Examples 1 to 3, And the effect of improving the formation was shown.
As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.
Claims (2)
The cleaning agent is composed of 1.5% by weight of an imidazoline-based cleaning compound and 8% by weight of an anionic surfactant cleaning compound,
The inorganic filler is composed of 70% by weight of silica,
The crosslinking agent is composed of 0.5% by weight of 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane A rubber composition for mold cleaning
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150187057A KR20170077312A (en) | 2015-12-28 | 2015-12-28 | Rubber compound for clearing of semiconductor mold |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020150187057A KR20170077312A (en) | 2015-12-28 | 2015-12-28 | Rubber compound for clearing of semiconductor mold |
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| KR20170077312A true KR20170077312A (en) | 2017-07-06 |
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| KR1020150187057A KR20170077312A (en) | 2015-12-28 | 2015-12-28 | Rubber compound for clearing of semiconductor mold |
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