CN102775656B - Rubber composition used for cleaning integrated circuit (IC) die - Google Patents
Rubber composition used for cleaning integrated circuit (IC) die Download PDFInfo
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- CN102775656B CN102775656B CN201210252751.3A CN201210252751A CN102775656B CN 102775656 B CN102775656 B CN 102775656B CN 201210252751 A CN201210252751 A CN 201210252751A CN 102775656 B CN102775656 B CN 102775656B
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Abstract
The invention relates to a rubber composition used for cleaning an IC die. The rubber composition is characterized by comprising, by weight, 40-60% of isoprene rubber, 30-50% of diatomite, 5-10% of octadecylamine, 2-5% of gamma-(aminopropyl)triethoxysilane and 1-2% of N, N- m-phenylene dimaleimide which are mixed and rolled to form the rubber composition. The composition has an excellent cleaning performance, and generates no pungent smells or smog during a utilization process.
Description
Technical field
The present invention relates to a kind of rubber combination, especially a kind of rubber combination for cleaning integrated circuit die.
Background technology
In traditional integrated circuit packaging process, partial encapsulation material and releasing agent are easily oxidized under the effect of high temperature, are attached to die surface, form the dirt being difficult to remove, release difficulty, package macroscopic irregularity when this can cause encapsulation.This makes mold clean technique most important.
In clear membrane process in the past, often use trimeric cyanamide die cleaning material, its main component has trimeric cyanamide, solidifying agent, filler, wax etc., price is relatively cheap, but trimeric cyanamide viscosity is less, frangible after solidification, make its cleaning performance not good, generally need repeatedly to clean 8-10 time; And in cleaning process, produce a large amount of smog, pollute Working environment.CN1172001 relate to a kind of trimeric cyanamide die cleaning material, and it is made up of trimeric cyanamide, formaldehyde, Mierocrystalline cellulose, silicon powder etc.; CN1351093 discloses a kind of amino resin compositions, and it mainly contains the compositions such as melamine formaldehyde resin, lignocellulose, mineral filler, lubricant, curing catalyst.But still it is good to change cleaning performance, in cleaning process, produce the shortcoming of a large amount of smog.
In current clear mold technique, clear mould film is adopted by encapsulation factory gradually, compares with traditional trimeric cyanamide die cleaning material, because the viscosity of rubber is higher than trimeric cyanamide, so the fruit of imitating clearly of clear mould film is better than trimeric cyanamide.It is general that cleaning 2-3 time just can be clean by mold clean repeatedly.Different manufacturer has different formulas, so its cleaning performance showed, odor profiles, smokiness difference all to some extent.CN1952032 discloses a kind of die cleaning material, and it mainly contains synthetic rubber, liquid amino alcohol, silica flour, organo-peroxide composition.But it does not add silane coupling agent, this makes the consistency between silica flour and rubber reduce, and this can affect viscosity and the mobility of rubber, causes cleaning performance to decline.Zhou Xinqi uses trolamine, 2-methylethylolamine increases cleaning performance, but because 2-methylethylolamine can cause the amine taste of product very heavy, and silicon-dioxide is without any adsorption property, this can in use, produce a large amount of irritating smell, affect Working environment.(see document: Zhou Xinqi, Cao Youming, Xie Fei, Tian Junling. for the research of integrated circuit packaging mould cleaning material, investigation of materials and application .4 (4), 351-353 (2010) .)
For this reason, the invention provides a kind of rubber combination for cleaning integrated circuit die, it is that cleaning performance is excellent.Said composition before high temperature vulcanized, has good viscosity and mobility, is beneficial to adhere to stain thing in mould; After high temperature vulcanized, there is good forming ability, be beneficial to discharge and stain thing in mould.It is also have no irritating odor in use procedure generation, non smoke generation.
Diatomaceous consistency that for achieving the above object, the present invention adopts silane coupling agent---γ-aminopropyl triethoxysilane increases rubber and mineral filler---, thus improve mobility and the viscosity of rubber combination, be conducive to improving cleaning performance; Adopt the solid-state hard ester amine that smell is very little, boiling point is very high to strengthen cleaning performance, reduce the generation of irritating smell.Between N, N-, penylene bismaleimides is shaping to rubber high-speed vulcanization at a higher temperature, is beneficial to discharge and stains thing.Meanwhile, adopt porous diatomite to have the character of absorption, the minute quantity smog produced in absorption cleaning, makes job site non smoke.
Summary of the invention
A kind of rubber combination for cleaning integrated circuit die, said composition is by polyisoprene rubber, diatomite, hard ester amine, γ-aminopropyl triethoxysilane, N, penylene bismaleimides composition between N-, the weight percent of each component is: polyisoprene rubber 40-60%, diatomite 30-50%, hard ester amine 5-10%, γ-aminopropyl triethoxysilane 2-5%, penylene bismaleimides 1-2% between N, N-.
For cleaning a preparation method for integrated circuit die rubber combination, comprise following steps:
A. at room temperature by polyisoprene rubber, diatomite, hard ester amine, γ-aminopropyl triethoxysilane, between N, N-, penylene bismaleimides mixes.
B. in mill, carry out mixing 1 hour by under this mixture room temperature, make rubber combination.
C. then this rubber combination is put into rolling press, calendering formation, put into tr, in less than 5 degrees Celsius preservations.
For cleaning an application effect appraisal for integrated circuit die rubber combination, test method is as follows:
By the unicircuit TO-220 mould of injection moulding machine after 50 times repeatedly injection moulding, die surface produces and pollutes.Then in mould, add a certain amount of rubber combination, apply temperature 190 degrees Celsius, 60kgf/cm
2pressure, continue 5 minutes.The irritating smell of the relation between its wash number and cleaning performance, the smog of generation, generation is according to following method evaluation:
A: seldom; B: few; C: general; D: serious; E: very serious
1.: remain without dirt completely; 2.: almost remain without dirt; 3.: slightly dirt remains; 4.: have
Dirt remains; 5.: a lot of dirt remains
The present invention has following beneficial outcomes: use the rubber combination that the method according to each embodiment and comparative example obtains, carry out application effect appraisal through test method, its result is as table 1.Can have good cleaning performance by sufficient proof rubber combination of the present invention by table 1, the generation that in use has no irritating odor, non smoke produce.
Table 1
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
Embodiment 1,
In rubber combination gross weight 100%, get polyisoprene rubber weight percentage 55%, diatomite weight percentage 35%, hard ester amine weight percentage 5%, γ-aminopropyl triethoxysilane weight percentage 3%, between N, N-, penylene bismaleimides weight percentage 2% mixes.Mixture is put into mill mixing 1 hour, make rubber combination.Then rubber combination put into rolling press calendering, hack and make product, put into tr, in less than 5 degrees Celsius preservations.
Embodiment 2,
In rubber combination gross weight 100%, get polyisoprene rubber weight percentage 45%, diatomite weight percentage 45%, hard ester amine weight percentage 7%, γ-aminopropyl triethoxysilane weight percentage 2%, between N, N-, penylene bismaleimides weight percentage 1% mixes.Mixture is put into mill mixing 1 hour, make rubber combination.Then rubber combination put into rolling press calendering, hack and make product, put into tr, in less than 5 degrees Celsius preservations.
Comparative example 1,
Only the diatomite in embodiment 1 is changed into the silicon powder of weight percentage 35%, all the other all operate according to the same procedure in embodiment 1, obtain cleaning die rubber combination.
Comparative example 2,
Only remove the γ-aminopropyl triethoxysilane in embodiment 1, hard ester amine weight percentage is increased to 8% by original 5%, all the other are all operated according to the same procedure in embodiment 1, obtain cleaning die rubber combination.
Comparative example 3,
Only the hard ester amine in embodiment 2 is changed into the 2-methylethylolamine of weight percentage 7%, all the other all operate according to the same procedure in embodiment 1, obtain cleaning die rubber combination.
Claims (2)
1. for cleaning a rubber combination for integrated circuit die, it is characterized in that, said composition is by polyisoprene rubber, diatomite, hard ester amine, γ-aminopropyl triethoxysilane, penylene bismaleimides composition between N, N-.
2. the rubber combination according to claims 1, it is characterized in that, the each weight percentages of components of described rubber combination is: polyisoprene rubber 40-60%, diatomite 30-50%, hard ester amine 5-10%, γ-aminopropyl triethoxysilane 2-5%, penylene bismaleimides 1-2% between N, N-.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210252751.3A CN102775656B (en) | 2012-07-15 | 2012-07-15 | Rubber composition used for cleaning integrated circuit (IC) die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210252751.3A CN102775656B (en) | 2012-07-15 | 2012-07-15 | Rubber composition used for cleaning integrated circuit (IC) die |
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| CN102775656A CN102775656A (en) | 2012-11-14 |
| CN102775656B true CN102775656B (en) | 2015-06-03 |
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| CN201210252751.3A Expired - Fee Related CN102775656B (en) | 2012-07-15 | 2012-07-15 | Rubber composition used for cleaning integrated circuit (IC) die |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103232700B (en) * | 2013-04-27 | 2017-12-15 | 上海锦湖日丽塑料有限公司 | Low smell PC/ABS enhancings alloy material and preparation method thereof |
| CN104262797B (en) * | 2014-09-19 | 2016-08-17 | 无锡晶睿光电新材料有限公司 | A kind of unvulcanized rubber composition |
| CN105296179A (en) * | 2015-11-19 | 2016-02-03 | 吴庆春 | Soap-based environment-friendly laundry detergent |
| CN108047694A (en) * | 2017-12-27 | 2018-05-18 | 东莞市浦元电子有限公司 | Semiconductor packaging mold cleaning material and preparation method thereof |
| CN108395632B (en) * | 2018-03-29 | 2020-06-09 | 电子科技大学中山学院 | Mold cleaning material and preparation method thereof |
Citations (3)
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|---|---|---|---|---|
| EP0687539A1 (en) * | 1994-06-15 | 1995-12-20 | Bridgestone Corporation | Rubber composition for cleaning mold, and method for cleaning mold |
| CN1931981A (en) * | 2006-09-28 | 2007-03-21 | 无锡乐东微电子有限公司 | Demolding material for integrated circuit packaging |
| CN101821075A (en) * | 2007-10-29 | 2010-09-01 | 日本碳化物工业株式会社 | Mold cleaning rubber compositon |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2548964B2 (en) * | 1988-02-03 | 1996-10-30 | 旭光学工業株式会社 | Cleaning method for urethane resin mold |
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2012
- 2012-07-15 CN CN201210252751.3A patent/CN102775656B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687539A1 (en) * | 1994-06-15 | 1995-12-20 | Bridgestone Corporation | Rubber composition for cleaning mold, and method for cleaning mold |
| CN1931981A (en) * | 2006-09-28 | 2007-03-21 | 无锡乐东微电子有限公司 | Demolding material for integrated circuit packaging |
| CN101821075A (en) * | 2007-10-29 | 2010-09-01 | 日本碳化物工业株式会社 | Mold cleaning rubber compositon |
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| 周心其等.用于集成电路封装模具清洗材料的研究.《材料研究与应用》.2010,第4卷(第4期),第231-234页. * |
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